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31. 发明授权

US11357112B2 Molded interconnect device 有权
公开(公告)号：US11357112B2
公开(公告)日：2022-06-07
申请号：US16315244
申请日：2017-07-05
申请人： Molex, LLC
发明人： Tsuey Choo Chang , Steven Zeilinger , Hyun-Jong Ko , Patrick Riley , SukMin Kang
IPC分类号： H01R43/00 , H05K3/00 , H05K1/02 , H05K1/03 , H05K3/02 , H05K3/24 , H05K3/42
摘要： In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.

32. 发明申请

US20220146934A1 PHOTOSENSITIVE FIBER-FORMING COMPOSITION AND METHOD FOR FORMING FIBER PATTERN 有权
公开(公告)号：US20220146934A1
公开(公告)日：2022-05-12
申请号：US17429489
申请日：2020-01-16
申请人： TOYAMA PREFECTURE , NISSAN CHEMICAL CORPORATION
发明人： Yoshiyuki YOKOYAMA , Takahiro KISHIOKA
IPC分类号： G03F7/039 , G03F7/09 , D01F6/36 , D01F6/34 , G03F7/20 , H05K3/02
摘要： A method for producing a metal pattern by processing a substrate having on its surface a metal layer with a photosensitive fiber having a specific composition, a method for producing a metal pattern, and a composition for producing the photosensitive fiber. The photosensitive fiber contains a positive photosensitive material. The positive photosensitive material may contain a novolac resin, etc. The method for producing a metal pattern includes a first step of forming a fiber layer of photosensitive resin on a substrate having on its surface a metal layer; a second step of exposing the fiber layer to light via a mask; a third step of developing the fiber layer with a developer to thereby form a photosensitive fiber pattern; and a fourth step of etching the metal layer with an etchant and removing the photosensitive fiber, to thereby form a network metal pattern.

33. 发明授权

US11291126B2 Circuit board and method of manufacturing circuit board 有权
公开(公告)号：US11291126B2
公开(公告)日：2022-03-29
申请号：US17022385
申请日：2020-09-16
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Jun Dai
IPC分类号： H05K1/00 , H05K1/02 , H05K1/09 , H05K1/11 , H05K1/18 , H05K3/02 , H05K3/06 , H05K3/28 , H05K3/46 , H05K1/03 , H05K3/18 , H05K3/00
摘要： A circuit board includes a substrate, a first circuit layer, a second circuit layer, and a third circuit layer. The substrate includes a base layer, a first metal layer formed on the base layer, and a seed layer formed on the first metal layer. The first circuit layer is located on the substrate and includes the first metal layer and a signal layer formed on a surface of the first metal layer. The second circuit layer is coupled to the first circuit layer and includes the first metal layer, the seed layer, and a connection pillar formed on a surface of the first metal layer and the seed layer. The third circuit layer is coupled to the second circuit layer and includes the seed layer and a coil formed on a surface of the seed layer.

34. 发明授权

US11287648B2 Inconspicuous near-eye electrical circuits 有权
公开(公告)号：US11287648B2
公开(公告)日：2022-03-29
申请号：US17144936
申请日：2021-01-08
申请人： Facebook Technologies, LLC
发明人： Karol Constantine Hatzilias , Robin Sharma , Christopher Yuan Ting Liao , Andrew Ouderkirk
IPC分类号： G02B27/00 , H05K1/02 , H05K1/09 , H05K3/02 , H05K1/18 , G02B27/01 , H05K1/11 , H05K3/12
摘要： A near-eye optic includes a substrate having a clear aperture for propagating light. An inconspicuous electrical circuit is supported by the substrate in the clear aperture of the substrate. The inconspicuous electrical circuit includes a plurality of inconspicuous conductive traces disposed in an inconspicuous pattern and electrically coupled to a plurality of inconspicuous electrical components. The inconspicuous pattern may include e.g. an asymmetric pattern, an aperiodic pattern, a pseudo-random pattern, a meandering pattern, a periodic pattern modulated with pseudo-random perturbations, or a non-rectangular pattern modulated with pseudo-random perturbations.

35. 发明授权

US11284519B2 Electronic board comprising SMDS soldered on buried solder pads 有权
公开(公告)号：US11284519B2
公开(公告)日：2022-03-22
申请号：US16630364
申请日：2018-07-13
申请人： SAFRAN ELECTRONICS & DEFENSE
发明人： Denis Lecordier , Philippe Chocteau
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/02 , H05K3/04 , H05K3/06 , H05K3/18 , H05K3/28 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/46 , H01L21/02 , H01L21/44 , H01L21/48 , H01L21/58 , H01L21/60 , H01L23/00 , H01L23/04 , H01L23/13 , H01L23/14 , H05K3/12
摘要： The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).

