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51. 发明公开

US20240003826A1 SEMICONDUCTOR INSPECTION TOOL SYSTEM AND METHOD FOR WAFER EDGE INSPECTION 审中-公开
公开(公告)号：US20240003826A1
公开(公告)日：2024-01-04
申请号：US18216162
申请日：2023-06-29
申请人： CAMTEK LTD
发明人： Carmel Yehuda DRILLMAN , Moshe EDRI , Menachem REGENSBURGER , Baheej BATHISH , Mordi DAHAN
IPC分类号： G01N21/95 , G01N21/88
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2021/8825 , H01L22/12
摘要： A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

52. 发明授权

US11852465B2 Wafer inspection method and apparatus thereof 有权
公开(公告)号：US11852465B2
公开(公告)日：2023-12-26
申请号：US17585552
申请日：2022-01-27
申请人： GlobalWafers Co., Ltd.
发明人： Shang-Chi Wang , Miao-Pei Chen , Han-Zong Wu , Chia-Chi Tsai , I-Ching Li
IPC分类号： G01B11/30 , G01N21/95 , G01N21/93
CPC分类号： G01B11/303 , G01N21/93 , G01N21/9501
摘要： The disclosure provides a wafer inspection method and wafer inspection apparatus. The method includes: receive scanning information of at least one wafer, wherein the scanning information includes a plurality of haze values; the scanning information is divided into a plurality of information blocks according to the unit block, and the feature value of each of the plurality of information blocks is calculated according to the plurality of haze values included in each of the plurality of information blocks; and converting the feature value into a color value according to the haze upper threshold and the haze lower threshold, generating the color value corresponding to the at least one wafer according to the converted color value according to the feature value, whereby the color graph displays the texture content of the at least one wafer.

53. 发明公开

US20230411223A1 SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：US20230411223A1
公开(公告)日：2023-12-21
申请号：US17826318
申请日：2022-05-27
申请人： Taiwan Semiconductor Manufacturing Company
发明人： Shih-Chang Wang , Hsiu-Hui Huang , Hung-Yi Chung , Chien-Huei Chen , Xiaomeng Chen
IPC分类号： H01L21/66 , G01N21/95
CPC分类号： H01L22/12 , G01N21/9505
摘要： A method of qualifying semiconductor wafer processing includes: illuminating a semiconductor wafer simultaneously with source light having wavelengths in a plurality of wavebands, including at least a first waveband and a second waveband, the second waveband being different from the first waveband; separating light reflected from the semiconductor wafer as a result of said illuminating, the separating dividing the reflected light according to waveband; generating a first image of the semiconductor wafer based on reflected light separated into the first waveband; and, generating a second image of the semiconductor wafer base on reflected light separated into the second waveband.

54. 发明公开

US20230400418A1 PHOTOLUMINESCENCE MEASUREMENT DEVICE 审中-公开
公开(公告)号：US20230400418A1
公开(公告)日：2023-12-14
申请号：US18249454
申请日：2021-10-20
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
发明人： Renaud VARACHE , Patrick Jeremy DAHAN
IPC分类号： G01N21/95 , H02S50/15 , G01N21/956 , G01N21/64
CPC分类号： G01N21/9505 , H02S50/15 , G01N21/956 , G01N21/6489 , G01N2021/646 , G01N2021/8461
摘要： A photoluminescence measurement device may include: a sample holder; a detector configured to collect a photoluminescence signal; a processing unit configured to process a signal collected by the detector; and a support disposed facing a rear face of the sample holder, opposite to the front face, and on one face, called the main face, of which rests at least one radiation source for emitting light radiation illuminating the rear face and likely to be collected, by transparency of the sample holder with respect to the light radiation, by the detector.

55. 发明公开

US20230398641A1 DETECTION METHOD OF RESISTIVITY AND PROCESSING METHOD OF PLATE-SHAPED WORKPIECE 审中-公开
公开(公告)号：US20230398641A1
公开(公告)日：2023-12-14
申请号：US18327146
申请日：2023-06-01
申请人： DISCO CORPORATION
发明人： Atsushi UEKI
IPC分类号： B23K31/12 , G01N21/95
CPC分类号： B23K31/12 , G01N21/9501 , B23K2101/40
摘要： A detection method of resistivity is a detection method of resistivity in which resistivity of a plate-shaped workpiece having a back surface and a front surface on a side opposite to the back surface is detected. The detection method includes an interference waveform acquisition step of irradiating the back surface of the plate-shaped workpiece with light from a light source and acquiring an interference waveform between light reflected by the back surface and light that has been transmitted through the back surface and been reflected by the front surface, and an estimation step of estimating the resistivity of the plate-shaped workpiece on the basis of the interference waveform acquired in the interference waveform acquisition step.

56. 发明公开

US20230395411A1 DATA COLLECTION SYSTEM, DATA COLLECTION APPARATUS, DATA COLLECTION METHOD, AND DATA COLLECTION PROGRAM 审中-公开
公开(公告)号：US20230395411A1
公开(公告)日：2023-12-07
申请号：US18455067
申请日：2023-08-24
申请人： Tokyo Electron Limited
发明人： Tsuyoshi MORIYA , Hironori Moki , Kazuya Uoyama , Takahito Matsuzawa , Yuki Kataoka
IPC分类号： H01L21/67 , G01N21/95 , H01L21/02 , G05B19/418 , G05B19/401 , H05H1/00
CPC分类号： H01L21/67288 , G01N21/9501 , H01L21/02 , G05B2219/45031 , G05B19/401 , H05H1/0006 , G05B19/41875
摘要： A data collection system includes: a first substrate processing apparatus having a first processing space, a second substrate processing apparatus having a second processing space, and a data collection apparatus connected to the first substrate processing apparatus and the second substrate processing apparatus. The data collection apparatus is configured to compare observed data observed when substrates having the same or similar shapes are processed under the same processing conditions in the first processing space and the second processing space, respectively, and calculate a correction amount for correcting the observed data observed when being processed in the second processing space, and correct the observed data observed when being processed in the second processing space based on the correction amount, and collect corrected observed data, when searching for a processing condition by processing substrates while changing the processing condition in the second processing space.

