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1. 发明申请

WO2013018847A1 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体封装的环氧树脂组合物，使用其的半导体器件及其制造半导体器件的方法
公开(公告)号：WO2013018847A1
公开(公告)日：2013-02-07
申请号：PCT/JP2012/069641
申请日：2012-07-26
申请人： NAMICS CORPORATION , CZUBAROW, Pawel , SUZUKI, Osamu , SATO, Toshiyuki , YAMADA, Kazuyoshi , MATSUMURA, Kaori , Obata, Naoki
发明人： CZUBAROW, Pawel , SUZUKI, Osamu , SATO, Toshiyuki , YAMADA, Kazuyoshi , MATSUMURA, Kaori , Obata, Naoki
IPC分类号： C08G59/40 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G59/621 , C08K5/3415 , C08K5/3445 , C08L63/00 , H01L24/29 , H01L2224/16 , H01L2224/16225 , H01L2224/2929 , H01L2224/32 , H01L2224/32225 , H01L2224/73 , H01L2224/73204 , H01L2224/83 , H01L2224/83192 , H01L2224/92 , H01L2224/92125 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： An epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one imidazole compound, and (C) at least one maleimide compound, a semiconductor device encapsulated by the epoxy resin composition, and an assembly in which a cured material of the epoxy resin is positioned between a substrate and a semiconductor chip. The epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.
摘要翻译：一种用于半导体封装的环氧树脂组合物，包括：（A）至少一种环氧树脂，（B）至少一种咪唑化合物，和（C）至少一种马来酰亚胺化合物，由环氧树脂组合物包封的半导体器件，其中环氧树脂的固化材料位于基板和半导体芯片之间。环氧树脂组合物提供了对半导体芯片表面具有优异的粘合性并且具有优异的耐湿性的固化材料。

2. 发明申请

WO2017022191A1 HIGH PERFORMANCE, THERMALLY CONDUCTIVE SURFACE MOUNT (DIE ATTACH) ADHESIVES 审中-公开
标题翻译：高性能，导热表面安装（DIE附件）粘合剂
公开(公告)号：WO2017022191A1
公开(公告)日：2017-02-09
申请号：PCT/JP2016/003363
申请日：2016-07-15
申请人： NAMICS CORPORATION
发明人： TRUMBLE, Cathy Shaw , PATELKA, Maciej , SAKAI, Noriyuki , KRASCO, Nicholas C.
IPC分类号： C08L83/04 , C08K3/08 , C09J11/04 , C09J11/06 , C09J183/04
CPC分类号： C08L83/04 , C08G77/045 , C08K3/08 , C08K2003/0806 , C08K2003/085 , C08K2201/003 , C08K2201/014 , C08L83/00 , C09J183/04
摘要： A composition including (a) 20 to 85 wt% of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt% of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt% of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt% of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt% of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.
摘要翻译：一种组合物，其包含（a）20〜85重量％的含有粒径为5〜500纳米的银纳米粒子的导热性银成分; （b）聚有机倍半硅氧烷组分，所述聚有机倍半硅氧烷组分选自（i）0.5至12重量％的聚有机倍半硅氧烷细粉，（ii）0.5至8重量％的含有交联聚合物网络的共聚物粉末（I）聚有机倍半硅氧烷和（II）聚二有机硅氧烷; 和（iii）0.5〜12重量％的聚有机倍半硅氧烷细粉与共聚物粉末的组合; 和（c）以（i）一种或多种溶剂形式的总溶剂含量的3至12重量％，（ii）含有一种或多种溶剂的载体，或（iii）其组合。

3. 发明申请

WO2011032120A3 UNDERFILL FOR HIGH DENSITY INTERCONNECT FLIP CHIPS 审中-公开
标题翻译：高密度互连倒装芯片的底部填充
公开(公告)号：WO2011032120A3
公开(公告)日：2011-03-17
申请号：PCT/US2010/048706
申请日：2010-09-14
申请人： NAMICS CORPORATION , CZUBAROW, Pawel , SUZUKI, Osamu , SATO, Toshiyuki
发明人： CZUBAROW, Pawel , SUZUKI, Osamu , SATO, Toshiyuki
IPC分类号： C08G59/30 , C08G59/32 , C08L63/00 , H01L23/29 , C08J5/00 , C08K9/04 , H01L21/26 , H01L21/56
摘要： Underfill materials include inorganic fill materials (e.g., functionalized CNT' s, organo clay, ZnO) that are functionalized reactive with other organic constituents (e.g., organics with epoxy groups, amine groups, or PMDA). The underfill materials also beneficially include polyhedral oligomeric silsesquioxane and/or dendritic siloxane groups that are functionalized with a reactive group (e.g., glycidyl) that reacts with other components of an epoxy system of the underfill.
摘要翻译：底部填充材料包括与其它有机成分（例如，具有环氧基团，胺基团或PMDA的有机物）官能化的无机填充材料（例如官能化CNT's，有机粘土，ZnO）。底部填充材料还有利地包括用与底部填充物的环氧体系的其它组分反应的反应性基团（例如缩水甘油基）官能化的多面体低聚倍半硅氧烷和/或树枝状硅氧烷基团。

