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    • 1. 发明申请
    • TOUCH SCREEN INSTRUMENT PANEL
    • 触摸屏仪表板
    • WO2015138327A1
    • 2015-09-17
    • PCT/US2015/019459
    • 2015-03-09
    • CESSNA AIRCRAFT COMPANY
    • KNEUPER, Jeremy, JosephPINKERTON, Christopher, Adair
    • B64D45/00G06F3/041
    • G06F3/0416B64D43/00G01C23/00G08G5/0021G08G5/0034G08G5/0052G08G5/0065G08G5/0078G08G5/0091G08G5/025
    • Systems, methods and computer-storage media are provided for a touch-screen interface panel (TSIP) of an aircraft. The TSIP may communicate with one or more aircraft systems. In other words, the TSIP is configured to display information of one or more aircraft systems. For example, the TSIP may receive a request for weather information. In response, the TSIP receives weather information from a weather system and displays it via the TSIP screen. In another example, the TSIP may display warnings or alerts that are detected by an aircraft warning system, maintenance system, or the like. Furthermore, information that may have typically been looked up physically or called in to a tower may now be provided via the TSIP by the interfacing of the TSIP with the systems maintaining the information. For example, a charts database may communicate with the TSIP and the information thereof displayed via the TSIP.
    • 为飞机的触摸屏界面面板(TSIP)提供了系统,方法和计算机存储介质。 TSIP可以与一个或多个飞行器系统通信。 换句话说,TSIP被配置为显示一个或多个飞行器系统的信息。 例如,TSIP可以接收对天气信息的请求。 作为回应,TSIP从天气系统接收天气信息,并通过TSIP屏幕显示。 在另一示例中,TSIP可以显示由飞行器警告系统,维护系统等检测到的警告或警报。 此外,现在可以通过TSIP通过TSIP与维护信息的系统的接口来提供物理上或被调用到塔中的信息。 例如,图表数据库可以与TSIP通信,以及通过TSIP显示的信息。
    • 6. 发明申请
    • STUMP CUTTER DISC WITH RECESSED TOOTH POCKETS
    • 带切割牙签的切割切割盘
    • WO2014110253A1
    • 2014-07-17
    • PCT/US2014/010869
    • 2014-01-09
    • VERMEER MANUFACTURING COMPANY
    • WEINBERG, ClintHARTKE, Louis, C.
    • A01G23/06A01G23/00A01B33/02
    • A01G23/067
    • One stump cutter cutting wheel disclosed herein includes a wheel structure having left and right sides and being rotatable about a central axis extending between the left and right sides. The left and right sides define receptacles having depths measured in an orientation extending along the axis. Cutter assemblies are mounted to the wheel structure and include cutters mounted to cutter holders. The cutter holders include base portions that fit within the receptacles, and the base portions each define at least one fastener opening. The base portions further define base thicknesses measured in the orientation extending along the axis. The receptacle depths are at least 0.25 times as large as the base thicknesses such that no more than 75 percent of the base thicknesses extend laterally outside the receptacles. Fasteners secure the cutter holders to the wheel structure and extend through the fastener openings defined by the base portions.
    • 本文公开的一个残端切割轮包括具有左侧和右侧的轮结构,并且可围绕在左右两侧之间延伸的中心轴线旋转。 左侧和右侧限定具有沿着轴线延伸的方向测量的深度的插座。 刀具组件安装到车轮结构,并包括安装到刀架上的刀具。 切割器保持器包括配合在容器内的基部,并且基部各自限定至少一个紧固件开口。 基部还限定了沿沿着轴延伸的取向测量的基底厚度。 容器深度至少为基底厚度的0.25倍,使得不超过75%的基底厚度横向延伸到插座外侧。 紧固件将刀架固定到车轮结构并延伸穿过由基部限定的紧固件开口。
    • 8. 发明申请
    • THE ENCAPSULATION AND PACKAGING OF ULTRAVIOLET AND DEEP-ULTRAVIOLET LIGHT EMITTING DIODES
    • 超紫外线和深紫外线发光二极管的包封和包装
    • WO2006071327A1
    • 2006-07-06
    • PCT/US2005/036365
    • 2005-10-10
    • III-N TECHNOLOGY, INC.
    • FAN, ZhaoyangJIANG, HongxingLIN, Jingyu
    • H01L21/44
    • G06F1/1607
    • Disclosed are the materials and methods used to package and encapsulate UV and DUV LEDs. These LEDs have emission wavelengths in the range from around 360 nm to around 200 nm. The UV/DUV LED die or its flip-chip bonded subassembly are disposed in a low thermal resistance packaging house. Either the whole package or just the UV/DUV LED is globed with a UV/DUV transparent dome-shape encapsulation. This protects the device, enhances light extraction, and focuses the light emitted. The dome-shape encapsulation may be comprised of optically transparent PMMA, fluorinated polymers or other organic materials. Alternatively it might be configured having a lens made from sapphire, fused silica or other transparent materials. The lens material is cemented on the UV/DUV LED with UV/DUV transparent polymers.
    • 公开了用于封装和封装UV和DUV LED的材料和方法。 这些LED具有在约360nm至约200nm范围内的发射波长。 UV / DUV LED芯片或其倒装芯片接合子组件设置在低热阻包装室内。 整个封装或只是UV / DUV LED都采用UV / DUV透明的圆顶形封装。 这样可以保护设备,增强光线提取,并对发出的光线进行聚焦。 圆顶形封装可以由光学透明的PMMA,氟化聚合物或其它有机材料组成。 或者,其可以被配置为具有由蓝宝石,熔融二氧化硅或其它透明材料制成的透镜。 透镜材料用UV / DUV透明聚合物胶合在UV / DUV LED上。