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1. 发明授权

US5990261A Organic optical component 失效
标题翻译：有机光学元件
公开(公告)号：US5990261A
公开(公告)日：1999-11-23
申请号：US917387
申请日：1997-08-26
申请人： Wataru Yamashita , Tomomi Yoshimura , Atsushi Shibuya , Yoshihiro Sakata , Hideaki Oikawa , Keisuke Takuma , Masahiro Ohta
发明人： Wataru Yamashita , Tomomi Yoshimura , Atsushi Shibuya , Yoshihiro Sakata , Hideaki Oikawa , Keisuke Takuma , Masahiro Ohta
IPC分类号： C08G69/42 , C08G69/12 , C08G69/32 , C08G69/40 , C08G73/10 , C08G63/00 , C08G69/26
CPC分类号： C08G69/40 , C08G69/32 , C08G73/1039
摘要： A low birefringent organic optical component prepared from a resin consisting essentially of one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## The organic optical component can exhibit excellent transparency, heat resistance and mechanical strength as well as a low birefringence. Also provided is a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.
摘要翻译：由基本上由选自由通式（1）表示的结构的一个或多个重复结构单元组成的树脂制成的低双折射有机光学部件; 其中A是下面的组之一。有机光学部件可以表现出优异的透明性，耐热性和机械强度以及低双折射性。还提供了具有低介电常数和优异的透明性，加工性和热稳定性的新型芳族聚酰胺，以及芳族聚酰胺固有的优异的耐热性。

2. 发明授权

US5380805A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
标题翻译：聚酰亚胺，其制备方法和聚酰亚胺树脂组合物
公开(公告)号：US5380805A
公开(公告)日：1995-01-10
申请号：US143105
申请日：1993-10-29
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi , Kouji Ohkoshi , Masao Yoshikawa
IPC分类号： C08G73/10 , C08L79/08
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
摘要翻译：一方面，本发明涉及具有优异耐热性的聚酰亚胺及其制备方法，包括在不同的二胺化合物和任选地存在下进行4,4'-双（3-氨基苯氧基）联苯与均苯四酸二酐的缩合与不同的四羧酸二酐。在第二方面，本发明涉及一种主要由芳族聚醚酰亚胺和所定义的聚酰亚胺组成的耐热树脂组合物。在第三方面，本发明涉及包含在限定的聚酰亚胺和单独的高温工程聚合物上的聚酰亚胺树脂组合物。在第四方面，本发明涉及由限定的聚酰亚胺和芳族聚酰胺酰亚胺组成的树脂组合物。

3. 发明授权

US5354839A Polyimide and preparation process of same 失效
标题翻译：聚酰亚胺及其制备方法相同
公开(公告)号：US5354839A
公开(公告)日：1994-10-11
申请号：US40608
申请日：1993-03-31
申请人： Wataru Yamashita , Yoshihiro Sakata , Toshiyuki Kataoka , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Mitsunori Matsuo , Tsutomu Ishida , Keizaburo Yamaguchi , Akihiro Yamaguchi
发明人： Wataru Yamashita , Yoshihiro Sakata , Toshiyuki Kataoka , Yuichi Okawa , Hideaki Oikawa , Tadashi Asanuma , Mitsunori Matsuo , Tsutomu Ishida , Keizaburo Yamaguchi , Akihiro Yamaguchi
IPC分类号： C07C217/90 , C08G73/10 , H05K1/00 , H05K1/03 , C08G69/26
CPC分类号： C08G73/105 , C07C217/90 , C08G73/10 , C08G73/1014 , C08G73/1017 , H05K1/0346 , H05K3/4676
摘要： A polyimide comprising a requisite structural unit having one or more recurring structural units of the formula: ##STR1## such as the structural units of the formula ##STR2## The polyimide can have an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance, and also provides an aromatic diamine which is useful as a raw material monomer of the polyimide or a raw material of other various engineering plastics.
摘要翻译：一种聚酰亚胺，其包含具有一个或多个下式的重复结构单元的必需结构单元：例如下式的结构单元：该聚酰亚胺可以具有极低的介电常数，为无色透明且加工性优异和耐热性，并且还提供可用作聚酰亚胺的原料单体或其它各种工程塑料的原料的芳族二胺。

4. 发明授权

US5286840A Thermally stable polyimide and preparation process of polyimide 失效
标题翻译：聚酰亚胺热稳定剂及其制备方法
公开(公告)号：US5286840A
公开(公告)日：1994-02-15
申请号：US795750
申请日：1991-11-21
申请人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
发明人： Hideaki Oikawa , Nobuhito Koga , Akihiro Yamaguchi , Shoji Tamai
IPC分类号： C08G73/10 , C08G69/26
CPC分类号： C08G73/1071 , C08G73/1014
摘要： A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.
摘要翻译：在聚合物末端用由式（III）表示的二羧酸酐封闭的热稳定聚酰亚胺：（*化学结构*）（III）其中Z是选自以下的二价基团：单芳族基团，其为基本上未被取代或被不与胺或二羧酸酐反应的基团或具有6至15个碳原子的基团取代，稠合的多芳族基团或非缩合的芳族基团彼此直接连接或桥接，并具有基本的由式（IV）的重复结构单元表示的骨架：（*化学结构*）（IV）和制备聚酰亚胺的方法。

