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61. 发明申请

US20210296553A1 HIGH-POWER THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION SYSTEM 有权
公开(公告)号：US20210296553A1
公开(公告)日：2021-09-23
申请号：US16629036
申请日：2019-04-12
申请人： Shandong University
发明人： Hongchao WANG , Xue WANG , Wenbin SU , Chunlei WANG
IPC分类号： H01L35/32 , H01L35/08 , H01L35/10
摘要： The present invention relates to a high-power thermoelectric conversion module and thermoelectric conversion system. The thermoelectric conversion module includes: a first substrate made of ceramic; a second substrate made of ceramic and disposed opposite to the first substrate; a plurality of third electrodes and thermoelectric conversion elements arranged crosswise in a matrix between the first substrate and the second substrate; a first electrode disposed between the first substrate and the thermoelectric conversion elements; and a second electrode disposed between the second substrate and the thermoelectric conversion elements. The first electrode is connected to one ends of the thermoelectric conversion elements and the third electrodes whose tops are flush with the one ends of the thermoelectric conversion elements, respectively. The second electrode is connected to the other ends of the thermoelectric conversion elements and the third electrodes whose bottoms are flush with the other ends of the thermoelectric conversion elements, respectively.

62. 发明申请

US20200312742A1 BUMP INTEGRATED THERMOELECTRIC COOLER 审中-公开
公开(公告)号：US20200312742A1
公开(公告)日：2020-10-01
申请号：US16370703
申请日：2019-03-29
申请人： Intel Corporation
发明人： Kelly Lofgreen , Chandra Mohan Jha , Krishna Vasanth Valavala
IPC分类号： H01L23/38 , H01L23/48 , H01L23/00 , H01L25/18 , H01L35/10 , H01L35/34
摘要： An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.

63. 发明申请

US20200279988A1 THERMOELECTRIC MODULE 审中-公开
公开(公告)号：US20200279988A1
公开(公告)日：2020-09-03
申请号：US16754243
申请日：2018-10-24
申请人： KYOCERA Corporation
发明人： Tomohiro FURUKAWA
IPC分类号： H01L35/10 , H01L35/32 , H01L35/08
摘要： A thermoelectric module according to the disclosure includes: a pair of support substrates including mutually opposed regions; wiring conductors disposed on opposed one principal surfaces of the pair of support substrates, respectively; a plurality of thermoelectric elements disposed between the one principal surfaces; a lead member joined to one wiring conductor of the wiring conductors, the one wiring conductor being located on either one support substrate of the pair of support substrates; and an electrically conductive joining material which joins the one wiring conductor and the lead member together. A bonding interface between the electrically conductive joining material and the wiring conductor is smaller in width on a side close to the thermoelectric elements than on a side away from the thermoelectric elements, as viewed in a section in a direction perpendicular to an axial direction of the lead member.

64. 发明申请

US20200266329A1 THERMOELECTRIC CONVERSION MODULE AND VEHICLE INCLUDING THE SAME 审中-公开
公开(公告)号：US20200266329A1
公开(公告)日：2020-08-20
申请号：US16867150
申请日：2020-05-05
申请人： Hyundai Motor Company , Kia Motors Corporation
发明人： Jin Woo KWAK , Kwang Min CHOI , Byung-Wook KIM , Hoo Dam LEE , Ho Chan AN , Jong Ho SEON
IPC分类号： H01L35/32 , H01L35/10 , F01N5/02
摘要： A thermoelectric conversion module may include a plurality of n type thermoelectric conversion materials and a plurality of p type thermoelectric conversion materials that are disposed alternately, and a plurality of electrodes that connects the plurality of thermoelectric conversion material disposed alternately on one side and on an opposite side alternately, wherein the plurality of electrodes includes a first electrode configured to electrically connect the n type thermoelectric conversion material and the p type thermoelectric conversion material by penetrating the n type thermoelectric conversion material and the p type thermoelectric conversion material to transfer heat obtained from a heat source to the plurality of thermoelectric conversion materials.

65. 发明授权

US10665768B2 Thermoelectric conversion module package 有权
公开(公告)号：US10665768B2
公开(公告)日：2020-05-26
申请号：US16158980
申请日：2018-10-12
申请人： YAMAHA CORPORATION , TOPPAN PRINTING CO., LTD. , TOYOTA TSUSHO CORPORATION
发明人： Tetsutsugu Hamano , Takahiro Hayashi , Yuma Horio , Tomoaki Taniguchi , Yuki Muroi , Takashi Nakamura
IPC分类号： H01L35/10 , H01L35/32 , H01L35/30 , H01L23/38
摘要： A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.

66. 发明授权

US10559736B2 Thermoelectric generator 有权
公开(公告)号：US10559736B2
公开(公告)日：2020-02-11
申请号：US15322521
申请日：2015-06-29
申请人： KELK Ltd.
发明人： Kazuya Makino , Haruo Imamura , Hirokuni Hachiuma
IPC分类号： H01L35/30 , H01L35/10 , H01L35/32
摘要： A thermoelectric generator includes: a heat-receiving plate configured to receive heat; a cooling plate configured to be kept at a lower temperature than a temperature of the heat-receiving plate; and a thermoelectric generation module interposed between the heat-receiving plate and the cooling plate, in which the thermoelectric generation module includes: an opposed surface that is opposed to the cooling plate; a plurality of thermoelectric elements; a terminal configured to electrically conduct to the thermoelectric elements; and a lead member bonded to the terminal, in which the lead member penetrates the opposed surface and extends to the cooling plate.

