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11. 发明授权

US09484372B2 Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus 有权
标题翻译：用于嵌入成像装置的基板及其制造方法以及成像装置
公开(公告)号：US09484372B2
公开(公告)日：2016-11-01
申请号：US14960094
申请日：2015-12-04
申请人： TAIYO YUDEN CO., LTD.
发明人： Yuichi Sugiyama , Masashi Miyazaki , Yoshiki Hamada
IPC分类号： H01L31/0203 , H01L27/146
CPC分类号： H01L27/14618 , H01L24/32 , H01L27/14607 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L31/0203 , H01L2224/05553 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83385 , H01L2924/10155 , H01L2924/00014 , H01L2924/00
摘要： A substrate for embedding an imaging device includes: a core layer; a first multilayered wiring layer that is formed onto the core layer, the core layer and the first multilayered wiring layer having a cavity penetrating therethrough; a second multilayered wiring layer that is formed onto the core layer on a side opposite to the first multilayered wiring layer and that includes a conductive pattern formed at a position facing the cavity; a resin portion that is arranged inside the cavity and includes a bottom surface supported by the second multilayered wiring layer, a side face supported by the core layer, and a curved surface formed on a side opposite to the bottom surface; and an imaging device adhered along the curved surface inside the cavity.
摘要翻译：用于嵌入成像装置的基板包括：芯层; 形成在所述芯层上的第一多层布线层，所述芯层和所述第一多层布线层具有穿透其中的空腔; 第二多层布线层，形成在与第一多层布线层相反的一侧的芯层上，并且包括形成在面向空腔的位置处的导电图案; 布置在所述空腔内的树脂部分，其包括由所述第二多层布线层支撑的底面，由所述芯层支撑的侧面和形成在与所述底面相反的一侧的曲面; 以及沿着腔内的弯曲表面粘附的成像装置。

12. 发明申请

US20160172774A1 COMPOSITE SUBSTRATE AND RIGID SUBSTRATE 有权
标题翻译：复合基板和刚体基板
公开(公告)号：US20160172774A1
公开(公告)日：2016-06-16
申请号：US14962710
申请日：2015-12-08
申请人： TAIYO YUDEN CO., LTD.
发明人： Masashi Miyazaki , Yuichi Sugiyama , Yutaka Hata
IPC分类号： H01R12/71
CPC分类号： H01R12/62 , H05K1/028 , H05K1/117 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/361 , H05K3/4691 , H05K3/4697 , H05K2201/042 , H05K2201/056 , H05K2201/09036 , H05K2201/09127 , H05K2201/09709
摘要： A composite substrate has a rigid substrate that includes: a core layer, a first laminated layer on a first surface of the core layer, and a second laminated layer on a second surface of the core layer, the rigid substrate having a cutout in the core layer and the second laminated layer on one side face of the rigid substrate; and a flexible substrate inserted into the cutout in the rigid substrate on the one side face and laterally and externally protruding from the one side face of the rigid substrate, wherein the rigid substrate has opposing walls each constituted of the second laminated layer and the core layer erected on the first laminated layer to define inner side faces, respectively, of the cutout so as to accommodate the flexible substrate in a direction perpendicular to a direction in which the side face of the rigid substrate extends.
摘要翻译：复合基板具有刚性基板，其包括：芯层，在芯层的第一表面上的第一层叠层和在芯层的第二表面上的第二层叠层，刚性基板在芯中具有切口层和第二层压层在刚性基板的一个侧面上; 以及柔性基板，其插入到所述刚性基板的所述切口部的所述一个侧面上，并且从所述刚性基板的一个侧面侧向外侧突出，其中，所述刚性基板具有由所述第二层叠层和所述芯层构成的相对的壁竖立在第一层压层上以分别限定切口的内侧面，以便沿着与刚性基板的侧面延伸的方向垂直的方向容纳柔性基板。

