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41. 发明授权

US08238113B2 Electronic module with vertical connector between conductor patterns 有权
标题翻译：导体图案之间具有垂直连接器的电子模块
公开(公告)号：US08238113B2
公开(公告)日：2012-08-07
申请号：US12842052
申请日：2010-07-23
申请人： Antti Iihola , Petteri Palm
发明人： Antti Iihola , Petteri Palm
IPC分类号： H05K1/18 , H05K7/00
CPC分类号： H05K3/4046 , H01L21/4828 , H01L21/568 , H01L23/49827 , H01L23/49838 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/0401 , H01L2224/04105 , H01L2224/16245 , H01L2224/32145 , H01L2224/73267 , H05K1/188 , H05K2201/10378 , H05K2201/10674 , H05K2201/2018
摘要： The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more.
摘要翻译：本发明一般涉及一种与电子模块如印刷电路板和半导体封装基板一起使用的新结构。此外，在此提出了制造该方法。根据本发明的一个方面，通孔的纵横比显着提高。长宽比测量通孔或微通孔导体在高度分割宽度方向上的关系。根据本发明的方面，可以将现有技术方案的纵横比提高10倍以上。

42. 发明申请

US20120048605A1 METHOD FOR CONTROLLING WARPAGE WITHIN ELECTRONIC PRODUCTS AND AN ELECTRONIC PRODUCT 有权
标题翻译：用于控制电子产品和电子产品中的WARPAGE的方法
公开(公告)号：US20120048605A1
公开(公告)日：2012-03-01
申请号：US12872538
申请日：2010-08-31
申请人： Kwan Sik CHUNG
发明人： Kwan Sik CHUNG
IPC分类号： H05K1/16 , H05K1/00 , H05K3/10
CPC分类号： H05K1/188 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L2224/24 , H01L2924/3511 , H05K3/4626 , H05K2201/09136 , H05K2203/063 , Y10T29/49126 , Y10T29/49155
摘要： The present invention discloses a method for minimizing warpage in the electronic products, and the structures of such electronic products as well. Groove holes are formed into the insulating material layer or several layers. The groove holes can be processed by laser drilling or by other suitable means. A cured epoxy adhesive will fill the groove holes after the heat and pressure treatment performed to the circuit structure. The electronic product may contain several insulating layers and embedded electronic components connected to a wiring layer. A double-stacked symmetrical structure can also be manufactured. Asymmetrical structures with different sized embedded components can be handled as well. The groove holes can be shaped as straight short lines, ellipses, crosses, circles etc, or as any combination of different shapes. The groove holes can be scratched so that they locate outside strips, between the strips of a panel, between blocks of the strip, between modules of the block or between embedded components of the module.
摘要翻译：本发明公开了一种使电子产品中的翘曲最小化以及这种电子产品的结构的方法。凹槽形成绝缘材料层或几层。槽孔可以通过激光钻孔或其他合适的方式加工。在对电路结构进行热和压力处理后，固化的环氧树脂粘合剂将填充凹槽。电子产品可以包含几个绝缘层和连接到布线层的嵌入式电子部件。也可以制造双层对称结构。也可以处理不同大小的嵌入式组件的非对称结构。槽孔可以形成为直线短线，椭圆形，十字形，圆形等，也可以是不同形状的任何组合。凹槽可以被划伤，使得它们定位在条带之间，面板条之间，条带的块之间，块的模块之间或模块的嵌入部件之间。

