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    • 96. 发明申请
    • RESONANCE BODY AND POWER DIVIDING AND COMBINING DEVICE
    • US20210399399A1
    • 2021-12-23
    • US17304311
    • 2021-06-17
    • AMPAK TECHNOLOGY INC.
    • FURE-TZAHN TSAIRUEY BING HWANGTSO HUA LINCHIH WEI WANGTZONG-YOW HO
    • H01P5/16H05K7/14H05K5/03
    • A power dividing and combining device comprising a resonance body, a plurality of circuit boards, an upper cover and a lower cover is provided. The resonance body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first dividing elements are disposed on the first surface and separate a plurality of first resonance channels on the first surface. The first resonance channels intersect at a first common region on the first surface. The second dividing elements are disposed on the second surface and separate a plurality of second resonance channels on the second surface. The second resonance channels intersect at a second common region on the second surface. The signal-receiving end is disposed on the first surface and in the first common region. The signal-transmitting end is disposed on the second surface and in the second common region. The circuit boards are disposed respectively on the side surfaces. Two opposite ends of each of the circuit boards respectively close one of the first resonance channels and one of the second resonance channels. Each of the circuit boards comprises a power-amplifying element. The upper cover is disposed on the first dividing elements. The first resonance channels are located in a first accommodating space formed by the upper cover, the circuit boards and the first surface of the solid conductive body. The lower cover is disposed on the second dividing elements. The second resonance channels are located in a second accommodating space formed by the lower cover, the circuit boards and the second surface of the solid conductive body.