5. 发明授权

US5043419A Process for preparing a polyimide and a composite material containing the same 失效
公开(公告)号：US5043419A
公开(公告)日：1991-08-27
申请号：US261520
申请日：1988-10-24
申请人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
发明人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
IPC分类号： C08G73/10 , C08K7/04 , C08L79/08
CPC分类号： C08K7/04 , C08G73/1014 , C08G73/105 , C08G73/1064 , C08L79/08
摘要： This invention relates to a method for preparing a polyimide having good heat-stability and excellent flowability in a molten state.The polymide is prepared by reacting aromatic diamines such as 4,4'-bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl] ketone and bis [4-(3-aminophenoxy)phenyl] sulfone; tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine: tetracarboxylic dianhydride: dicarboxylic anhydride is 1:(0.9 to 1.0):(0.001 to 1.0).The invention also relates to polyimide composite materials which are excellent in mechanical strengths and processability. The materials contain the polyimide and fibrous reinforcing materials such as yarn, roving, tow, fabrics, mats and felts of glass fiber, carbon fibers or aromatic polyamide fibers.

6. 发明授权

US5459233A Polyimides, process for the preparation thereof and polyimide resin compositions 失效
公开(公告)号：US5459233A
公开(公告)日：1995-10-17
申请号：US143148
申请日：1993-12-07
申请人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
发明人： Shoji Tamai , Masahiro Ohta , Saburo Kawashima , Katsuaki Iiyama , Hideaki Oikawa , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L79/08 , C08G69/26
CPC分类号： C08G73/1042 , C08G73/105 , C08G73/1071 , C08L79/08
摘要： In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.

7. 发明授权

US5321096A Polyimide composition 失效
标题翻译：聚酰亚胺组合物
公开(公告)号：US5321096A
公开(公告)日：1994-06-14
申请号：US35043
申请日：1993-03-22
申请人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
发明人： Yuichi Okawa , Nobuhito Koga , Hideaki Oikawa , Tadashi Asanuma , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C08L71/00 , C08L79/08 , C08L81/06 , C08F283/04 , C08G69/48
CPC分类号： C08L71/00 , C08G73/101 , C08L79/08 , C08L81/06
摘要： A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member.The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.
摘要翻译：热塑性树脂组合物包含99.9重量份的一种或多种选自芳族聚酰亚胺，芳族聚醚酰亚胺，芳族聚酰胺酰亚胺，芳族聚醚砜和芳族聚醚酮的热塑性树脂和0.1重量份的一种或多种液体具有由式（1）表示的重复结构单元的结晶型芳族聚酰亚胺：（1）n原子，氟原子，三氟甲基，甲基，乙基或氰基，可以相同或不同，R是具有 6个碳原子，并且选自由直链或桥构件相互连接的单芳族基团，缩合多芳族基团和非缩合芳族基团组成的组。本发明可以提供具有非常好的加工性和优异的热稳定性的热塑性树脂组合物，除了每种树脂的基本上优异的性能。

8. 发明授权

US5278276A Polyimide and high-temperature adhesive of polyimide 失效
标题翻译：聚酰亚胺和聚酰亚胺的高温粘合剂
公开(公告)号：US5278276A
公开(公告)日：1994-01-11
申请号：US9091
申请日：1993-01-26
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.
摘要翻译：公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体; （*化学结构*）（I）（*化学结构*）（II）（其中Y是选自由键，碳数1〜10的二价烃，六氟化异亚丙基，羰基，硫代，亚磺酰基，磺酰基和氧化物，R是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非稠合多芳族基团中的四价基团，其中芳族基团相互连接具有键或交联功能）。聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为（*化学结构*）（III）（*化学结构*）（IV）Y为键，R为III或IV，Y为异丙叉基而R是IV。聚合物可以由相应的二胺和四羧酸二酐制备。本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

9. 发明授权

US5087689A Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines 失效
标题翻译：基于金属氧化物的聚酰亚胺和高温胶粘剂
公开(公告)号：US5087689A
公开(公告)日：1992-02-11
申请号：US611471
申请日：1990-11-09
申请人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
发明人： Masahiro Ohta , Saburo Kawashima , Yoshiho Sonobe , Shoji Tamai , Hideaki Oikawa , Kouji Ohkoshi , Akihiro Yamaguchi
IPC分类号： C08G73/10 , C09J179/08
CPC分类号： C08G73/1039 , C08G73/105 , C08G73/1064 , C08G73/1071 , C09J179/08
摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

10. 发明授权

US5013817A Process for preparing a polyimide and a composite material containing the same 失效
标题翻译：制备聚酰亚胺和含有它的复合材料的方法
公开(公告)号：US5013817A
公开(公告)日：1991-05-07
申请号：US266678
申请日：1988-11-03
申请人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
发明人： Masahiro Ohta , Saburo Kawashima , Shoji Tamai , Hideaki Oikawa , Akihiro Yamaguchi , Tomohito Koba , Toshiyuki Nakakura , Hideo Sakai , Misao Masuda , Satoru Kishi , Chiaki Maruko
IPC分类号： C08G73/10
CPC分类号： C08G73/105 , C08G73/1017
摘要： The invention relates to processes for preparing a polyimide, a polyimide composition prepared by the processes and polyimide composite materials containing the same.

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