43. 发明授权

US07989944B2 Method for embedding a component in a base 有权
标题翻译：在基础中嵌入组件的方法
公开(公告)号：US07989944B2
公开(公告)日：2011-08-02
申请号：US11878557
申请日：2007-07-25
申请人： Risto Tuominen
发明人： Risto Tuominen
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H05K1/0218 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/24137 , H01L2224/24227 , H01L2224/82039 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , H05K1/185 , H05K1/188 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4652 , H05K2201/09981 , H05K2201/10674 , H05K2203/061 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： A method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base, when part of the base structure is, as it were, manufactured around the semiconductor components. Through-holes for the semiconductor components are made in the base, in such a way that the holes extend between the first and second surface of the base. After the making of the holes, a polymer film is spread over the second surface of the base structure, in such a way that the polymer film also covers the through-holes made for the semiconductor components from the side of the second surface of the base structure. Before the hardening, or after the partial hardening of the polymer film, the semiconductor components are placed in the holes made in the base, from the direction of the first surface of the base. The semiconductor components are pressed against the polymer film in such a way that they adhere to the polymer film.
摘要翻译：一种方法，其中形成电子电路的一部分的半导体部件或其至少一部分的半导体部件在基体的制造期间嵌入基板（例如电路板）中，当基部结构的一部分为它是在半导体元件周围制造的。用于半导体部件的通孔在基座中以这样的方式制成，使得孔在基部的第一和第二表面之间延伸。在制作孔之后，将聚合物膜分散在基底结构的第二表面上，使得聚合物膜也从基底的第二表面的一侧覆盖由半导体部件制成的通孔结构体。在硬化之前或在聚合物膜部分硬化之后，将半导体部件从基底的第一表面的方向放置在基底中制成的孔中。将半导体部件压在聚合物膜上，使得它们粘附到聚合物膜上。

44. 发明申请

US20100202114A1 ELECTRIC MODULE 有权
标题翻译：电动模块
公开(公告)号：US20100202114A1
公开(公告)日：2010-08-12
申请号：US12699628
申请日：2010-02-03
申请人： Risto Tuominen , Petteri Palm
发明人： Risto Tuominen , Petteri Palm
IPC分类号： H05K7/00
CPC分类号： H01L23/5389 , H01L23/5385 , H01L23/544 , H01L23/552 , H01L24/19 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/0652 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/18 , H01L2224/2919 , H01L2224/32245 , H01L2224/7565 , H01L2224/7665 , H01L2224/82039 , H01L2224/83005 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H05K1/188 , H05K3/025 , H05K3/4611 , H05K2201/0355 , H01L2924/00
摘要： An electronic module, comprising: a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; at least one component inside the insulating-material layer, the at least one component comprising a first surface and contact zones on the first surface; a first hardened adhesive layer on the first surface of the at least one component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer.
摘要翻译：一种电子模块，包括：导电图案层; 支撑导电图案层的绝缘材料层; 所述绝缘材料层内的至少一个部件，所述至少一个部件包括第一表面和所述第一表面上的接触区域; 在所述至少一个部件的第一表面上的第一硬化粘合剂层; 与导电图案层和第一硬化粘合剂层接触的第二硬化粘合剂层; 在接触区的位置处的第一和第二硬化粘合剂层中的孔; 和孔中的导电材料，并与元件和导电图案层的接触区电连接。

45. 发明授权

US07719851B2 Electronics module and method for manufacturing the same 有权
标题翻译：电子模块及其制造方法
公开(公告)号：US07719851B2
公开(公告)日：2010-05-18
申请号：US11587586
申请日：2005-04-27
申请人： Risto Tuominen , Antti Iihola
发明人： Risto Tuominen , Antti Iihola
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L23/3677 , H01L24/25 , H01L24/82 , H01L25/0652 , H01L2224/04105 , H01L2224/16 , H01L2224/18 , H01L2224/2518 , H01L2224/32245 , H01L2224/82039 , H01L2224/82047 , H01L2224/83005 , H01L2224/83132 , H01L2224/83192 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H05K1/0206 , H05K1/188 , H05K3/4046 , H05K3/4611 , Y10T29/49128 , Y10T29/49139 , Y10T29/49147 , Y10T29/49204 , Y10T29/49218 , H01L2924/00
摘要： This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7′), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.
摘要翻译：该出版物公开了一种电子模块及其制造方法。电子模块包括嵌入在绝缘材料层（1）中的至少一个部件（6），其具有第一接触表面，其中存在第一接触端子（7），部件（6）从该第一接触表面电连接到包含在电子模块中的导体结构。另外，组件（6）具有与第一接触表面相对的第二接触表面，其中存在至少一个第二接触端子（7'），部件（6）从该接触端子电连接到包含的导体结构在电子模块中。借助于本发明，可以实现与现有技术相比节省空间的电子模块结构。

