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61. 发明申请

US20130252445A1 Electrical Connectors Including Electromagnetic Interference (EMI) Absorbing Material 有权
标题翻译：电连接器包括电磁干扰（EMI）吸收材料
公开(公告)号：US20130252445A1
公开(公告)日：2013-09-26
申请号：US13884756
申请日：2011-12-08
申请人： Alexander W. Barr
发明人： Alexander W. Barr
IPC分类号： H01R13/6585 , H01R13/6598
CPC分类号： H01R13/6598 , H01R13/6585 , H01R13/6586 , H01R13/6597
摘要： Examples of electrical connectors that incorporate electromagnetic interference (EMI) absorbing materials are described. In one example, an electrical connector includes a first pair of conductors, a second pair of conductors, and electromagnetic interference (EMI) absorbing material at least partially separating the first pair of conductors from the second pair of conductors. Each of the first and second pairs of conductors defines one of a differential pair or a signal conductor/ground pair. The EMI absorbing material may be configured to attenuate, primarily by absorption, an electromagnetic field generated due to transmission of electrical signals via one of the first pair and second pair of conductors to reduce the electromagnetic inference from the electromagnetic field on the other of the first pair and second pair of conductors.
摘要翻译：描述了包含电磁干扰（EMI）吸收材料的电连接器的例子。在一个示例中，电连接器包括第一对导体，第二对导体和至少部分地将第一对导体与第二对导体分离的电磁干扰（EMI）吸收材料。第一和第二对导体中的每一个限定差分对或信号导体/接地对中的一个。 EMI吸收材料可以被配置为主要通过吸收来衰减由于通过第一对和第二对导体中的一个传导电信号而产生的电磁场，以减少来自第一对和第二对导体中的另一个的电磁场的电磁推断对和第二对导体。

62. 发明申请

US20220344861A1 BOARD-TO-BOARD (B2B) CONNECTOR FOR IMPROVED PERFORMANCE AND STRENGTH AND METHOD OF MAKING SAME 有权
公开(公告)号：US20220344861A1
公开(公告)日：2022-10-27
申请号：US17727102
申请日：2022-04-22
申请人： Verre.io, Inc.
发明人： Raghunandan Chaware , Tarangini Deshpande
IPC分类号： H01R13/50 , H01R43/18 , H01R13/6598 , H01R13/6581 , H01R12/71
摘要： According to embodiments, a board-to-board (B2B) connector includes an array of contacts. The B2B connector further includes a housing holding the array of contacts. A main body of the housing is made of glass. The main body occupies at least 50% of the housing in volume.

63. 发明申请

US20220329015A1 COMPLIANT SHIELD FOR VERY HIGH SPEED, HIGH DENSITY ELECTRICAL INTERCONNECTION 有权
公开(公告)号：US20220329015A1
公开(公告)日：2022-10-13
申请号：US17824381
申请日：2022-05-25
申请人： Amphenol Corporation
发明人： Daniel B. Provencher , Mark W. Gailus , David Manter , Vysakh Sivarajan
IPC分类号： H01R13/6587 , H01R13/6582 , H01R12/72 , H01R12/73 , H01R13/02 , H01R13/518 , H01R13/6598 , H01R43/24
摘要： An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.

64. 发明申请

US20220212016A1 Connectors For High Density Neural Interfaces 有权
公开(公告)号：US20220212016A1
公开(公告)日：2022-07-07
申请号：US17605493
申请日：2020-04-14
申请人： Verily Life Sciences LLC
发明人： Benjamin K. Yaffe , Bo Lu
IPC分类号： A61N1/375 , A61N1/05 , H01B3/30 , H01B3/42 , H01R13/6598 , H01R13/642 , H01R24/58
摘要： The present disclosure relates to connectors for high density neural interfaces and methods of microfabricating the connectors. Particularly, aspects of the present disclosure are directed to a connector having a core and a supporting structure wrapped around at least a portion of the core. The supporting structure may have a first layer of a high temperature liquid crystal polymer, and the second layer of a low temperature liquid crystal polymer that is reflowed to attach the supporting structure to the core. Conductive traces are buried between the first layer and the second layer, and the conductive traces terminate at conductive contacts formed on a surface of the first layer. The connector may have a predetermined shape or profile, which facilitates alignment and insertion of the connector into a header of a neurostimulator.

65. 发明申请

US20220094114A1 PLUG-IN CONNECTOR AND METHOD 有权
公开(公告)号：US20220094114A1
公开(公告)日：2022-03-24
申请号：US17471208
申请日：2021-09-10
申请人： MD ELEKTRONIK GmbH
发明人： Josef Ohni , Thomas Halbig , Thomas Grasser
IPC分类号： H01R13/6586 , H01R13/6588 , H01R13/6598
摘要： A plug-in connector for a two- or multi-wire cable includes a male and female contact. The male and female contacts are configured to be coupled to first and second wires, respectively, and are elongated in a plug-in direction. A carrier element is configured to position and receive the male and female contacts in first and second receiving spaces, respectively, each at a predefined angle with respect to the plug-in direction, and to electrically insulate the male and female contacts from one another. A shielding element includes first and second channels for receiving the first and second wires, respectively. The channels each penetrate the shielding element from its end located counter to the plug-in direction to its end located in the plug-in direction. The shielding element comprises an electrically conducting material, and is arranged at an end of the carrier element located counter to the plug-in direction.

