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21. 发明授权

US06510022B1 Method for shaping pole pieces of magnetic heads by chemical mechanical polishing 失效
公开(公告)号：US06510022B1
公开(公告)日：2003-01-21
申请号：US09504969
申请日：2000-02-15
申请人： Ashok Lahiri , Edward Hin Pong Lee , Eric James Lee , Hong Xu
发明人： Ashok Lahiri , Edward Hin Pong Lee , Eric James Lee , Hong Xu
IPC分类号： G11B5147
CPC分类号： G11B5/313 , G11B5/012 , G11B5/3116 , Y10T29/49032 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： The thin film magnetic head of the present invention includes an improved P2 pole tip/yoke interface structure. The interface structure includes yoke material that is formed in a concave curved shape at the interface between the P2 pole tip and the yoke, such that a right angle interface between the P2 pole tip and the yoke is eliminated. The process for forming the P2 pole tip/yoke interface includes a second CMP polishing step that is performed on the surface of the write head wafer subsequent to the plating of the P2 pole tip thereon, and subsequent to a first CMP step. This second CMP step utilizes a relatively soft polishing pad and an acidic polishing slurry having a pH within the range of approximately 1 to approximately 5, and preferably approximately 2.5. The acidic polishing slurry contains a chemical agent which preferentially attacks the P2 pole tip material, such that the second CMP step results in the recession of the upper surface of the P2 pole tip relative to the dielectric layer surrounding it, as well as the significant rounding of the upper edges of the dielectric trench in which the P2 pole tip is formed. Thereafter, when the yoke is plated onto the P2 pole tip the rounded upper edges of the dielectric trench result in a concave curved interface between the yoke and the P2 pole tip. The resulting P2 pole tip/yoke interface possesses improved magnetic flux flow control properties and results in decreased side writing. Greater track per inch areal data storage results from the reduced side writing of the improved write head.

22. 发明授权

US07504038B2 System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding 有权
标题翻译：用于机械可拆卸的滑块加工的系统，方法和装置，包括研磨，空气轴承图案化和脱粘
公开(公告)号：US07504038B2
公开(公告)日：2009-03-17
申请号：US10788145
申请日：2004-02-26
申请人： Alexander Bietsch , Michael W. Chaw , Ashok Lahiri , Bruno Michel , Mark C. Thurber
发明人： Alexander Bietsch , Michael W. Chaw , Ashok Lahiri , Bruno Michel , Mark C. Thurber
IPC分类号： B44C1/22
CPC分类号： G11B5/127
摘要： A mechanically releasable slider process utilizes silicone rubber or PDMS to take the function of a planarization material for individual sliders or slider rows. Mechanical debonding takes advantage of the rubber-elastic property of PDMS. A gripper is used in a virtually solvent-free, air bearing patterning UV-molding process and resist-based processes. A PDMS-based fixture is used during both the lapping process and the photo or UV-mold patterning of the ABS surface. This fixture can mechanically hold sliders by large area reversible adhesion while allowing gimbaling, electrical connection, actuation, UV-molding or photolithography, and mechanical release, thus reducing the number of slider manipulations to two.
摘要翻译：机械可剥离的滑块工艺利用硅橡胶或PDMS来承担各个滑块或滑块排的平面化材料的功能。机械剥离利用了PDMS的橡胶弹性特性。夹具用于几乎无溶剂的空气轴承图案化UV成型工艺和基于抗蚀剂的工艺。在ABS表面的研磨过程和照相或UV模具图案化期间都使用基于PDMS的夹具。该夹具可以通过大面积可逆粘合机械地保持滑块，同时允许伸缩，电连接，致动，UV成型或光刻，以及机械释放，从而将滑块操纵的数量减少到两个。

