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11. 发明授权

US09869810B2 Method for manufacturing electronic products, related arrangement and product 有权
公开(公告)号：US09869810B2
公开(公告)日：2018-01-16
申请号：US14264273
申请日：2014-04-29
申请人： TactoTek Oy
发明人： Antti Keranen , Jarmo Saaski , Tuomas Heikkila , Paavo Niskala , Kari Severinkangas , Sami Torvinen
IPC分类号： F21V1/00 , F21V8/00
CPC分类号： G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.

12. 发明授权

US09297675B2 Illuminated indicator structures for electronic devices 有权
标题翻译：电子设备的照明指示器结构
公开(公告)号：US09297675B2
公开(公告)日：2016-03-29
申请号：US14046425
申请日：2013-10-04
申请人： TactoTek Oy
发明人： Antti Keränen , Mikko Heikkinen
IPC分类号： G01D11/28
CPC分类号： G01D11/28 , F21K9/60 , F21V23/04 , H01H13/83 , H01H2219/028 , H01H2219/039 , H01H2219/056 , H01H2219/06
摘要： A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.
摘要翻译：用于电子设备的复合层压组件为由组件限定的一个或多个指示器形状提供集成背光。组件包括基本上不透明的盖构件，以遮蔽电子设备的至少一部分。盖构件中的半透明指示器结构限定相应的指示器形状，以允许背光通过盖构件。光学导电材料的光学基质层被附着到盖构件的内表面，其中多个照明装置嵌入在光学矩阵层中并且横向偏离相关联的指示器结构。多个照明装置可以连接到承载在盖构件的内表面上的电路。

13. 发明申请

US20220171121A1 ILLUMINATED MULTILAYER STRUCTURE WITH EMBEDDED LIGHT SOURCES 有权
公开(公告)号：US20220171121A1
公开(公告)日：2022-06-02
申请号：US17674894
申请日：2022-02-18
申请人： TACTOTEK OY
发明人： Antti KERÄNEN , Mikko HEIKKINEN
IPC分类号： F21V8/00
摘要： An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

14. 发明授权

US10960641B2 Integrated multilayer structure for use in sensing applications and method for manufacturing thereof 有权
公开(公告)号：US10960641B2
公开(公告)日：2021-03-30
申请号：US17061934
申请日：2020-10-02
申请人： TactoTek Oy
发明人： Vinski Bräysy , Anne Isohätälä , Jarmo Sääski , Tomi Simula
IPC分类号： B32B1/00 , B32B3/00 , B32B3/30 , B32B27/08 , G06F3/044 , B29L31/34 , B29C45/16
摘要： A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

15. 发明授权

US10946612B2 Integrated multilayer structure for use in sensing applications and method for manufacturing thereof 有权
公开(公告)号：US10946612B2
公开(公告)日：2021-03-16
申请号：US16113335
申请日：2018-08-27
申请人： TactoTek Oy
发明人： Vinski Bräysy , Anne Isohätälä , Jarmo Sääski , Tomi Simula
IPC分类号： G06F3/045 , B32B3/30 , B32B27/08 , G06F3/044 , B29C45/16 , B29L31/34
摘要： An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.

16. 发明申请

US20210016539A1 INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF 有权
公开(公告)号：US20210016539A1
公开(公告)日：2021-01-21
申请号：US17061934
申请日：2020-10-02
申请人： TactoTek Oy
发明人： Vinski BRÄYSY , Anne ISOHÄTÄLÄ , Jarmo SÄÄSKI , Tomi SIMULA
IPC分类号： B32B3/30 , B32B27/08 , G06F3/044
摘要： A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.

17. 发明授权

US10897196B2 Arrangement and method for delivering a current-controlled voltage 有权
公开(公告)号：US10897196B2
公开(公告)日：2021-01-19
申请号：US16682106
申请日：2019-11-13
申请人： TactoTek Oy
发明人： Miikka Kärnä , Tuomas Heikkilä
IPC分类号： H02M3/156 , G05F1/67 , H02J1/10 , H02M7/217 , H02J9/06 , G05F1/445 , H02M1/08 , H02J3/38 , H05B45/10 , H05B45/395
摘要： An arrangement involving printed conductive traces includes at least a voltage source (Vsupply) and at least one target component, preferably a light-emitting component such as an LED. The arrangement is adapted to produce a current-controlled voltage (VOUT2, Vout) originating from the voltage source, the current-controlled voltage being coupled to the at least one target component, wherein said voltage is dependent on the current (IR,LED, ILED) that is being passed through the target component and said voltage is adaptable to a varying resistance of the arrangement and its features.

18. 发明申请

US20210007222A1 ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE 有权
公开(公告)号：US20210007222A1
公开(公告)日：2021-01-07
申请号：US17026960
申请日：2020-09-21
申请人： TactoTek Oy
发明人： Tero HEIKKINEN , Antti KERANEN , Mikko HEIKKINEN , Jarmo SAASKI
IPC分类号： H05K1/03 , F21V3/00 , F21V8/00 , H05K1/02 , H05K1/18 , H05K3/28 , H05K3/46
摘要： Integrated multilayer structure for hosting electronics, including a first substrate—including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

19. 发明授权

US10827609B2 Ecological multilayer structure for hosting electronics and related method of manufacture 有权
公开(公告)号：US10827609B2
公开(公告)日：2020-11-03
申请号：US16711610
申请日：2019-12-12
申请人： TactoTek Oy
发明人： Tero Heikkinen , Antti Keranen , Mikko Heikkinen , Jarmo Saaski
IPC分类号： H05K1/03 , F21V3/00 , F21V8/00 , H05K1/02 , H05K1/18 , H05K3/28 , H05K3/46 , F21Y115/10 , F21Y115/15
摘要： An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

20. 发明授权

US10575407B2 System for carrying out a manufacturing method on an electro chemical structure 有权
公开(公告)号：US10575407B2
公开(公告)日：2020-02-25
申请号：US16018127
申请日：2018-06-26
申请人： TactoTek Oy
发明人： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen , Paavo Niskala , Mikko Sippari , Pasi Raappana , Antti Keränen
IPC分类号： H05K3/00 , H05K1/02 , H05K1/03 , B29C45/14 , B29L31/34
摘要： A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

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