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51. 发明授权

US09910403B2 Positioning features for electrical contacts of a replaceable unit of an electrophotographic image forming device 有权
公开(公告)号：US09910403B2
公开(公告)日：2018-03-06
申请号：US15384377
申请日：2016-12-20
申请人： LEXMARK INTERNATIONAL, INC.
发明人： Mark William Amann , Gregory Alan Cavill , Katrina Rosit Lactuan , James Richard Leemhuis , Darren Wayne Tosh
IPC分类号： G03G21/00 , H01R13/00 , G03G21/16 , G03G15/00 , G03G21/18 , H01R13/629
CPC分类号： G03G21/1652 , G03G15/751 , G03G15/80 , G03G21/1671 , G03G21/1842 , G03G21/1871 , G03G2221/1606 , G03G2221/166 , G03G2221/1869 , H01R13/629
摘要： A replaceable unit for an electrophotographic image forming device according to one embodiment includes a pocket formed on a first side of a housing. A bottom end of the pocket is open for receiving an electrical connector during insertion of the replaceable unit into the image forming device. An electrical contact is positioned within the pocket and is electrically connected to processing circuitry on the housing. An outer guide is positioned on the first side of the housing and below the pocket. A portion of the outer guide inclines inward toward the first side of the housing as the outer guide extends upward. An inner guide is positioned within the pocket on a first inner surface of the pocket, which faces toward the first side of the housing. A portion of the inner guide inclines inward toward the first side of the housing as the inner guide extends upward.

52. 发明授权

US09881725B2 Ethernet magnetics package wire terminations 有权
公开(公告)号：US09881725B2
公开(公告)日：2018-01-30
申请号：US14550256
申请日：2014-11-21
申请人： Cisco Technology, Inc.
发明人： William Frank Edwards , Ki-Yuen Chau , Keith Frank Tharp , George Curtis , Kayen Lin
IPC分类号： H01F27/02 , H01F27/28 , H01F27/29 , H01F27/06 , H01F41/10 , H01F27/04 , H01F27/30 , H01R13/00 , H01R43/01 , H01R13/719 , H01F17/06 , H01F17/00 , H01R4/02 , H01R24/64 , H01R43/02 , H01R107/00
CPC分类号： H01F27/06 , H01F17/062 , H01F27/04 , H01F27/2823 , H01F27/2828 , H01F27/292 , H01F27/306 , H01F41/10 , H01F2017/0093 , H01F2027/065 , H01R4/023 , H01R4/027 , H01R13/00 , H01R13/719 , H01R24/64 , H01R43/01 , H01R43/0221 , H01R2107/00
摘要： In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

53. 发明申请

US20170341901A1 FLEXIBLE HELICAL CORD MANAGEMENT DEVICE 审中-公开
公开(公告)号：US20170341901A1
公开(公告)日：2017-11-30
申请号：US15604009
申请日：2017-05-24
申请人： Rene N. Makrinos
发明人： Rene N. Makrinos
IPC分类号： B65H75/34 , H01R13/72 , B65H57/00 , H01R13/00 , B65H75/00
CPC分类号： B65H75/34 , B65H57/00 , B65H75/00 , B65H75/36 , B65H2701/34 , B65H2701/3919 , H01R13/00 , H01R13/72 , Y10T24/3916 , Y10T24/3929 , Y10T24/3998
摘要： In one aspect of the present disclosure, a flexible cord management device is provided. The device includes a helical coil base, an s-loop, and a post. The base can be wrapped around at least a portion of a bundled cord. The s-loop includes a first loop and a second loop, where the first loop is coupled to a first end of the base. The first loop can be opened to receive a first end of the bundled cord, such that, the first end of the bundled cord is securely disposed through the first loop. The second loop is coupled to the first loop. The post extends from the first end of the base and can be inserted through the second loop to secure the first loop in a closed position and removed from the second loop to enable the first loop to achieve an open position.

54. 发明授权

US09815663B2 Electrical wire organization device 有权
公开(公告)号：US09815663B2
公开(公告)日：2017-11-14
申请号：US14538218
申请日：2014-11-11
申请人： Zahid Hussain
发明人： Zahid Hussain
IPC分类号： H01R25/00 , H01R13/00 , H01R13/72 , B65H75/36 , H02G11/02
CPC分类号： B65H75/362 , B65H2701/34 , H01R13/72 , H01R25/006 , H02G11/02
摘要： An apparatus may include a substrate material. The substrate material may lay substantially planar along a first axis. The apparatus may also include a plurality of punch-outs consisting of the substrate material and fastened to the substrate material. Each punch-out may be to be removed from the substrate material with an application of force upon each punch-out to create an open space in the substrate material. The apparatus may also include a first plurality of linear joints in the substrate material to allow the substrate material to be folded into a box form including at least five sides. The box form includes an inside portion.

55. 发明授权

US09728950B2 Cryogenic cable termination connector 有权
公开(公告)号：US09728950B2
公开(公告)日：2017-08-08
申请号：US13576689
申请日：2011-01-31
申请人： Shinichi Mukoyama , Tokui Yonemura , Shuka Yonemura , Masashi Yagi , Tomoya Nomura
发明人： Shinichi Mukoyama , Tokui Yonemura , Masashi Yagi , Tomoya Nomura
IPC分类号： H01B17/26 , H02G15/20 , H01B12/00 , H01R13/00 , H02G15/34
CPC分类号： H02G15/34
摘要： A cryogenic cable termination connector having a small heat inflow from the outside and stable electrical insulation properties. The cryogenic cable termination connector includes a lead-out conductor led out from a site at a very low temperature to a site at room temperature via a liquid refrigerant layer, a refrigerant gas layer, and an oil layer. The lead-out conductor includes a capacitor-cone insulator in which plural metal foils for dividing an electric field from a high voltage level down to the ground voltage level are stacked through an insulator. Among electric field tilting portions in which voltage changes gradually from the high voltage level to the ground voltage level, an electric field tilting portion positioned at a lower part is located in the liquid refrigerant layer and an electric field tilting portion positioned at an upper part is located in the oil layer.

