会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明申请
    • Method for Measuring Thickness or Surface Profile
    • 测量厚度或表面轮廓的方法
    • US20110188048A1
    • 2011-08-04
    • US12993301
    • 2009-01-16
    • Heui Jae PahkWoo Jung AhnSeong Ryong KimJun Hyeok Lee
    • Heui Jae PahkWoo Jung AhnSeong Ryong KimJun Hyeok Lee
    • G01B11/06
    • G01B11/0675
    • Disclosed is a method of measuring thickness or a surface profile of a thin film layer formed on a base layer through a white light scanning interferometry, the method including: preparing simulation interference signals corresponding to thicknesses by assuming a plurality of sample thin film layers different in thickness from one another and simulating interference signals with respect to the respective sample thin film layers; acquiring a real interference signal with respect to an optical-axis direction of entering the thin film layer by illuminating the thin film layer with white light; preparing a plurality of estimated thicknesses that the thin film layer may have on the basis of the real interference signal; comparing whether the simulation interference signal having thickness corresponding to the estimated thickness is substantially matched with the real interference signal; and determining the thickness of the simulation interference signal substantially matched with the real interference signal as the thickness of the thin film layer.
    • 公开了一种通过白光扫描干涉测量法测量在基底层上形成的薄膜层的厚度或表面轮廓的方法,该方法包括:通过假设多个不同的样品薄膜层来制备与厚度对应的模拟干涉信号 相对于各个样品薄膜层模拟干涉信号; 通过用白光照射薄膜层来获取相对于进入薄膜层的光轴方向的实际干涉信号; 基于实际干扰信号准备薄膜层可能具有的多个估计厚度; 比较具有与估计厚度相对应的厚度的模拟干扰信号是否与实际干扰信号基本匹配; 并且确定与实干扰信号基本匹配的模拟干扰信号的厚度作为薄膜层的厚度。