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61. 发明授权

US08134424B2 Electrostatic connector 有权
标题翻译：静电连接器
公开(公告)号：US08134424B2
公开(公告)日：2012-03-13
申请号：US12257612
申请日：2008-10-24
申请人： Shuichi Kato , Susumu Kawata , Makoto Honda
发明人： Shuichi Kato , Susumu Kawata , Makoto Honda
IPC分类号： H01P5/04 , H01P1/04
CPC分类号： H01R24/44 , H01R2103/00
摘要： A connector for transmitting signals using electrostatic coupling, comprises an inner first conductor portion and an outer first conductor portion respectively connected to two signal lines, an inner electrode portion having a facing area larger than the cross-sectional area of the inner first conductor portion in the direction perpendicular to the direction of the common axis, an outer electrode portion outside it, an inner second conductor portion for electrically connecting between the inner first conductor portion and the inner electrode portion, and an outer second conductor portion outside it, wherein the ratio of outer diameter of the inner second conductor portion to inner diameter of the outer second conductor portion is set to provide substantially fixed characteristic impedance at every position along the direction of the common axis.
摘要翻译：一种用于使用静电耦合传输信号的连接器，包括分别连接到两个信号线的内部第一导体部分和外部第一导体部分，内部电极部分具有大于内部第一导体部分的横截面积的面积区域与公共轴方向垂直的方向，外侧的外部电极部分，内部第一导体部分和内部电极部分之间电气连接的内部第二导体部分和外部第二导体部分之间的外部第二导体部分，内部第二导体部分的外径与外部第二导体部分的内径之间的距离设定为沿着公共轴线的方向在每个位置处提供基本固定的特性阻抗。

62. 发明授权

US08058956B2 High frequency and wide band impedance matching via 有权
标题翻译：高频和宽带阻抗匹配通孔
公开(公告)号：US08058956B2
公开(公告)日：2011-11-15
申请号：US12801673
申请日：2010-06-21
申请人： Uei-Ming Jow , Ching-Liang Weng , Ying-Jiunn Lai , Chang-Sheng Chen
发明人： Uei-Ming Jow , Ching-Liang Weng , Ying-Jiunn Lai , Chang-Sheng Chen
IPC分类号： H03H7/38 , H01P1/04
CPC分类号： H05K1/0251 , H01L23/66 , H01L2223/6616 , H01L2223/6638 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01P5/02 , H05K1/0222 , H05K1/0245 , H05K1/115 , H05K1/116 , H05K3/429 , H05K2201/09236 , H05K2201/09454 , H05K2201/09618 , H05K2201/09627 , H05K2201/09809 , H05K2201/09845 , H01L2924/00
摘要： A high frequency and wide band impedance matching via is provided, applicable to multi-layer printed circuit boards, for example. The multi-layer circuit board may include several signal transmission traces, several ground layers, signal transmission vias and ground vias. The signal transmission traces and the ground layers may be sited on different circuit layers, and each signal transmission trace may be opposite to one of the ground layers. The signal transmission vias may be connected between the signal transmission traces. The ground vias may be connected between the ground layers. The ground vias may be opposite to the signal transmission vias, and the ground vias corresponding to the signal transmission vias may be sited to stabilize the characteristic impedance of the transmission traces.
摘要翻译：提供了高频和宽带阻抗匹配通孔，例如适用于多层印刷电路板。多层电路板可以包括几个信号传输迹线，几个接地层，信号传输通路和接地通孔。信号传输迹线和接地层可以位于不同的电路层上，并且每个信号传输迹线可以与一个接地层相反。信号传输通孔可以连接在信号传输迹线之间。接地通孔可以连接在接地层之间。接地通孔可能与信号传输通孔相反，并且可能选择对应于信号传输通孔的接地通孔来稳定传输迹线的特性阻抗。

63. 发明授权

US07994881B2 Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide 有权
标题翻译：在多层波导基板和包括多层波导中的扼流结构的金属波导基板之间的波导连接
公开(公告)号：US07994881B2
公开(公告)日：2011-08-09
申请号：US12307755
申请日：2007-10-30
申请人： Takuya Suzuki
发明人： Takuya Suzuki
IPC分类号： H01P1/04
CPC分类号： H01P1/042 , H01P3/121
摘要： A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.
摘要翻译：在面向金属基板的多层电介质基板上的第一波导周围形成矩形导体图案，其端部距离第一波导的长边缘大约λ/ 4，其中λ是信号的自由空间波长波。导体开口形成在导电图案的端部和第一波导的长边缘之间，其长度比第一波导的长边长并且短于约λ。在多层电介质基板中沿层方向形成封闭电介质传输路径，长度约为λg/ 4，其中λg为信号波的衬底内有效波长。

