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    • 60. 发明授权
    • Electrochemical photoetching of compound semiconductors
    • 化学半导体的电化学光刻
    • US4414066A
    • 1983-11-08
    • US416472
    • 1982-09-10
    • Stephen R. ForrestPaul A. KohlRichard L. Panock
    • Stephen R. ForrestPaul A. KohlRichard L. Panock
    • C25F3/12H01L21/3063H01L21/465H01L21/467
    • H01L21/467C25F3/12H01L21/30635H01L21/465
    • A procedure is described for electrochemically photoetching n-type and intrinsic compound semiconductors. The process involves applying a potential to the compound semiconductor while it is in contact with an electrolytic solution and irradiating the surface to be etched with light in a certain energy range. By suitable adjustment in the potential, electrolytic solution composition and light energy, the etch rate is made proportional to the light intensity. By suitable variation in light intensity and light-ray direction, various geometrical features can be made on the surface of the compound semiconductor. For example, a hole with straight sides can be made in the compound semiconductor by use of a light spot and parallel (collimated) light rays. An advantageous application of this process is the fabrication of a photodiode with a hole in the center for use in bidirectional communication systems and to monitor power output for optical communication sources. The advantage of this process is that no damage occurs outside etched hole so that a maximum area of the photodiode remains active for detecting incoming radiation. Another advantage of the process is that etching will stop where the material becomes p-type so that etching can be made to stop automatically at a p/n junction.
    • 描述了用于电化学光刻n型和本征化合物半导体的方法。 该方法包括在化合物半导体与电解液接触的同时施加电位,并在一定的能量范围内用光照射被蚀刻的表面。 通过适当调整电位,电解液组成和光能,刻蚀速率与光强成正比。 通过适当的光强度和光线方向的变化,可以在化合物半导体的表面上形成各种几何特征。 例如,可以通过使用光点和平行(准直)光线在化合物半导体中制造具有直边的孔。 该方法的有利应用是制造在中心具有用于双向通信系统的孔的光电二极管,并监视光通信源的功率输出。 该方法的优点是在蚀刻孔外部不产生损伤,使得光电二极管的最大面积保持活跃以检测入射辐射。 该方法的另一个优点是,在材料变为p型的情况下,蚀刻将停止,使得蚀刻可以在p / n结处自动停止。