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    • 60. 发明申请
    • PHOTOSENSITIVE SILICONE RESIN COMPOSITION
    • 感光硅树脂组合物
    • US20130158148A1
    • 2013-06-20
    • US13816657
    • 2011-06-15
    • Natsumi TsuganeHideo SaitoToru KusakabeMotonori Nakamichi
    • Natsumi TsuganeHideo SaitoToru KusakabeMotonori Nakamichi
    • C08L83/00
    • C08L83/00C08F299/08C08G77/14C08G77/20C08K5/0025C08K9/06G03F7/0047G03F7/0757C08L83/04C08L83/06
    • Provided is a resin composition which gives a cured product of a photocurable resin having excellent crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R1n1SiX14-n1 (wherein R1, n1 and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si—O—Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0
    • 提供一种树脂组合物,其即使形成为厚膜也能获得具有优异的抗裂性的光固化性树脂的固化物,并且能够维持低的线性热膨胀系数,低热重量损失和低固化收缩率。 该感光性有机硅树脂组合物含有(A)含有二氧化硅颗粒的缩合反应产物和(B)光聚合引发剂,其特征在于含二氧化硅颗粒的缩合反应产物(A)是聚硅氧烷化合物 (a)包含由以下通式(1)表示的一种或多种硅烷化合物的水解缩合产物:R1n1SiX14-n1(其中R1,n1和X1定义在权利要求中)和/或硅烷化合物和二氧化硅颗粒 (b)所示,并且具有满足下式(2)的端基结构Si-OY(其中Y在权利要求中限定):0 <[Si-O-SiR33] /([Si-O-R2] + [ Si-O-SiR 33])@ 1(其中,R 2和R 3在权利要求中定义),并具有光聚合官能团。