4. 发明申请

WO2015108205A1 CONDUCTIVE PASTE AND METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME 审中-公开
标题翻译：用于制造使用该半导体器件的半导体器件的导电胶和方法
公开(公告)号：WO2015108205A1
公开(公告)日：2015-07-23
申请号：PCT/JP2015/051743
申请日：2015-01-15
申请人： NAMICS CORPORATION
发明人： DIETZ, Raymond , PATELKA, Maciej , TRUMBLE, Cathy Shaw , SAKAI, Noriyuki , YAMAGUCHI, Hiroshi
IPC分类号： H01B1/22
CPC分类号： C03C8/24 , C03C3/122 , C03C3/125 , C03C3/127 , C03C4/14 , C03C8/02 , C03C8/18 , C03C2204/00 , C03C2205/00 , C09J9/02 , H01B1/16 , H01B1/22 , H01L24/83 , H01L2224/83851 , H01L2224/83948 , H01L2924/10272
摘要： Provided are a conductive paste which does not contain an injurious material, such as lead, arsenic, tellurium, or antimony, and which can not only achieve bonding at a relatively low temperature (for example, at 370 °C or lower) but also maintain the bond strength even at a relatively high temperature (for example, at 300 to 360 °C), and a method for producing a semiconductor device using the conductive paste. A conductive paste comprising (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent, wherein the glass frit (B) has a remelting temperature of 320 to 360 °C, wherein the remelting temperature is indicated by the peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste preferably further comprises (D) an oxide selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. Glass frit (B) preferably comprises (B-1) Ag 2 O, (B-2) V 2 O 5 , and (B-3) MoO 3 .
摘要翻译：提供了不含铅，砷，碲或锑等有害物质的导电性糊剂，不仅能够在较低的温度（例如370℃以下）下进行接合，而且还能够维持即使在相对高的温度（例如，在300至360℃）下的粘合强度，以及使用导电浆料的半导体器件的制造方法。一种导电浆料，其包含（A）导电颗粒，（B）基本上不含铅，砷，碲和锑的玻璃料，和（C）溶剂，其中所述玻璃料（B）的重熔温度为320至360℃ ℃，其中通过差示扫描量热计测量的DSC曲线中，至少一个吸热峰的吸收峰的峰顶由20℃/ g以上的吸热峰表示。导电性糊料优选还包含（D）选自氧化锡，氧化锌，氧化铟和氧化铜的氧化物。玻璃料（B）优选包含（B-1）Ag2O，（B-2）V2O5和（B-3）MoO3。

5. 发明授权

US11634615B2 Resin composition 有权
公开(公告)号：US11634615B2
公开(公告)日：2023-04-25
申请号：US16614351
申请日：2018-05-18
申请人： NAMICS CORPORATION
发明人： Fuminori Arai , Kazuki Iwaya
IPC分类号： C09J129/12 , C08K3/013 , C08J5/18 , C08K5/00 , C08K5/17 , H01L23/10 , C08J5/24
摘要： A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

6. 发明授权

US11623813B2 Resin composition-filled syringe, and production method and preservation method for same 有权
公开(公告)号：US11623813B2
公开(公告)日：2023-04-11
申请号：US17435198
申请日：2020-02-06
申请人： NAMICS CORPORATION
发明人： Hiroki Myodo , Masaaki Hoshiyama
IPC分类号： B65D83/00
摘要： There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

7. 发明申请

US20230013549A1 VARISTOR FORMING PASTE, CURED PRODUCT THEREOF, AND VARISTOR 有权
公开(公告)号：US20230013549A1
公开(公告)日：2023-01-19
申请号：US17782211
申请日：2020-09-25
申请人： NAMICS CORPORATION
发明人： Pawel Czubarow , Daisuke Hashimoto , Yoshitaka Kamata , Toshiyuki Sato
IPC分类号： H01C7/10 , H01C7/102 , H01C17/065
摘要： Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

8. 发明申请

US20220144531A1 RESIN COMPOSITION-FILLED SYRINGE, AND PRODUCTION METHOD AND PRESERVATION METHOD FOR SAME 有权
公开(公告)号：US20220144531A1
公开(公告)日：2022-05-12
申请号：US17435198
申请日：2020-02-06
申请人： NAMICS CORPORATION
发明人： Hiroki MYODO , Masaaki HOSHIYAMA
IPC分类号： B65D83/00
摘要： There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

9. 发明授权

US10550131B2 Mercaptoethylglycol uril compound and utilization thereof 有权
公开(公告)号：US10550131B2
公开(公告)日：2020-02-04
申请号：US15556450
申请日：2016-03-10
申请人： SHIKOKU CHEMICALS CORPORATION
发明人： Akikazu Matsuda , Naoto Okumura , Takeshi Kumano
IPC分类号： C09J163/00 , C08L63/00 , C07D487/04 , C07D519/00 , C08G59/66 , C08G59/50 , C08K5/17
摘要： The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.

10. 发明申请

US20180358484A1 ELECTRO-CONDUCTIVE PASTE, SOLAR CELL AND METHOD FOR PRODUCING SOLAR CELL 审中-公开
公开(公告)号：US20180358484A1
公开(公告)日：2018-12-13
申请号：US15579815
申请日：2016-06-03
申请人： NAMICS CORPORATION
发明人： Seiya KONNO
IPC分类号： H01L31/0224 , C03C8/18 , H01B1/22 , H01L21/288 , H01L31/0272
摘要： An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO2 is 3% by weight to 30% by weight.

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