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    • 65. 发明专利
    • Cutting fluid for slicing silicon ingot
    • 切削硅胶切削液
    • JP2012214767A
    • 2012-11-08
    • JP2012076240
    • 2012-03-29
    • Sanyo Chem Ind Ltd三洋化成工業株式会社
    • FUKUSHIMA TAKESHIKATSUKAWA YOSHITAKAYAMASHITA SEIJI
    • C10M169/04C10M105/18C10M107/34C10M129/26C10N30/00C10N30/04C10N40/22
    • PROBLEM TO BE SOLVED: To provide a cutting fluid and an abrasive slurry allowing an improvement in cutting work efficiency because dispersibility of abrasive grains and fluidity of the abrasive slurry are better than those of the conventional products, and having excellent productivity of silicon wafers because washing efficiency of the silicon wafers can be improved as a result of excellent washability of the abrasive slurry in a cutting process of silicon ingots.SOLUTION: The cutting fluid for slicing the silicon ingots includes a polyoxyalkylene compound (A) having a number-average molecular weight of 130-500 and an organic acid salt (B) as essential components, and electroconductivity thereof is 1.0-7.0 μS/cm. Furthermore, the abrasive slurry includes the same.
    • 要解决的问题:提供切削液和磨料浆料,从而提高切削加工效率,因为磨粒的分散性和磨料浆的流动性优于常规产品,并具有优异的硅生产率 由于在硅锭的切割过程中磨料浆料的优异的洗涤性能可以提高硅晶片的洗涤效率,所以可以提高晶片。 解决方案:用于切割硅锭的切削液包括数均分子量为130-500的聚氧化烯化合物(A)和作为必需组分的有机酸盐(B),其导电率为1.0-7.0 μS/ cm以下。 此外,磨料浆料包括其。 版权所有(C)2013,JPO&INPIT
    • 67. 发明专利
    • Aqueous cutting agent and method for cutting solid material using the same
    • 水性切割剂及其切割固体材料的方法
    • JP2012201750A
    • 2012-10-22
    • JP2011066264
    • 2011-03-24
    • Nicca Chemical Co Ltd日華化学株式会社
    • IGARASHI HIROKOSUEYOSHI MASATOMOSASAKI MITSURU
    • C10M173/02C10M105/18C10M107/34C10M129/04C10M129/16C10M145/26C10N30/00C10N40/22
    • PROBLEM TO BE SOLVED: To provide an aqueous cutting agent capable of sufficiently suppressing generation of chipping and cracks in cutting and excellent in washing properties after processing, and a method for cutting a solid material using the same.SOLUTION: The aqueous cutting agent includes: a nonionic surfactant expressed by a general equation (1): RO(RO)H [in the general equation (1), Ris a 6C-22C alkyl group, alkenyl group or aryl group, or a 7C-22C alkylaryl group or arylalkyl group; Ris a 2C-4C alkylene group; x is an integer of 1-30; and when x is ≥2, a plurality of Rmay be the same or different each other]; and a dihydroxy compound expressed by a general equation (2) [in the general equation (2), Rand Rmay be the same or different each other, and are each 1C-8C linear or branched chain-containing alkyl group or 2C-8C linear or branched chain-containing alkenyl group; Rand Rmay be the same or different each other, and are each a 2C-4C alkylene group; y and z are each independently an integer of 0-14; and when y is ≥2, a plurality of Rmay be the same or different each other; and when z is ≥2, a plurality of Rmay be the same or different each other].
    • 要解决的问题:提供一种能够充分抑制切屑产生和切削裂纹以及加工后洗涤性能优异的水性切割剂,以及使用其的切割固体材料的方法。 水溶性切割剂包括:由通式(1)表示的非离子表面活性剂:R 1(R 2 < / SP> O) x <在通式(1)中,R 1 是6C-22C烷基, 烯基或芳基,或7C-22C烷基芳基或芳烷基; R 2 是2C-4C亚烷基; x是1-30的整数; 并且当x≥2时,多个R 2 可以相同或不同。 和由通式(2)表示的二羟基化合物[在通式(2)中,R 3 和R 4 各自可以相同也可以不同,分别为含有1〜8个直链或支链的烷基或含有2C-8C直链或支链的烯基; R 5 和R 6 可以相同或不同,并且各自为2C-4C亚烷基; y和z各自独立地为0-14的整数; 并且当y为≥2时,多个R 5 可以相同或不同; 并且当z≥2时,多个R 6 可以相同或不同。 版权所有(C)2013,JPO&INPIT