66. 发明授权

US11251572B2 Electrical connector with grounding features on the board-side wall of the housing 有权
公开(公告)号：US11251572B2
公开(公告)日：2022-02-15
申请号：US17022333
申请日：2020-09-16
申请人： DONGGUAN LEADER PRECISION INDUSTRY CO., LTD
发明人： Hong-Qiang Xu , Li-Jun Xu , Gao-Fei He , Meng-Jie Peng
IPC分类号： H01R13/6596 , H01R13/52 , H01R13/6598 , H01R24/60 , H01R13/6581 , H01R12/72 , H01R13/6591 , H01R13/658 , H01R13/502 , H01R13/516 , H01R107/00 , H01R13/02 , H01R13/648 , H01R13/6594
摘要： A connector includes an insulated member, a plurality of first conductive terminals, a plurality of second conductive terminals, a shielding shell, and a metal housing. The first conductive terminals are disposed on an upper surface of the insulated member and extending rearward. The second conductive terminals are disposed on a lower surface of the insulated member, extending rearward, and located below the first conductive terminals. The shielding shell is fitted over the insulated member, and the shielding shell has a plug end and a mounting end. The metal housing has a plurality of grounding structures, the metal housing is fitted over the mounting end of the shielding shell, and the grounding structures are completely located below the second conductive terminals.

67. 发明申请

US20210376531A1 SHIELDED ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF MANUFCTURING SAME 有权
公开(公告)号：US20210376531A1
公开(公告)日：2021-12-02
申请号：US16629824
申请日：2018-07-24
申请人： Delphi Technologies, LLC
发明人： William C. Lovitz , Patrick J. Reedy , Glenn E. Robison , Michael L. Mellott , Jeffrey A. Janis , Bruce D. Taylor , Steven P. Ragalyi , Christopher D. Hanton , Hoi Lui
IPC分类号： H01R13/6581 , H01R13/53 , H01R13/6598 , H01R13/6592 , H01R13/05 , H01R13/502 , H01R43/16 , H01R13/44
摘要： A shielded electrical connector assembly includes an electromagnetic shield integrally formed from a single sheet of conductive material. The shield has a main wall and four side walls surrounding the main wall. The shield defines an opening opposite the main wall having an opening perimeter that is greater than or equal to a main wall perimeter. One of the four side walls defines at least one side wall opening that is configured to receive a shielded wire cable. A method of manufacturing the shielded electrical connector assembly includes the steps of providing a single planar sheet of conductive material, providing a die and a punch, forming the sheet into a cupped shape having a main wall and four side walls surrounding the main wall using the die and the punch, and forming a side wall opening in one of the four side walls.

68. 发明授权

US11152729B2 Electrical connector and electrical connector assembly having a mating array of signal and ground contacts 有权
公开(公告)号：US11152729B2
公开(公告)日：2021-10-19
申请号：US16144566
申请日：2018-09-27
申请人： TE CONNECTIVITY CORPORATION
发明人： Rodney Ivan Martens , John Joseph Consoli , Arturo Pachon Munoz , Chad William Morgan , Douglas Edward Shirk
IPC分类号： H01R13/03 , H01R13/6587 , H01R13/514 , H01R13/658 , H01R13/6598
摘要： Electrical connector includes a housing and a mating array having a plurality of signal contacts and a plurality of ground contacts that are coupled to the housing. The signal contacts and the ground contacts are positioned for mating with signal conductors and ground conductors, respectively, of a mating connector. The ground contacts are plated with a ground-material composition and the signal contacts are plated with a signal-material composition. The ground-material composition is configured to cause a first low-level contact resistance (LLCR) while mated with the ground conductors during operation. The signal-material composition is configured to cause a second LLCR while mated with the signal conductors during operation. The second LLCR is less than the first LLCR during operation.

69. 发明授权

US10978833B2 Electromagnetic interference (EMI) grounding protection method for a connector using a conductive housing 有权
公开(公告)号：US10978833B2
公开(公告)日：2021-04-13
申请号：US16504288
申请日：2019-07-07
申请人： J.S.T. CORPORATION
发明人： Vikas Azad
IPC分类号： H01R13/6599 , B60R16/03 , H01R13/502 , H01R13/6581 , H01R13/6596 , H01R13/74 , H01R13/426 , H01R13/436 , H01R13/52 , H01R13/53 , H01R13/73 , H01R43/20 , H01R13/533 , H01R13/6598
摘要： An electromagnetic interference (EMI) grounding protection method for a connector assembly using a conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the conductive housing, the conductive plastic housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the conductive housing directly through conductive pads thereof, and ultimately to the metallic device.

70. 发明申请

US20210050691A1 METHODS AND APPARATUS FOR RF SHIELD AND CABLE ATTACHMENT SYSTEM 有权
公开(公告)号：US20210050691A1
公开(公告)日：2021-02-18
申请号：US16984649
申请日：2020-08-04
申请人： High Speed Interconnects, LLC
发明人： Antonio De La Rosa , Todd Albertson
IPC分类号： H01R13/6581 , H01R13/24 , H01R13/6598 , H05K3/34 , H01R12/52
摘要： A shield for a cable attachment system for attaching a cable to a component having a ball grid array (BGA). The shield may comprise an outer conductive surface, a first end configured to be coupled to a surface of the component, a second end that receives the cable, and an inner non-conductive material received within the shield adjacent the first end and encasing the connection of the cable to the BGA of the component. The cable may be configured to be coupled to the BGA of the component.

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