36. 发明申请

US20210392749A1 METAL FOIL WITH CARRIER AND PREPARATION METHOD THEREOF 有权
公开(公告)号：US20210392749A1
公开(公告)日：2021-12-16
申请号：US17289417
申请日：2019-11-06
申请人： GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
发明人： Zhi SU
IPC分类号： H05K1/09 , H05K3/02 , C23F17/00
摘要： A metal foil that has a carrier and a preparation method thereof. The metal foil with a carrier comprises a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping lay, and the metal foil layer are sequentially stacked, or the carrier layer, the striping layer, the barrier layer, and the metal foil layer are sequentially stacked. The diffusion depth of the carrier layer to the metal foil layer is less than or equal to 3 μm and the diffusion depth of the metal foil layer toward the carrier layer is less than or equal to 3 μm at a temperature of 20-400° C. By setting the barrier layer, the carrier layer and the metal foil layer are prevented from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off

37. 发明申请

US20210382581A1 TOUCH SENSOR WITH AUXILIARY CONDUCTIVE UNIT ON TRANSPARENT ELECTRODE 有权
公开(公告)号：US20210382581A1
公开(公告)日：2021-12-09
申请号：US17408418
申请日：2021-08-21
申请人： Chih-Chiang Pai , Meng-Kuei Lin , Hung-Chi Huang
发明人： Chih-Chiang Pai , Meng-Kuei Lin , Hung-Chi Huang
IPC分类号： G06F3/044 , H05K3/02 , H05K3/06 , G06F3/046
摘要： A touch sensor includes a substrate, a first touch conductive layer (TCL), a first auxiliary conductive layer (ACL), a second touch conductive layer, and a second auxiliary conductive layer. The first TCL has a first touch conductive trail pattern (TCTP). The first ACL has a lower sheet resistance than the first TCL and a first auxiliary conductive trail pattern (ACTP). The second TCL has a second TCTP. The second ACL has a lower sheet resistance than the second touch conductive layer and a second ACTP. The first and second TCTPs and the first and second ACTPs jointly constitute a touch sensor.

38. 发明授权

US11191168B2 Method of manufacturing composite circuit board and composite circuit board 有权
公开(公告)号：US11191168B2
公开(公告)日：2021-11-30
申请号：US17030521
申请日：2020-09-24
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Yang Li , Yan-Lu Li
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/06 , H05K3/10 , H05K3/36 , H05K3/46 , H01L21/02 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/56 , H01L21/68 , H01L23/02 , H01L23/12 , H01L23/14 , H01L23/24 , H01L23/34 , H01L23/48 , H01L23/52 , H01L23/498 , H05K3/34 , H05K3/32 , H05K3/00 , H05K3/02
摘要： A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

39. 发明授权

US11186918B2 Micro-roughened electrodeposited copper foil and copper clad laminate using the same 有权
公开(公告)号：US11186918B2
公开(公告)日：2021-11-30
申请号：US16672860
申请日：2019-11-04
申请人： CO-TECH DEVELOPMENT CORP.
发明人： Yun-Hsing Sung
IPC分类号： C25D7/04 , C25D1/04 , H05K3/02 , B32B15/08 , C25D3/38 , B32B15/20 , H05K3/38
摘要： The present disclosure provides a micro-rough electrolytic copper foil and a copper clad laminate. The electrolytic copper foil has a micro-rough surface formed with mountain-shaped structures and recessed structures. A multiplication value of an arithmetic mean height (Sa) and a vertex density (Spd) of the mountain-shaped structures measured according to ISO 25178 is between 150000 μm/mm2 and 400000 μm/mm2. An arithmetic mean undulation (Wa) of the mountain-shaped structures measured according to JIS B0601:2001 is between 0.06 μm and 1.5 μm. Therefore, the electrolytic copper foil with good binding strength and electrical properties can be obtained.

40. 发明申请

US20210321515A1 COMPOSITE METAL FOIL AND PREPARATION METHOD THEREOF 有权
公开(公告)号：US20210321515A1
公开(公告)日：2021-10-14
申请号：US17309059
申请日：2019-11-06
申请人： GUANGZHOU FANGBANG ELECTRONIC CO., LTD.
发明人： Zhi Su
IPC分类号： H05K1/03 , H05K1/11 , H05K1/09 , H05K3/02
摘要： A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.

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