64. 发明申请

US20100277258A1 TUNABLE CAPACITIVE INPUT COUPLING 有权
标题翻译：电容式输入耦合
公开(公告)号：US20100277258A1
公开(公告)日：2010-11-04
申请号：US12434432
申请日：2009-05-01
申请人： Raja K. Reddy , Yin-Shing Chong , Teppo M. Lukkarila
发明人： Raja K. Reddy , Yin-Shing Chong , Teppo M. Lukkarila
IPC分类号： H01P1/20 , H01P1/04
CPC分类号： H01P7/06 , Y10T29/49826
摘要： Various exemplary embodiments include a cavity having a tuning assembly with tunable capacitive coupling. The tuning assembly may have a recess having a specified depth, designed for a default magnitude of coupling into the cavity. A sleeve may be fully inserted within the recess to have the structure operate at that default coupling magnitude. If a different amount of coupling is desired, the sleeve may be inserted to a particular depth that only includes part of the recess, enabling repeatable tuning of a plurality of cavities.
摘要翻译：各种示例性实施例包括具有可调电容耦合的调谐组件的空腔。调谐组件可以具有一个具有指定深度的凹槽，设计用于连接到空腔中的默认大小。套筒可以完全插入凹槽内，以使结构以该默认的耦合幅度工作。如果需要不同的耦合量，则可以将套筒插入到仅包括凹部的一部分的特定深度，从而实现多个空腔的可重复调谐。

65. 发明授权

US07791438B2 Millimeter and sub-millimeter wave waveguide interface having a junction of tight tolerance and a junction of lesser tolerance 有权
标题翻译：毫米波和亚毫米波波导接口具有紧公差和较小公差的接合点
公开(公告)号：US07791438B2
公开(公告)日：2010-09-07
申请号：US12151096
申请日：2008-05-01
申请人： Yuenie S. Lau , Anthony Denning
发明人： Yuenie S. Lau , Anthony Denning
IPC分类号： H01P1/04
CPC分类号： H01P1/042
摘要： A waveguide interface for millimeter wave and sub-millimeter wave applications adapted to couple and uncouple abutting waveguide sections wherein said waveguide interface acts as both a mating surface and a precision alignment mechanism. The waveguide interface comprises a first member having a first waveguide defined therein, a second member having a second waveguide similar in cross-section to said first waveguide defined therein, a means for mating said first member and said second member comprising a centrally located precision mating surface through which propagates electromagnetic energy and additionally comprising at least one pair of diametrically opposed rotational alignment pins and holes located a specified distance from said centrally located precision-mating surface, and wherein said pins and holes are in mating relation of looser fitment than said centrally located precision mating surface.
摘要翻译：一种用于毫米波和亚毫米波应用的波导接口，其适用于耦合和分离邻接波导部分，其中所述波导接口充当配合表面和精密对准机构。波导界面包括具有限定在其中的第一波导的第一构件，具有与限定在其中的所述第一波导的横截面类似的第二波导的第二构件，用于配合所述第一构件和所述第二构件的装置，其包括位于中心的精密配合表面，其传播电磁能量，并且还包括至少一对直径相对的旋转对准销和位于离所述中心位置的精密匹配表面规定距离的孔，并且其中所述销和孔具有比所述中心位置更宽松配合的配合关系定位精密配合面。

66. 发明申请

US20100097159A1 SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE 有权
标题翻译：半导体芯片和半导体器件
公开(公告)号：US20100097159A1
公开(公告)日：2010-04-22
申请号：US12529443
申请日：2008-02-29
申请人： Eiji Hankui , Toshihide Kuriyama , Hideki Sasaki , Muneo Fukaishi
发明人： Eiji Hankui , Toshihide Kuriyama , Hideki Sasaki , Muneo Fukaishi
IPC分类号： H01P1/10 , H01P1/04
CPC分类号： H01L27/0688 , H01L23/48 , H01L25/0657 , H01L2225/06513 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.
摘要翻译：提供了一种半导体器件和半导体芯片，其中通过堆叠三层或更多层芯片而使互连成为高可靠性，其间没有接触。本发明的半导体芯片包括第一信号传输电路，其上形成有第一转换开关的硅衬底和形成有第一电容耦合上电极的互连层，其中第一电容耦合下电极通过穿过硅衬底的第一通孔另外形成在硅衬底的后表面上，而第一电容耦合上电极直接连接到第一信号传输电路，第一电容耦合下电极连接通过第一通孔和第一转换开关连接到第一信号传输电路。