46. 发明授权

US07663215B2 Electronic module with a conductive-pattern layer and a method of manufacturing same 有权
标题翻译：具有导电图案层的电子模块及其制造方法
公开(公告)号：US07663215B2
公开(公告)日：2010-02-16
申请号：US10550023
申请日：2004-03-31
申请人： Risto Tuominen , Petteri Palm
发明人： Risto Tuominen , Petteri Palm
IPC分类号： H01L23/02 , H01L21/00 , H05K3/34 , H01K3/10 , H01L23/48
CPC分类号： H01L23/544 , H01L23/5389 , H01L24/19 , H01L25/0652 , H01L2223/54426 , H01L2223/54473 , H01L2224/04105 , H01L2224/20 , H01L2224/32245 , H01L2224/83005 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/01327 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/3025 , H01L2924/3511 , H05K1/188 , H05K3/4611 , H01L2924/00
摘要： This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.
摘要翻译：该出版物公开了一种用于制造电子模块的电子模块和方法，其中将组件（6）胶合（5）到导电层的表面，稍后形成导电层导电图案（14）。在粘合组件（6）之后，在导电层的表面上形成或附着到导电层的表面上的围绕附着在导电层上的部件（6）的绝缘材料层（1）。在组件（6）的胶合之后，还制成馈通，通过它可以在导电层和部件的接触区域（7）之间形成电接触。此后，导电图案（14）由导电层制成，其表面部件（6）被胶合。

47. 发明授权

US07299546B2 Method for manufacturing an electronic module 有权
标题翻译：电子模块的制造方法
公开(公告)号：US07299546B2
公开(公告)日：2007-11-27
申请号：US10546820
申请日：2004-02-25
申请人： Risto Tuominen , Petteri Palm
发明人： Risto Tuominen , Petteri Palm
IPC分类号： H05K3/34
CPC分类号： H05K1/188 , H01L21/4857 , H01L21/486 , H01L23/13 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/20 , H01L2225/1035 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01055 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H01L2924/3511 , H05K3/4611 , H05K3/4691 , Y10T29/49121 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T29/49169 , H01L2924/00
摘要： An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the to which the component (6) is attached.
摘要翻译：一种电子模块和一种电子模块的制造方法，其中使用安装基座，其在绝缘材料层的表面上包括绝缘材料层（1）和导电层。导电层还覆盖部件（6）的安装空腔。将部件（6）设置在安装空腔中，使得接触区面向导电层，并且在部件（6）和导电层的接触区之间形成电接触。之后，导电图案（14）由组件（6）所附着的导电层形成。

48. 发明申请

US20070227761A1 Heat Conduction From an Embedded Component 有权
标题翻译：嵌入式组件的热传导
公开(公告)号：US20070227761A1
公开(公告)日：2007-10-04
申请号：US11587694
申请日：2005-04-27
申请人： Risto Tuominen , Petteri Palm
发明人： Risto Tuominen , Petteri Palm
IPC分类号： H01R43/00 , H05K1/00
CPC分类号： H05K1/188 , H01L21/568 , H01L23/3677 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0652 , H01L2224/04105 , H01L2224/32245 , H01L2224/82039 , H01L2224/83005 , H01L2224/83132 , H01L2224/83192 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01061 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H05K1/0206 , H05K3/4611 , Y10T29/49117 , H01L2924/00
摘要： This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).
摘要翻译：该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

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