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    • 21. 发明授权
    • Capacitor
    • 电容器
    • US06891716B2
    • 2005-05-10
    • US10432449
    • 2001-11-20
    • Jörg-Rudolf MaierHans-Georg Keck
    • Jörg-Rudolf MaierHans-Georg Keck
    • H01G9/08H01G9/00H01G9/004H01G9/012
    • H01G9/012Y10T29/417
    • A capacitor includes an anode body, a dielectric layer adjacent to the anode body, a cathode layer adjacent to the dielectric layer, and an enclosure that substantially encloses the anode body, the dielectric layer, and the cathode body. The enclosure has an upper side and an underside and is made of a castable material. The capacitor includes an anode contact having a contact section on the underside of the enclosure, an anode conductor that connects the anode body to the anode contact, and a cathode conductor that contacts the cathode layer and that exits the enclosure. The cathode conductor is a plate having holes at a portion of the cathode conductor inside the enclosure. The holes are at least partially filled with castable material.
    • 电容器包括阳极体,与阳极体相邻的电介质层,与电介质层相邻的阴极层,以及基本上包围阳极体,电介质层和阴极体的外壳。 外壳具有上侧和下侧,并由浇注材料制成。 该电容器包括阳极接触件,该阳极接触件在外壳的下侧具有接触部分,将阳极体连接到阳极接触件的阳极导体以及接触阴极层并且离开外壳的阴极导体。 阴极导体是在外壳内的阴极导体的一部分具有孔的板。 孔至少部分地被浇注材料填充。
    • 24. 发明授权
    • Solid electrolytic capacitor array and method for manufacturing the same
    • 固体电解电容器阵列及其制造方法
    • US5926363A
    • 1999-07-20
    • US920517
    • 1997-08-29
    • Chojiro Kuriyama
    • Chojiro Kuriyama
    • H01G9/004H01G9/00H01G9/052H01G9/08H01G9/15H01L21/20H01G9/04
    • H01G9/15H01G9/26
    • A solid electrolytic capacitor array includes a substrate (12) made of conductive silicon, and an insulation film (15) which is formed with a plurality of contact holes is formed on an upper surface of the substrate. A plurality of contact layers (18) which are respectively connected to the substrate through the contact holes is formed on the insulation film. A plurality of chips each of which is a sintered unit of tantalum powder are arranged on the contact layers, respectively. A plurality of solid electrolytic layers which are respectively electrically insulated from the tantalum powder of the chips by insulation films are provided on the chips, respectively. A covering resin layer (25) covers the chips in a manner that portions of the solid electrolytic layers of the chips are respectively exposed, and cathode electrodes are formed on the covering resin layer so as to be electrically conducted to the solid electrolytic layers being exposed from the covering resin layer. An anode electrode (28) are formed on a lower surface of the substrate so as to be electrically conducted to the tantalum powder of the respective chips via the substrate and the contact layers.
    • 固体电解电容器阵列包括由导电硅制成的衬底(12),并且在衬底的上表面上形成有形成有多个接触孔的绝缘膜(15)。 在绝缘膜上形成分别通过接触孔与基板连接的多个接触层(18)。 在接触层上分别设置有多个芯片,每个芯片是钽粉末的烧结单元。 分别在芯片上分别设置多个通过绝缘膜与芯片的钽粉末电绝缘的固体电解质层。 覆盖树脂层(25)以芯片的固体电解质层的一部分分别露出的方式覆盖芯片,并且在覆盖树脂层上形成阴极电极,使其暴露于固体电解质层 从覆盖树脂层。 在基板的下表面上形成阳极电极(28),以经由基板和接触层将各个芯片的钽粉导电。
    • 25. 发明授权
    • Chip-formed solid electrolytic capacitor without an anode lead
projecting from anode member
    • 芯片形成的固体电解电容器,没有从阳极部件突出的阳极引线
    • US5654869A
    • 1997-08-05
    • US569304
    • 1995-12-08
    • Masashi OhiHiromichi TaniguchiAtushi Kobayashi
    • Masashi OhiHiromichi TaniguchiAtushi Kobayashi
    • H01G9/012H01G9/00H01G9/004H01G9/02
    • H01G9/012Y10T29/417
    • A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.
    • 一种芯片形成的固体电解电容器,其具有不向阳极部件提供突出的阳极引线的结构。 固体电解电容器通过以下方式制造:首先,在多孔电极构件的端面上浸渍诸如氟树脂的电绝缘树脂以形成绝缘树脂浸渍部分,并且将电极引线构件结合到阳极 绝缘树脂浸渍部分的部件。 在阳极部件上依次形成阳极氧化膜,固体电解质层和阴极层。 然后,施加电绝缘的外包装,使阳极部件的与安装有电极引线部件的面相对的面上的阴极层露出。 在除去电极引线部件之后,在绝缘树脂浸渍部分上形成阳极外部电极层,并且在与阳极外部电极相对的阳极部件的端面上形成与阴极层电连接的阴极外部电极层 层。
    • 27. 发明授权
    • Solid electrolytic capacitor
    • 固体电解电容器
    • US5469326A
    • 1995-11-21
    • US133342
    • 1993-10-08
    • Yasuo Kanetake
    • Yasuo Kanetake
    • H01G9/012H01G9/00H01G9/004H01G9/06H01G9/12H01G9/04
    • H01G9/012
    • Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead. The solid electrolytic capacitor prevents the capacitor element thereof from being displaced and the leads thereof from breaking, allows an easy assembling operation, and contributes to the down-scaling of a capacitor.
    • 提供了一种固体电解电容器,其包括电容器元件,从电容器元件的一个侧表面的大致中心部分延伸的内部阳极引线,电容器元件的垂直于侧表面的其他表面适于用作阴极端子壁, 连接到内部阳极引线的外部阳极引线,连接到阴极端子壁之一的外部阴极引线以及封装电容器元件的树脂模具以及与其连接的连接部分,其中连接到内部阳极的外部阳极引线 引线弯曲成在其端部处具有至少两个台阶,所述至少两个步骤的下部台阶通过绝缘材料固定到另一个阴极端壁,所述至少两个步骤的上部台阶被固定到 内部阳极引线。 固体电解电容器防止其电容器元件发生位移并且其引线断开,从而允许容易的组装操作,并且有助于电容器的缩小。