13. 发明授权

US08988885B2 Electronic circuit module and method for producing the same 有权
标题翻译：电子电路模块及其制造方法
公开(公告)号：US08988885B2
公开(公告)日：2015-03-24
申请号：US14073287
申请日：2013-11-06
申请人： Taiyo Yuden Co., Ltd.
发明人： Tatsuro Sawatari , Masashi Miyazaki , Yoshiki Hamada , Yuichi Sugiyama , Kazuaki Ida
IPC分类号： H05K5/00 , H05K9/00 , H01L23/552 , H01L21/56 , H01L23/00
CPC分类号： H05K9/00 , H01L21/561 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/19105 , Y10T29/49146 , H01L2224/81
摘要： An electronic circuit module includes a substrate with built-in component, a mount component mounted on the substrate with built-in component, a sealing portion covering the mount component, and a shield made of a conductive synthetic resin covering the sealing portion. The substrate with built-in component has a core layer made of a metal, an outer cover made of an insulating synthetic resin, and a first protrusion. The core layer has corners and side faces. The outer cover covers the corners and the side faces, and has a first surface. The first protrusion has a first end face exposed at the outer cover and a second surface adjacent to the first surface, and is formed away from the corners of the side faces to protrude outwardly. The sealing portion covers the mount component. The shield covers the sealing portion, and has a third surface bonded to the first surface and the second surface.
摘要翻译：电子电路模块包括具有内置部件的基板，安装在具有内置部件的基板上的安装部件，覆盖安装部件的密封部分和覆盖密封部分的导电合成树脂制成的屏蔽。具有内置部件的基板具有由金属制成的芯层，由绝缘合成树脂制成的外盖和第一突起。芯层有拐角和侧面。外盖覆盖角部和侧面，并且具有第一表面。第一突起具有在外盖处露出的第一端面和与第一表面相邻的第二表面，并且远离侧面的角部形成以向外突出。密封部分覆盖安装部件。护罩覆盖密封部分，并且具有结合到第一表面和第二表面的第三表面。

14. 发明授权

US09818780B2 Camera module 有权
公开(公告)号：US09818780B2
公开(公告)日：2017-11-14
申请号：US14155308
申请日：2014-01-14
申请人： TAIYO YUDEN CO., LTD.
发明人： Masashi Miyazaki , Yuichi Sugiyama , Tatsuro Sawatari , Hideki Yokota , Yutaka Hata
IPC分类号： H01L27/146
CPC分类号： H01L27/14627 , H01L27/146 , H01L27/14605 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L2224/48091 , H01L2224/48227 , H01L2924/15192 , H01L2924/19105 , H01L2924/00014
摘要： In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.

15. 发明授权

US09363897B2 Substrate with built-in electronic component 有权
标题翻译：基板内置电子元器件
公开(公告)号：US09363897B2
公开(公告)日：2016-06-07
申请号：US14133372
申请日：2013-12-18
申请人： Taiyo Yuden Co., Ltd.
发明人： Yuichi Sugiyama , Tatsuro Sawatari , Yusuke Inoue , Masashi Miyazaki
IPC分类号： H05K1/18 , H05K1/02 , H01L23/00 , H05K3/46
CPC分类号： H05K1/183 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H01L2924/19105 , H05K1/0298 , H05K1/185 , H05K3/4602 , H05K2201/0209 , H05K2201/068 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
摘要： Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.
摘要翻译：提供了具有内置电子部件的基板，包括部件存储层和两个累积层。部件存储层包括电子部件和具有绝缘性的盖部。电子部件包括终端面和主体。盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。两个堆积层各自包括绝缘层和通孔部分。绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。通孔部分设置在绝缘层中并连接到端子表面。两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。

16. 发明授权

US09253386B2 Camera module 有权
标题翻译：相机模块
公开(公告)号：US09253386B2
公开(公告)日：2016-02-02
申请号：US14155311
申请日：2014-01-14
申请人： TAIYO YUDEN CO., LTD.
发明人： Masashi Miyazaki , Yuichi Sugiyama , Tatsuro Sawatari , Hideki Yokota , Yutaka Hata
IPC分类号： H04N5/225 , H01L23/00
CPC分类号： H04N5/2257 , H01L24/47 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H04N5/2253 , H04N5/2254 , H01L2224/45015 , H01L2924/207
摘要： A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.
摘要翻译：在嵌入式部件基板的表面（上表面）上设置相机模块，其中具有比成像装置的厚度更大的深度的凹部。成像装置结合到凹部的底部，使得在成像装置的表面（顶表面）和嵌入部件基板的表面（顶表面）之间存在开口。成像装置上的连接焊盘通过接合穿过开口的导线连接到设置在嵌入式组件衬底的表面（顶表面）上的导体焊盘。