23. 发明申请

US20050191582A1 System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding 有权
标题翻译：用于机械可拆卸的滑块加工的系统，方法和装置，包括研磨，空气轴承图案化和脱粘
公开(公告)号：US20050191582A1
公开(公告)日：2005-09-01
申请号：US10788145
申请日：2004-02-26
申请人： Alexander Bietsch , Michael Chaw , Ashok Lahiri , Bruno Michel , Mark Thurber
发明人： Alexander Bietsch , Michael Chaw , Ashok Lahiri , Bruno Michel , Mark Thurber
IPC分类号： B24B1/00 , G03C5/00 , G11B5/127
CPC分类号： G11B5/127
摘要： A mechanically releasable slider process utilizes silicone rubber or PDMS to take the function of a planarization material for individual sliders or slider rows. Mechanical debonding takes advantage of the rubber-elastic property of PDMS. A gripper is used in a virtually solvent-free, air bearing patterning UV-molding process and resist-based processes. A PDMS-based fixture is used during both the lapping process and the photo or UV-mold patterning of the ABS surface. This fixture can mechanically hold sliders by large area reversible adhesion while allowing gimbaling, electrical connection, actuation, UV-molding or photolithography, and mechanical release, thus reducing the number of slider manipulations to two.
摘要翻译：机械可剥离的滑块工艺利用硅橡胶或PDMS来承担各个滑块或滑块排的平面化材料的功能。机械剥离利用了PDMS的橡胶弹性特性。夹具用于几乎无溶剂的空气轴承图案化UV成型工艺和基于抗蚀剂的工艺。在ABS表面的研磨过程和照相或UV模具图案化期间都使用基于PDMS的夹具。该夹具可以通过大面积可逆粘合机械地保持滑块，同时允许伸缩，电连接，致动，UV成型或光刻，以及机械释放，从而将滑块操纵的数量减少到两个。

24. 发明申请

US20050191418A1 System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning 失效
标题翻译：用于空气轴承表面图案化的多层UV成型光刻的系统，方法和装置
公开(公告)号：US20050191418A1
公开(公告)日：2005-09-01
申请号：US10787476
申请日：2004-02-26
申请人： Alexander Bietsch , Michael Chaw , Ashok Lahiri , Ian McFadyen , Bruno Michel , Mark Thurber
发明人： Alexander Bietsch , Michael Chaw , Ashok Lahiri , Ian McFadyen , Bruno Michel , Mark Thurber
IPC分类号： B05D5/00 , G03F7/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F7/0017
摘要： UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
摘要翻译：公开了能够以高精度复制UV固化的抗蚀剂图案的薄弯曲背板上的弹性体主体的UV模塑。这种设计适应于大的基片形状，具有改善的脱模性能，并且促进滑块在地形结构的弹性粘性垫上的二合一光刻和组装。粘垫组件和二合一光刻的组合允许基于UV成型的一体式和谐工艺。这些特征解决了和谐过程的现有技术问题，同时显着降低了成本。

25. 发明申请

US20050160586A1 Method for shaping pole pieces of magnetic heads by chemical mechanical polishing 失效
标题翻译：通过化学机械抛光对磁头的极片进行成形的方法
公开(公告)号：US20050160586A1
公开(公告)日：2005-07-28
申请号：US11090087
申请日：2005-03-24
申请人： Ashok Lahiri , Edward Pong Lee , Eric Lee , Hong Xu
发明人： Ashok Lahiri , Edward Pong Lee , Eric Lee , Hong Xu
IPC分类号： G11B5/012 , G11B5/31 , G11B5/127 , G11B5/147
CPC分类号： G11B5/313 , G11B5/012 , G11B5/3116 , Y10T29/49032 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A thin film magnetic head that includes an improved P2 pole tip/yoke interface. The process for forming the P2 pole tip/yoke interface includes a CMP polishing step that is performed on the surface of the wafer subsequent to the plating of the P2 pole tip. This CMP step utilizes a relatively soft polishing pad and an acidic polishing slurry which preferentially attacks the P2 pole tip material, such that the CMP step results in the recession of the upper surface of the P2 pole tip relative to the dielectric layer surrounding it, as well as the significant rounding of the upper edges of the dielectric trench in which the P2 pole tip is formed. Thereafter, when the yoke is plated onto the P2 pole tip the rounded upper edges of the dielectric trench result in a concave curved interface between the yoke and the P2 pole tip.
摘要翻译：一种薄膜磁头，包括改进的P 2极尖/磁轭接口。用于形成P 2极尖/轭接口的工艺包括在P 2极尖的电镀之后在晶片的表面上执行的CMP抛光步骤。该CMP步骤使用相对软的抛光垫和优先攻击P 2极尖材料的酸性抛光浆料，使得CMP步骤导致P 2极尖端的上表面相对于围绕其的介电层的凹陷，以及形成有P 2极尖的电介质沟槽的上边缘的显着的四舍五入。此后，当轭被镀在P 2极尖上时，电介质沟槽的圆形上边缘导致轭和P 2极尖之间的凹形弯曲界面。