67. 发明授权

US07692518B2 Compact broadband non-contacting transmission line junction having inter-fitted elements 有权
标题翻译：紧凑型宽带非接触式传输线路接头，具有相互配合的元件
公开(公告)号：US07692518B2
公开(公告)日：2010-04-06
申请号：US11825494
申请日：2007-07-06
申请人： James P. McKay
发明人： James P. McKay
IPC分类号： H01P5/02 , H01P1/04
CPC分类号： H01P1/202
摘要： A transmission line junction for a coaxial conductor line has mating ends of interfitting cores, sleeves, and dielectrics for communicating broadband signals through the junction that blocks DC currents and voltages, the junction maintaining a quarter wavelength junction length for high frequency coupling while providing improved low frequency coupling across the junction.
摘要翻译：用于同轴导体线的传输线接头具有配线芯，套筒和电介质的配合端，用于通过阻塞直流电流和电压的接点传送宽带信号，该结保持四分之一波长结长以进行高频耦合，同时提供改进的低跨接头的频率耦合。

68. 发明授权

US07463122B2 Compact via transmission line for printed circuit board and its designing method 有权
标题翻译：用于印刷电路板的紧凑型传输线及其设计方法
公开(公告)号：US07463122B2
公开(公告)日：2008-12-09
申请号：US10558888
申请日：2004-06-01
申请人： Taras Kushta , Kaoru Narita , Takanori Saeki , Tomoyuki Kaneko , Hirokazu Tohya
发明人： Taras Kushta , Kaoru Narita , Takanori Saeki , Tomoyuki Kaneko , Hirokazu Tohya
IPC分类号： H01P1/04
CPC分类号： H05K1/0222 , H01P3/06 , H05K1/024 , H05K1/0251 , H05K3/429 , H05K2201/0187 , H05K2201/09063 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809
摘要： A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
摘要翻译：一种用于具有优选特性阻抗并能够使包括多层印刷电路板的印刷电路板小型化并且扩展安装在印刷电路板上的通孔传输线的频率范围的印刷电路板的紧凑型通路传输线，以及设计方法一样的。传输线具有形成内导体层边界的中心导体，构成信号通孔，围绕中心导体布置的多个通孔形成外导体层边界，以及由印刷电路板导体形成的多个导体板通过传输线在压缩体的内部和外部导体层边界之间进一步设置本构参数调整间隙孔，并且电隔离以防止通过信号通孔传播的信号与其他信号在高电平中的串扰频率信号频带。

69. 发明授权

US07456702B2 Low pass metal powder filter 有权
标题翻译：低通金属粉末过滤器
公开(公告)号：US07456702B2
公开(公告)日：2008-11-25
申请号：US11456351
申请日：2006-07-10
申请人： George Andrew Keefe , Roger Hilsen Koch , Frank P Milliken, Jr. , James R. Rozen
发明人： George Andrew Keefe , Roger Hilsen Koch , Frank P Milliken, Jr. , James R. Rozen
IPC分类号： H01P1/04 , H01P1/213
CPC分类号： H01P1/202 , Y10T29/49002
摘要： A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50Ω characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.
摘要翻译：一种低通滤波器，其具有介于内导体和外导体之间的内导体，外导体和金属粉复合体的同轴结构。实施例包括50mega特性阻抗。金属粉末可以是青铜，铜或其他金属，在环氧树脂载体中混合。

70. 发明授权

US07439830B2 Constant contact pressure PIM interface 失效
公开(公告)号：US07439830B2
公开(公告)日：2008-10-21
申请号：US11026685
申请日：2004-12-31
申请人： Rolf Kich
发明人： Rolf Kich
IPC分类号： H01P1/04
CPC分类号： H01P1/042
摘要： An interface that provides minimum changes in contact pressure over a thermal range is disclosed. The interface is a mated joint of given material, typically metallic, joined by a mechanical fastener or fasteners. The fastener(s) create contact pressure at the joint surface wherein the contact pressure variation over a temperature range is minimized by the use of a thermal compensator having a predetermined length. The thermal compensator's length is chosen by setting the thermally induced expansion delta to offset an equal delta created by the fastener and interface configuration. The difference in expansion of the mated joint and fastener is canceled by the equal, but negative, difference between compensator and fastener. This cancellation of expansion minimizes the change in contact pressure at the joint interface. Maintaining a constant pressure provides PIM reliability during temperature changes.

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