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    • 32. 发明授权
    • Method for making a thin film inductive write head having a pedestal
pole tip and an electroplated gap
    • 用于制造具有基座极端和电镀间隙的薄膜感应写头的方法
    • US5901432A
    • 1999-05-11
    • US997957
    • 1997-12-24
    • Michael ArmstrongDavid HeimRichard HsiaoNeil Leslie RobertsonHugo Alberto Emilio Santini
    • Michael ArmstrongDavid HeimRichard HsiaoNeil Leslie RobertsonHugo Alberto Emilio Santini
    • G11B5/31G11B5/39G11B5/127
    • G11B5/3967G11B5/3116G11B5/3163Y10T29/49044Y10T29/49046Y10T29/49052
    • A method for making a merged thin film read/write head, where the first pole piece includes a pedestal or pole tip portion that extends up from the first pole piece layer, uses electroplating to form the gap so that the gap layer does not have to be removed later. After the first pole piece is deposited, the coil insulation structure is built over the first pole piece. Afterwards an electrically conductive seed layer of the same ferromagnetic material as the first pole piece is formed over the wafer to provide an electrically conductive path for subsequent electroplating. After the seed layer deposition, a photoresist pattern is then formed to define the shape of the second pole piece. Nonmagnetic nickel-phosphorous is then electroplated onto the seed layer in the region not covered by the photoresist pattern to form the gap layer. The second ferromagnetic layer is then electroplated onto the gap layer to define the shape of the second pole piece. The thickness of the second pole piece layer is deliberately made thicker than the desired final thickness because the second pole piece layer is used as a mask for subsequent ion beam milling to form the notched pole tip element of the first pole piece. The photoresist is removed and ion beam milling performed to remove the seed layer and a portion of the first pole piece layer to define the pedestal pole tip element of the first pole piece. The ion beam milling does not have to remove the gap layer because the electroplated gap has been defined by the photoresist pattern to have the desired trackwidth.
    • 一种制造合并薄膜读/写头的方法,其中第一极片包括从第一极片层向上延伸的基座或极尖部分,使用电镀形成间隙,使得间隙层不必 稍后删除 在第一极片沉积之后,线圈绝缘结构被构建在第一极片上。 之后,在晶片上形成与第一极片相同的铁磁材料的导电种子层,以提供用于随后电镀的导电路径。 在种子层沉积之后,然后形成光刻胶图案以限定第二极片的形状。 然后将非磁性镍磷电镀在未被光致抗蚀剂图案覆盖的区域中的种子层上以形成间隙层。 然后将第二铁磁层电镀到间隙层上以限定第二极靴的形状。 由于第二极片层用作后续离子束铣削的掩模以形成第一极靴的切口极端部元件,所以第二极靴层的厚度被故意地制造得比期望的最终厚度更厚。 去除光致抗蚀剂,进行离子束研磨以除去种子层和第一极片层的一部分,以限定第一极片的基座极端部元件。 离子束铣削不必去除间隙层,因为电镀间隙已由光致抗蚀剂图案限定以具有期望的轨道宽度。