26. 发明授权

US06912772B2 Method for shaping pole pieces of magnetic heads by chemical mechanical polishing 失效
标题翻译：通过化学机械抛光对磁头的极片进行成形的方法
公开(公告)号：US06912772B2
公开(公告)日：2005-07-05
申请号：US09948957
申请日：2001-09-07
申请人： Ashok Lahiri , Edward Hin Pong Lee , Eric James Lee , Hong Xu
发明人： Ashok Lahiri , Edward Hin Pong Lee , Eric James Lee , Hong Xu
IPC分类号： G11B5/012 , G11B5/31 , G11B5/127 , H04R31/00
CPC分类号： G11B5/313 , G11B5/012 , G11B5/3116 , Y10T29/49032 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49046 , Y10T29/49048 , Y10T29/49052
摘要： A process for forming the P2 pole tip/yoke interface of a magnetic head that includes a second CMP polishing step that is performed on the surface of the write head wafer subsequent to the plating of the P2 pole tip thereon, and subsequent to a first CMP step. This second CMP step utilizes a relatively soft polishing pad and an acidic polishing slurry which preferentially attacks the P2 pole tip material. This results in the recession of the upper surface of the P2 pole tip relative to the dielectric layer surrounding it, and significant rounding of the upper edges of the dielectric trench in which the P2 pole tip is formed. Thereafter, when the yoke is plated onto the P2 pole tip the rounded upper edges of the dielectric trench result in a concave curved interface between the yoke and the P2 pole tip.
摘要翻译：一种用于形成磁头的P 2极尖/磁轭接口的方法，包括在其上的P 2极尖的电镀之后在写入头晶片的表面上执行的第二CMP抛光步骤，以及在第一CMP步骤。该第二CMP步骤使用相对较软的抛光垫和优先攻击P 2极端材料的酸性抛光浆料。这导致P 2极端部的上表面相对于围绕它的电介质层的衰减，以及形成有P 2极尖端的电介质沟槽的上边缘的显着的圆化。此后，当轭被镀在P 2极尖上时，电介质沟槽的圆形上边缘导致轭和P 2极尖之间的凹形弯曲界面。

27. 发明授权

US06631546B1 Self-aligned void filling for mushroomed plating 失效
标题翻译：自对准空隙填充为蘑菇电镀
公开(公告)号：US06631546B1
公开(公告)日：2003-10-14
申请号：US09496070
申请日：2000-02-01
申请人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
发明人： Thomas Edward Dinan , Richard Hsiao , John I. Kim , Ashok Lahiri , Clinton David Snyder
IPC分类号： G11R5127
CPC分类号： C25D5/022 , G11B5/127 , G11B5/3163 , Y10T29/49032 , Y10T29/49155 , Y10T29/49156
摘要： A method of manufacturing includes 2 mushroom plating process starts with an overplated component which includes an enlarged mushroom head having outer portions which overhang a resist layer. The next step in the first process embodiment is a heating step in which the resist layer is hard baked. Thereafter, using a dry etch process, such as a reactive ion etch (RIE) process, the hard baked resist layer is removed in all areas except beneath the overhang of the mushroom head. The area beneath the overhang thereby remains filled with hard baked resist. Thereafter, the device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. In an alternative process embodiment of the present invention the dry etch process is conducted first upon the resist layer, such that the resist layer is removed in all areas except under the overhang. Thereafter, the device is baked, such that hard baked resist remains beneath the overhang. Ultimately, the device is encapsulated and no voids or redeposition problems exist beneath the overhang due to the presence of the hard baked resist.
摘要翻译：一种制造方法包括2个蘑菇电镀工艺，其中包括一个具有外伸部分的扩大的蘑菇头的一个过度的部件，其上覆盖了一个抗蚀剂层。第一工艺实施例中的下一步骤是其中抗蚀剂层被硬烘烤的加热步骤。此后，使用诸如反应离子蚀刻（RIE）工艺的干蚀刻工艺，除了在蘑菇头的突出部以外的所有区域中除去硬烘烤抗蚀剂层。悬挂下方的区域由此保持充满硬烘烤抗蚀剂。此后，装置最终被封装，使得由于存在硬烘烤抗蚀剂而在悬垂下不存在空隙和/或再沉积问题。在本发明的替代方法实施方案中，首先在抗蚀剂层上进行干蚀刻工艺，使得除了在悬垂体之外的所有区域中除去抗蚀剂层。此后，该装置被烘烤，使得硬烘烤抗蚀剂保留在悬垂物的下方。最终，器件被封装，由于存在硬烘烤的抗蚀剂，悬臂下方不存在空隙或再沉积问题。

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