17. 发明授权

US09007782B1 Substrate with built-in electronic component 有权
标题翻译：基板内置电子元器件
公开(公告)号：US09007782B1
公开(公告)日：2015-04-14
申请号：US14566470
申请日：2014-12-10
申请人： Taiyo Yuden Co., Ltd.
发明人： Tatsuro Sawatari , Yuichi Sugiyama , Hiroshi Nakamura , Masaki Naganuma , Tetsuo Saji
IPC分类号： H05K1/18 , H05K1/02
CPC分类号： H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
摘要： In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
摘要翻译：在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠其分别投影到第一导电层和第三导电层上。

18. 发明授权

US08964407B2 Substrate with built-in electronic component 有权
标题翻译：基板内置电子元器件
公开(公告)号：US08964407B2
公开(公告)日：2015-02-24
申请号：US14101054
申请日：2013-12-09
申请人： Taiyo Yuden Co., Ltd.
发明人： Tatsuro Sawatari , Yuichi Sugiyama
IPC分类号： H05K7/02 , H05K1/18
CPC分类号： H05K1/0216 , H05K1/0231 , H05K1/0298 , H05K1/183 , H05K1/185 , H05K3/4697 , H05K2201/0187 , H05K2201/10522
摘要： A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.
摘要翻译：具有内置电子部件的基板包括：芯层，其包括芯材料和形成在芯材中并且包含绝缘材料的空腔; 绝缘层，其包括接地布线和信号布线，并且形成在所述芯层上; 以及多个电子部件，其各自包括第一端子和第二端子，并且存储在所述空腔中，所述多个电子部件各自具有一个端部和另一个端部，所述第一端子形成在所述一个端部处，连接到接地布线，第二端子形成在另一端部并连接到信号布线，多个电子部件具有第一端子彼此面对并且第二端子面对的布置中的至少一种其他。

19. 发明授权

US11069589B2 Circuit board and circuit module 有权
公开(公告)号：US11069589B2
公开(公告)日：2021-07-20
申请号：US16502866
申请日：2019-07-03
申请人： TAIYO YUDEN CO., LTD.
发明人： Yutaka Hata , Masashi Miyazaki , Yuichi Sugiyama
IPC分类号： H01L23/31 , H05K3/46 , H05K1/02 , H01L23/00 , H05K1/18
摘要： Provided is a circuit board including: a metal core layer having a first main surface capable of supporting a mounting component and a second main surface which is opposite to the first main surface; a first exterior coating base material which is arranged facing the first main surface; and a second exterior coating base material which is arranged facing the second main surface and includes a heat dissipation layer having a via which is connected to the second main surface.

20. 发明授权

US10957652B2 Circuit board 有权
公开(公告)号：US10957652B2
公开(公告)日：2021-03-23
申请号：US16790625
申请日：2020-02-13
申请人： TAIYO YUDEN CO., LTD.
发明人： Yuichi Sugiyama , Masashi Miyazaki , Yoshiki Hamada
IPC分类号： H01L23/538 , H01L21/48 , H01L23/13 , H01L23/31 , H01L25/16 , H01L23/34
摘要： A circuit board includes a core layer including a plurality of metal layers laminated one over another, a bottommost metal layer of the plurality of metal layers being thickest, and a topmost metal layer of the plurality of metal layer being thinnest; an upper insulating layer and an upper conductive pattern provided over a top surface of the core layer; and a lower insulating layer and a lower conductive pattern provided below a bottom surface of the core layer, wherein the topmost metal layer of the core metal layer is patterned to have a prescribed shaped section that serves as wiring and that is connected to the upper conductive pattern, wherein a metal ratio that is defined as a ratio of an area that is formed of metal relative to an entire area in a plan view is higher in the bottommost metal layer than in the topmost metal layer.

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