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    • 17. 发明申请
    • CAMERA MODULE
    • US20230100251A1
    • 2023-03-30
    • US17906325
    • 2021-03-25
    • SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    • TOSHIHIRO TOKITO
    • H04N23/51G03B17/12
    • A camera module according to an embodiment of the present technology includes a housing that includes a first case that includes an opening at one of ends of the first case, and a second case that is joined to another of the ends of the first case; a barrel member that is arranged in the housing and includes a barrel that is fitted into the opening in an optical-axis direction; a sensor board that is arranged in the housing and includes an imaging device that faces the barrel; and a support that includes a peripheral wall portion and a control portion, and is arranged between the barrel member and the second case, the peripheral wall portion including a first end and a second end and covering around the imaging device, the first end supporting the barrel member, the second end being brought into elastic contact with the second case, the control portion being arranged between the peripheral wall portion and an inner peripheral surface of the first case and controlling approach of the barrel member to the second case.