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    • 70. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US09583314B2
    • 2017-02-28
    • US14846739
    • 2015-09-05
    • Hitachi High-Technologies Corporation
    • Hitoshi Tamura
    • H01J7/24H01J37/32H01J37/02H01P5/103
    • H01J37/32229H01J37/02H01J37/32256H01J37/32293H01J37/32311H01P5/103
    • Provided is a plasma processing apparatus including: a circular waveguide connected with a vacuum vessel, and through which a circularly polarized wave of an electric field for plasma formation propagates; a processing chamber which is arranged below the circular waveguide, and in which plasma is formed; a circularly polarized wave generator, which is arranged in the waveguide; a circularly polarized wave adjuster which is connected with the circular waveguide below the circularly polarized wave generator; a circularly polarized wave detector which is below the circularly polarized wave adjuster; and a controller which adjusts an operation of the circularly polarized wave adjuster according to an output from the circularly polarized wave detector, in which the circularly polarized wave adjuster adjusts a length of a protrusion of a dielectric stub into the circular waveguide based on a signal from the controller.
    • 提供一种等离子体处理装置,包括:与真空容器连接的圆形波导,用于等离子体生成的电场的圆极化波通过该波导传播; 处理室,其设置在所述圆形波导的下方,形成有等离子体; 圆偏振波发生器,布置在波导中; 圆偏振波调节器,与圆偏振波发生器下方的圆形波导连接; 在圆偏振波调节器下面的圆偏振波检测器; 以及根据圆偏振波检测器的输出调节圆偏振波调节器的操作的控制器,其中圆偏振波调节器基于来自圆偏振波检测器的信号将电介质短截线的突起的长度调节到圆形波导中 控制器。