57. 发明公开

US20230384211A1 IN-SITU APPARATUS FOR DETECTING ABNORMALITY IN PROCESS TUBE 审中-公开
公开(公告)号：US20230384211A1
公开(公告)日：2023-11-30
申请号：US18361777
申请日：2023-07-28
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Yu-Jen YANG , Chung-Pin CHOU , Yan-Cheng CHEN , Kai-Lin Chuang , Jun-Xiu Liu , Sheng-Ching Kao
IPC分类号： G01N21/05 , G01N21/95 , G01N15/02 , G01F1/663
CPC分类号： G01N21/05 , G01N21/9501 , G01N15/0211 , G01F1/663 , G01N2021/054 , G01N2015/1075
摘要： A process tube device can detect the presence of any external materials that may reside within a fluid flowing in the tube. The process tube device detects the external materials in-situ which obviates the need for a separate inspection device to inspect the surface of a wafer after applying fluid on the surface of the wafer. The process tube device utilizes at least two methods of detecting the presence of external materials. The first is the direct measurement method in which a light detecting sensor is used. The second is the indirect measurement method in which a sensor utilizing the principles of Doppler shift is used. Here, contrary to the first method that at least partially used reflected or refracted light, the second method uses a Doppler shift sensor to detect the presence of the external material by measuring the velocity of the fluid flowing in the tube.

58. 发明授权

US11830180B2 Blister-strip inspection device 有权
公开(公告)号：US11830180B2
公开(公告)日：2023-11-28
申请号：US17587024
申请日：2022-01-28
申请人： Blister Partners Holding BV
发明人： Gijsbert Olivier Van Schelven
IPC分类号： G06T7/00 , G01N21/95 , G01N21/88 , G01N21/90
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/90 , G01N21/9508
摘要： The invention relates to a blister strip inspection device (10) for sensing blister segments (12) of a blister strip (14), having an image acquisition device (16) which is arranged to capture images of the blister strip (14), wherein the image acquisition device (16) comprises a digital camera (18.1), an advance sensing device (24) for continuously sensing an advance (x) of the blister strip (14), and an evaluating unit (40) which is connected to the digital camera (18.1) and to the advance sensing device (24), and which is configured to automatically perform a method having the following steps: (v) sensing the advance of the blister strip (14), (vi) determining a target time (ti), at least also on the basis of the advance, at which a blister segment (12.i) is completely in the field of view (20.1) of the digital camera, and (vii) acquiring an image with the digital camera (18.1) at said target time (ti), wherein the digital camera (18.1) is a video camera which has a field of view (20.1, 20.2) and is formed to capture an image sequence consisting of temporally successive images. According to the invention, it is envisaged that the evaluating unit (40) is configured to automatically (i) determine the target time (t) at which a blister segment (12.i) is completely in the field of view (20.1, 20.2), at least also on the basis of the advance (x), (ii) take an image (AF) from the image sequence such that a monitoring image is generated, (iii) store the monitoring image and (v) repeat steps (i) to (iii) such that a monitoring image sequence is generated, and the evaluating unit (40) is configured to automatically: sense at least one preceding image at a time that lies shortly before the target time (ti) and/or acquire at least one following image (A) at a time that lies shortly after the target time, determine which of the images sufficiently completely contains the greatest portion of a blister segment (12) by means of image recognition, and store said image (A) as a monitoring image.

59. 发明授权

US11828714B2 Image acquisition by an electron beam examination tool for metrology measurement 有权
公开(公告)号：US11828714B2
公开(公告)日：2023-11-28
申请号：US17039694
申请日：2020-09-30
申请人： Applied Materials Israel Ltd.
发明人： Bobin Mathew Skaria , Anirban Ghosh , Nitin Singh Malik , Shay Attal
IPC分类号： G01N21/95 , H01L21/66 , G01N21/88
CPC分类号： G01N21/9505 , G01N21/8851 , H01L22/12 , G01N2021/8854 , G01N2021/8887
摘要： There is provided a system and a method comprising obtaining a sequence of a plurality of frames of an area of a specimen, wherein at least one frame of the sequence is transformed with respect to another frame, obtaining a reference frame based at least on a first frame of the sequence, determining, based on the reference frame, a reference pattern, wherein the reference pattern is informative of a structural feature of the specimen in the area, for a given frame of the sequence, determining, based on the given frame, a pattern informative of said structural feature in the area, determining data Dshrinkage informative of an amplitude of a spatial transformation between the reference pattern and the pattern, generating a corrected frame based on said pattern and Dshrinkage and generating an image of the area.

60. 发明授权

US11828713B1 Semiconductor inspection tool system and method for wafer edge inspection 有权
公开(公告)号：US11828713B1
公开(公告)日：2023-11-28
申请号：US18080006
申请日：2022-12-13
申请人： CAMTEK LTD
发明人： Carmel Yehuda Drillman , Moshe Edri , Menachem Regensburger , Baheej Bathish , Mordi Dahan
IPC分类号： G01N21/95 , G01N21/88 , H01L21/66
CPC分类号： G01N21/9503 , G01N21/8806 , G01N2021/8825 , G01N2021/8841 , H01L22/12
摘要： A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

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