67. 发明申请

US20200028054A1 THERMOELECTRIC CONVERSION DEVICE 审中-公开
公开(公告)号：US20200028054A1
公开(公告)日：2020-01-23
申请号：US16271167
申请日：2019-02-08
申请人： TDK CORPORATION
发明人： Takashi ASATANI , Makoto SHIBATA
IPC分类号： H01L35/30 , H01L35/32 , H01L35/10 , H01L27/16
摘要： A thermoelectric conversion device includes: a substrate having a first surface and a second surface that face each other in a thickness direction; at least one thermoelectric conversion element which is provided in a surface on a side of at least one of the first surface and the second surface; a heat transfer member disposed on the side of the substrate, on which the at least one thermoelectric conversion element is provided, with an interval from at least a part of the at least one thermoelectric conversion element; and at least one heat transfer portion configured to thermally connect the at least one thermoelectric conversion element and the heat transfer member, wherein an interspace between the substrate and the heat transfer member is sealed outside a perimeter of the at least one thermoelectric conversion element.

68. 发明申请

US20200013940A1 Thermoelectric Module And Flexible Thermoelectric Circuit Assembly 审中-公开
公开(公告)号：US20200013940A1
公开(公告)日：2020-01-09
申请号：US16483466
申请日：2018-02-08
申请人： Jason DAVIS , Artur Stepanov , Eric Kozlowski , Magna Seating Inc
发明人： Jason Davis , Artur Stepanov , Eric Kozlowski
IPC分类号： H01L35/32 , H01L35/10 , H01L35/16 , H01L35/14 , H01L35/30 , B60N2/56
摘要： A thermoelectric module has a base and first and second thermoelectric elements set in the base and electrically isolated by the base. A bottom layer is coupled to a bottom surface of the base, a bottom surface of the first thermoelectric element, and a bottom surface of the second thermoelectric element to electrically connect the first and second thermoelectric elements. The base is used to protect the thermoelectric elements. Multiple thermoelectric modules may be mounted to and connected by conductors on a flexible circuit panel to create a flexible thermoelectric circuit assembly for cooling, heating and/or power generating applications.

69. 发明申请

US20190355890A1 THERMOELECTRIC CONVERSION MODULE 审中-公开
公开(公告)号：US20190355890A1
公开(公告)日：2019-11-21
申请号：US16426002
申请日：2019-05-30
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： HIROKI SATO , TSUTOMU KANNO , HIROMASA TAMAKI , YURIKO KANEKO , MIHO UEHARA
IPC分类号： H01L35/32 , H01L35/10
摘要： The present disclosure provides a thermoelectric conversion module that enables continued use of a thermoelectric generation system even when a part of a plurality of the thermoelectric conversion modules fails by being exposed to a higher temperature. The thermoelectric conversion module according to the present disclosure includes a substrate, a plurality of thermoelectric conversion element pairs electrically connected in series on the substrate, a pair of external terminals that carries out one of inputting and outputting of electric power, and a low melting point conductor. The low melting point conductor has a melting point that is substantially equal to a heat-resistant temperature of a p-type thermoelectric conversion element or an n-type thermoelectric conversion element. One of the pair of external terminals has a first connecting part connecting with the p-type thermoelectric conversion element positioned at one end of the plurality of thermoelectric conversion element pairs, whereas the other of the pair of external terminals has a second connecting part connecting with the n-type thermoelectric conversion element positioned at the other end of the plurality of thermoelectric conversion element pairs. The first and second connecting parts and the low melting point conductor are positioned in an inner region of the substrate. At least a part of the low melting point conductor is positioned between the pair of external terminals and is electrically insulated from at least one of the pair of external terminals.

70. 发明授权

US10468573B2 Thermoelectric conversion material 有权
公开(公告)号：US10468573B2
公开(公告)日：2019-11-05
申请号：US15915793
申请日：2018-03-08
申请人： FURUKAWA CO., LTD.
发明人： Ge Nie , Junqing Guo , Masaaki Kikuchi , Takahiro Ochi , Shogo Suzuki , Taketoshi Tomida
IPC分类号： H01L35/18 , H01L35/14 , H01L35/10 , C22C12/00 , H01L35/34 , H01L35/08 , C22C1/02 , C22C1/04
摘要： A thermoelectric conversion material has a composition represented by General Formula LkRrTt−mMmSbx. Here, L includes at least one element selected from rare earth elements. R includes two or more elements selected from the group consisting of alkali metal elements, alkali earth metal elements, Group 4 elements, and Group 13 elements. T includes at least one element selected from Fe and Co. M includes at least one element selected from the group consisting of Ru, Os, Rh, Ir, Ni, Pd, Pt, Cu, Ag, and Au. In addition, 0.50≤k≤1.00, 0.1≤r≤0.5, 3.0≤t−m≤5.0, 0≤m≤0.5, 10.0≤x≤11.5, and x/t

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