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31. 发明授权

US07656374B2 Method for enhancing response speed of hold-typed display device 有权
标题翻译：提高保持型显示设备响应速度的方法
公开(公告)号：US07656374B2
公开(公告)日：2010-02-02
申请号：US11469888
申请日：2006-09-04
申请人： Yuh-Ren Shen , Yu-Lin Lee , Chang-Cheng Lin
发明人： Yuh-Ren Shen , Yu-Lin Lee , Chang-Cheng Lin
IPC分类号： G09G3/36
CPC分类号： G09G3/3648 , G09G3/2025 , G09G3/3426 , G09G2310/0237 , G09G2310/0251 , G09G2310/061 , G09G2320/0247 , G09G2320/0252 , G09G2320/0261 , G09G2340/0435 , G09G2340/16 , G09G2360/18
摘要： The method increases the output frame rate to p/q (p, q are both natural numbers and p>q) times of the input frame rate. In a period of time equal to the least common multiple of the input and output frame times, q input frames are output and (p−q) transient frames are generated and inserted at appropriate places before or after the q input frames in the output frame sequence so as to enhance the dynamic display effect of the display device.
摘要翻译：该方法将输出帧速率提高到输入帧速率的p / q（p，q都是自然数和p> q）倍。在等于输入和输出帧时间的最小公倍数的时间段内，输出q个输入帧，并且在输出帧序列中的q个输入帧之前或之后的适当位置生成（pq）瞬态帧，并插入以增强显示装置的动态显示效果。

32. 发明申请

US20090068496A1 LED STRUCTURE 审中-公开
标题翻译： LED结构
公开(公告)号：US20090068496A1
公开(公告)日：2009-03-12
申请号：US11852461
申请日：2007-09-10
申请人： Liann-Be Chang , Chin-Huai Young , Yu-Lin Lee
发明人： Liann-Be Chang , Chin-Huai Young , Yu-Lin Lee
IPC分类号： B32B9/00
CPC分类号： H01L33/44
摘要： The present invention discloses an improved LED structure and comprises: a circuit brace, a bowl member; a light chip; a welding line; a packing mask; and a photocatalystic agent. The volume of an LED is smaller so as to be convenient for installment. Compared the present invention to a light tube with same power, the present invention can be added several LEDs in order to increase the curve surface area to contact air, so that the functions of disinfection, deodorization, and mildewproof can be effectively achieved.
摘要翻译：本发明公开了一种改进的LED结构，包括：电路支架，碗状部件; 一个灯芯片; 焊接线; 包装面膜; 和光催化剂。 LED的体积较小，便于安装。将本发明与具有相同功率的光管相比，本发明可以添加几个LED，以增加曲面接触空气的面积，从而可以有效地实现消毒，除臭和防霉功能。

33. 发明申请

US20070075945A1 Method for reducing time lapse of consecutive scan of LCD pixel 有权
标题翻译：减少LCD像素连续扫描时间的方法
公开(公告)号：US20070075945A1
公开(公告)日：2007-04-05
申请号：US11241184
申请日：2005-09-30
申请人： Yuh-Ren Shen , Yu-Lin Lee , Chang-Cheng Lin
发明人： Yuh-Ren Shen , Yu-Lin Lee , Chang-Cheng Lin
IPC分类号： G09G3/36
CPC分类号： G09G3/3666 , G09G2310/0205 , G09G2310/0208 , G09G2310/0221 , G09G2310/06 , G09G2320/0252
摘要： A double-frame-rate method for reducing the time lapse of a LCD pixel between its two consecutive scans within a frame is provided. The method horizontally partitions the scan lines into (k) non-overlapping regions, each containing m1, m2, . . . , mk scan lines. The method then scans each of the regions twice before continuing to the next region and, as such, completes two passes of scanning of the entire frame. For a pixel in a region (j), the time lapse between the pixel's two consecutive scans during the frame's frame time is (mj/n) of the time lapse of conventional double-frame-rate methods.
摘要翻译：提供了一种用于在帧内减少其两次连续扫描之间的LCD像素的时间流逝的双帧速率方法。该方法将扫描线水平地划分为（k）个非重叠区域，每个区域包含m 1，m 2 2。。。，扫描线。然后，该方法在继续到下一个区域之前扫描每个区域两次，并且因此完成整个帧的扫描的两个遍。对于区域（j）中的像素，在帧的帧时间期间像素的两次连续扫描之间的时间流逝是常规双帧率方法的时间流逝的（m / j / n / n）。

