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    • 11. 发明授权
    • Array substrate assembly and display device
    • 阵列基板组装和显示装置
    • US09560756B2
    • 2017-01-31
    • US14202333
    • 2014-03-10
    • Hefei BOE Optoelectronics Technology Co., LTD.BOE Technology Group Co., LTD.
    • Juncai Ma
    • H01R9/00H05K1/11H05K7/00H05K7/10G02F1/1345H05K1/18
    • H05K1/111G02F1/13452G02F1/13454G02F1/13458H05K1/181H05K2201/094H05K2201/09436H05K2201/09709H05K2201/09736H05K2201/09845H05K2201/10234Y02P70/611
    • The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly. With the solution of the present invention, when the array substrate assembly is connected to IC or COF, deformation difference between a conducting gold ball at a gate line terminal and a conducting gold ball at a date line is small, thus impedances at the two terminals are close to each other, and therefore image quality of the display device is improved.
    • 本发明涉及阵列基板组件和显示装置。 阵列基板组件包括基板; 形成在所述基板一侧的第一金属线; 形成在所述第一金属线上的绝缘层; 形成在绝缘层上的第二金属线,其中与驱动电路连接的第二金属线的一端形成有第二端子,其中在基板的厚度方向上,第二端子的表面之间的距离远离 基板和基板的一侧小于离开基板的一侧的第二金属线的表面与基板之间的距离。 显示装置包括阵列基板组件。 利用本发明的解决方案,当阵列基板组件连接到IC或COF时,栅极线端子处的导电金球与日期线处的导电金球之间的变形差小,因此两个端子处的阻抗 彼此接近,因此改善了显示装置的图像质量。
    • 17. 发明申请
    • ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
    • 阵列基板组件和显示设备
    • US20140362542A1
    • 2014-12-11
    • US14202333
    • 2014-03-10
    • BOE Technology Group Co., LTD.Hefei BOE Optoelectronics Technology Co., LTD.
    • Juncai Ma
    • H05K1/02
    • H05K1/111G02F1/13452G02F1/13454G02F1/13458H05K1/181H05K2201/094H05K2201/09436H05K2201/09709H05K2201/09736H05K2201/09845H05K2201/10234Y02P70/611
    • The present invention relates to an array substrate assembly and a display device. The array substrate assembly comprises a substrate; a first metal line formed at one side of the substrate; an insulating layer formed on the first metal line; a second metal line formed on the insulating layer, wherein one end of the second metal line connected with a driving circuit is formed with a second terminal, wherein in a thickness direction of the substrate, a distance between a surface of the second terminal away from the one side of the substrate and the substrate is less than a distance between a surface of the second metal line away from the one side of the substrate and the substrate. The display device includes the array substrate assembly. With the solution of the present invention, when the array substrate assembly is connected to IC or COF, deformation difference between a conducting gold ball at a gate line terminal and a conducting gold ball at a date line is small, thus impedances at the two terminals are close to each other, and therefore image quality of the display device is improved.
    • 本发明涉及阵列基板组件和显示装置。 阵列基板组件包括基板; 形成在所述基板一侧的第一金属线; 形成在所述第一金属线上的绝缘层; 形成在绝缘层上的第二金属线,其中与驱动电路连接的第二金属线的一端形成有第二端子,其中在基板的厚度方向上,第二端子的表面之间的距离远离 基板和基板的一侧小于离开基板的一侧的第二金属线的表面与基板之间的距离。 显示装置包括阵列基板组件。 利用本发明的解决方案,当阵列基板组件连接到IC或COF时,栅极线端子处的导电金球与日期线处的导电金球之间的变形差小,因此两个端子处的阻抗 彼此接近,因此改善了显示装置的图像质量。