56. 发明授权

US09681582B1 Pluggable connector and unitary housing shell configured to transfer thermal energy of the pluggable connector 有权
公开(公告)号：US09681582B1
公开(公告)日：2017-06-13
申请号：US14959293
申请日：2015-12-04
申请人： TYCO ELECTRONICS CORPORATION
发明人： Alan Weir Bucher
IPC分类号： H01R13/00 , H05K7/20 , H01R13/66
CPC分类号： G02B6/4284 , G02B6/4272 , H01R13/665
摘要： Pluggable connector includes a connector housing having a unitary housing shell that includes a top wall, a bottom wall that is spaced apart from the top wall, and a side wall that extends between and joins the top and bottom walls. The pluggable connector also includes a communication assembly positioned within an interior cavity of the pluggable connector. The communication assembly includes internal electronics that generate thermal energy during operation. The top wall has an exterior surface that forms an output area configured to dissipate the thermal energy therefrom. The bottom wall has an interior surface that is coupled to the internal electronics such that the thermal energy is conveyed from the internal electronics into the bottom wall. The unitary housing shell forms a seamless thermal-transfer path that extends from the bottom wall, through the side wall, and to the output area.

57. 发明授权

US09674987B2 Heat dissipation device 有权
公开(公告)号：US09674987B2
公开(公告)日：2017-06-06
申请号：US14892460
申请日：2013-11-13
申请人： ZTE Corporation
发明人： Fangxi Hou
IPC分类号： H01R13/00 , H05K7/20 , H01R12/72
CPC分类号： H05K7/20509 , H01R12/722 , H05K7/20418
摘要： Provided is a heat dissipation device. The heat dissipation device includes a thermal conductive plate (1), a shape of which is the same as a shape of a Secure Digital (SD) card. The thermal conductive plate (1) is used to be inserted into an SD card connector, and partially contacts with at least one inner surface of the SD card connector; the thermal conductive plate (1) is made of thermal conductive metallic material, and one or more contacting parts (10) of the thermal conductive plate (1) that contact with the SD card connector are set to be thermal conductive metallic material, and outer surfaces (12), other than the one or more contacting parts (10), of the thermal conductive plate (1) are set to be insulating material. The present technical solution solves the problem that the implementing effect of heat dissipation schemes already existed for terminals is fairly bad in the related technologies, and improves heat conduction and heat dissipation speed. The heat dissipation device occupies less space in the terminal, and enhances heat dissipation efficiency.

58. 发明授权

US09635768B2 Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same 有权
公开(公告)号：US09635768B2
公开(公告)日：2017-04-25
申请号：US14721942
申请日：2015-05-26
申请人： Samsung Electronics Co., Ltd.
发明人： Hyojae Bang , Dogeun Kim , Hongkyun Kim , Youngbok Jeon
IPC分类号： H05K5/00 , G06K7/00 , H01R12/57 , H01R12/50 , H05K1/11 , H01R13/00 , H05K3/10 , H05K3/30 , H05K7/02 , H05K13/00 , G06F1/18 , H05K1/18 , H01R27/00 , H05K1/02 , H05K3/34
CPC分类号： H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/57 , H01R12/721 , H01R13/00 , H01R23/70 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要： Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

59. 发明授权

US09608371B2 Interconnection apparatus and assembly comprising same 有权
公开(公告)号：US09608371B2
公开(公告)日：2017-03-28
申请号：US14917854
申请日：2014-09-10
申请人： Plastic Omnium Advanced Innovation and Research
发明人： Renaud Bonzom , Romain Herdier
IPC分类号： H01R13/631 , F01N3/20 , F01N13/18 , H01R13/00 , H01R43/26
CPC分类号： H01R13/6315 , F01N3/2066 , F01N13/18 , F01N2450/18 , F01N2610/1406 , H01R13/005 , H01R43/26 , Y02A50/2325 , Y02T10/24
摘要： An interconnection apparatus including: a rigid substrate having a first side and a second side; at least one first connector arranged on the first side; and at least one second connector arranged on the second side. The apparatus can compensate an alignment error of complementary connectors configured to be mated with the at least one first connector and the at least one second connector.

60. 发明申请

US20170033484A1 QUICK CONNECTOR 有权
标题翻译：快速连接器
公开(公告)号：US20170033484A1
公开(公告)日：2017-02-02
申请号：US14812603
申请日：2015-07-29
申请人： STEIN INDUSTRIES INC.
发明人： Tim Ferrier
IPC分类号： H01R13/00
CPC分类号： H01R13/005 , H01R13/625
摘要： A quick connector has a tubular male member with an interior lumen, an outbound end configured to allow connection to a hose and to a current conductor, and a pair of opposed radially outwardly projecting protuberances. A tubular female member has an interior lumen, an outbound end configured to allow connection to a hose and to a current conductor, and an inbound end sized to receive an inbound end of the male tubular member. The female member has a sleeve with an undercut lip at an inbound end with opposed slots sized to receive the opposed protuberances of the tubular male member.
摘要翻译：快速连接器具有管状阳构件，其具有内腔，出口端构造成允许连接到软管和电流导体，以及一对相对的径向向外突出的突起。管状阴构件具有内腔，出口端构造成允许连接到软管和电流导体，以及入口端，其尺寸适于容纳阳管状构件的入站端。阴构件具有在入口端具有底切唇缘的套筒，其相对的狭槽的尺寸适于容纳管状阳构件的相对的突出部。

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