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    • 25. 发明授权
    • Edge densification for film boiling process
    • 薄膜沸腾过程的边缘致密化
    • US08163339B2
    • 2012-04-24
    • US12210228
    • 2008-09-15
    • Arnaud Fillion
    • Arnaud Fillion
    • C23C16/00B05D1/18C23C8/00C23C14/26H05B6/02H05B6/24
    • F16D69/023C04B35/117C04B35/83C04B2235/3826C04B2235/3873C04B2235/422C04B2235/48C04B2235/483C04B2235/614C04B2235/616
    • A method and apparatus are disclosed for improving densification of porous substrate using a film boiling process. In particular, the disclosed method and apparatus permit more complete densification of a substrate (i.e., densification closer to the surface of the substrate) by providing a sort of barrier that reduces cooling of the surface of the substrate being densified caused by contact with the relatively cool boiling liquid precursor of the densifying material, such as carbon. In particular, contact between the substrate and the liquid precursor is reduced using one or both of physical barriers (such as a mesh material) or structures that promote the formation of an insulating gaseous layer between the substrate and the liquid precursor (such as a plate closely spaced apart from the surface of the porous substrate).
    • 公开了一种使用薄膜沸腾工艺改善多孔基材致密化的方法和装置。 特别地,所公开的方法和设备允许通过提供一种屏障来使衬底的更完全的致密化(即致密化更靠近衬底的表面),该屏障减少由于与相对的接触而导致的致密化的衬底的表面的冷却 致冷材料的冷却沸腾液体前体如碳。 特别地,使用物理屏障(例如网状材料)之一或两者来减少基板和液体前体之间的接触,或者促使在基板和液体前体之间形成绝缘气体层的结构(例如板 与多孔基底的表面紧密间隔开)。