34. 发明授权

US09241378B2 Hybrid constant current LED lamp 有权
标题翻译：混合恒流LED灯
公开(公告)号：US09241378B2
公开(公告)日：2016-01-19
申请号：US14205782
申请日：2014-03-12
申请人： Yu-Lin Lee
发明人： Yu-Lin Lee , Kuo- Chung Huang
IPC分类号： H05B37/02 , H05B33/08
CPC分类号： H05B33/0815 , H05B37/02
摘要： The present invention relates to a hybrid constant current LED lamp. The LED lamp includes a rectifier unit, a filter circuit, a switching mode power supply, at least one main LED and a subsidiary LED. The main LED is electrically connected in series to the output terminal of the rectifier unit and the input port of the primary-side circuit of the switching mode power supply. The subsidiary LED is connected to the secondary-side circuit. The invention not only provides circuit architecture capable of providing a constant current, but also improves the power efficiency of the lamp.
摘要翻译：本发明涉及混合型恒流LED灯。 LED灯包括整流器单元，滤波器电路，开关模式电源，至少一个主LED和辅助LED。主LED与整流器单元的输出端子和开关模式电源的初级侧电路的输入端口串联电连接。辅助LED连接到次级侧电路。本发明不仅提供能够提供恒定电流的电路架构，而且还提高了灯的功率效率。

35. 发明授权

US09000326B2 Apparatus for laser processing 有权
标题翻译：激光加工设备
公开(公告)号：US09000326B2
公开(公告)日：2015-04-07
申请号：US13194958
申请日：2011-07-31
申请人： Yu-Lin Lee , Yung-Hsiang Huang , Tai-Wei Wu , Shun-Han Yang , Gong-Qian Wang
发明人： Yu-Lin Lee , Yung-Hsiang Huang , Tai-Wei Wu , Shun-Han Yang , Gong-Qian Wang
IPC分类号： B23K26/00 , B23K26/06 , G09G3/00 , B28B17/00 , B23K26/08 , B23K26/38 , B23K26/40 , H01S3/223
CPC分类号： B23K26/0869 , B23K26/0622 , B23K26/384 , B23K26/389 , B23K2103/42 , B23K2103/50 , H01S3/2232
摘要： An apparatus for laser processing a board is provided. The apparatus for laser processing a board includes a chip, a laser, a modulating device and a focus device. The chip receives a first frequency signal to generate a second frequency signal. The laser receives the first frequency signal to emit a first laser beam. The modulating device receives the second frequency signal and the first laser beam, and adjusts the first laser beam to emit a second laser beam. The focus device focuses the second laser beam to emit a third laser beam onto the board for forming plural dots on the board.
摘要翻译：提供了一种激光加工板的设备。用于激光加工板的装置包括芯片，激光器，调制装置和聚焦装置。芯片接收第一频率信号以产生第二频率信号。激光器接收第一频率信号以发射第一激光束。调制装置接收第二频率信号和第一激光束，并调节第一激光束以发射第二激光束。聚焦装置将第二激光束聚焦到板上以在板上形成多个点的第三激光束。

36. 发明申请

US20080105962A1 CHIP PACKAGE 审中-公开
标题翻译：芯片包装
公开(公告)号：US20080105962A1
公开(公告)日：2008-05-08
申请号：US11833716
申请日：2007-08-03
申请人： Yu-Lin Lee , Gwo-Liang Weng
发明人： Yu-Lin Lee , Gwo-Liang Weng
IPC分类号： H01L23/02
CPC分类号： H01L25/03 , H01L24/73 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/00012 , H01L2924/00
摘要： A chip package and a process thereof are provided. The chip package includes a first package unit and a second package unit. The first package unit includes a carrier; a chip, disposed on the carrier and electrically connected thereto; a first encapsulant, disposed on the carrier and covering the chip; an interposer, disposed on the first encapsulant, having a plurality of pads thereon, and electrically connected to the carrier; a plurality of conducting elements, respectively disposed on the pads; and a second encapsulant, covering the surface of the carrier, encapsulating the chip, the first encapsulant, the interposer, and the conducting elements, and exposing the top of each conducting element. The second package unit is disposed on the first package unit, and electrically connected to the interposer through the conducting elements.
摘要翻译：提供了芯片封装及其工艺。芯片封装包括第一封装单元和第二封装单元。第一包装单元包括载体; 芯片，设置在载体上并与其电连接; 第一密封剂，设置在载体上并覆盖芯片; 布置在所述第一密封剂上的插入件，其上具有多个焊盘，并且电连接到所述载体; 分别设置在所述垫上的多个导电元件; 以及第二密封剂，其覆盖所述载体的表面，封装所述芯片，所述第一密封剂，所述插入件和所述导电元件，以及暴露每个导电元件的顶部。第二封装单元设置在第一封装单元上，并通过导电元件电连接到插入器。

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