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    • 18. 发明申请
    • FORWARDING ELEMENT INTEGRATED CIRCUIT CHIP WITH SEPARATE I/O AND SWITCHING TILES
    • US20200265002A1
    • 2020-08-20
    • US16796828
    • 2020-02-20
    • Barefoot Networks, Inc.
    • Anurag AGRAWALAlain LOGE
    • G06F13/40H03K17/81
    • Some embodiments of the invention provide a novel method and chip design for a forwarding chip, that decouples input-output (IO) technology requirements from the technology used in a high bandwidth switching ASIC. In some embodiments, a main die including a latest generation switching chip is coupled to a set of IO dies (e.g., SerDes dies). The main die, in some embodiments, uses a latest technology (e.g., 7 nm nodes) while the IO dies, in some embodiments, use a more mature technology (e.g., 16 nm nodes). Some embodiments provide multiple IO dies that each provide connectivity to external components to the high bandwidth switching ASIC (e.g., a core ASIC die). The multiple dies are mounted on a silicon interposer, in some embodiments, using microbumps to make the connections between the dies and the silicon interposer. Additional connections to the pad are made from each die including to general purpose input-output (GPIO) connections. In some embodiments, the main die and the IO dies make all connections through microbumps on the silicon interposer and some microbumps connect to external components using through-silicon vias (TSVs). The microbumps of the main die, in some embodiments, are arranged so that they are mirrored on either side of the main die and rotationally invariant under a 180 degree rotation. IO dies, in some embodiments, are mounted in a first orientation to connect to a first side of the main die and a second rotated (by 180 degrees) orientation to connect to a second opposite side of the main die.
    • 19. 发明授权
    • Forwarding element data plane with computing parameter distributor
    • US10721188B2
    • 2020-07-21
    • US16147750
    • 2018-09-30
    • Barefoot Networks, Inc.
    • Masoud Moshref JavadiChanghoon KimPatrick W. BosshartAnurag Agrawal
    • H04L12/935G06F9/455G06N3/08
    • Some embodiments provide a network forwarding element with a data-plane forwarding circuit that has a parameter collecting circuit to store and distribute parameter values computed by several machines in a network. In some embodiments, the machines perform distributed computing operations, and the parameter values that compute are parameter values associated with the distributed computing operations. The parameter collecting circuit of the data-plane forwarding circuit (data plane) in some embodiments (1) stores a set of parameter values computed and sent by a first set of machines, and (2) distributes the collected parameter values to a second set of machines once it has collected the set of parameter values from all the machines in the first set. The first and second sets of machines are the same set of machines in some embodiments, while they are different sets of machines (e.g., one set has at least one machine that is not in the other set) in other embodiments. In some embodiments, the parameter collecting circuit performs computations on the parameter values that it collects and distributes the result of the computations once it has processed all the parameter values distributed by the first set of machines. The computations are aggregating operations (e.g., adding, averaging, etc.) that combine corresponding subset of parameter values distributed by the first set of machines.