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71. 发明授权

US10081000B2 Methods, systems, and apparatuses for controlling substance mixing concentration 有权
公开(公告)号：US10081000B2
公开(公告)日：2018-09-25
申请号：US14443204
申请日：2013-11-15
申请人： Entegris, Inc.
发明人： Francisco Javier Machuca , Ronald Chiarello
IPC分类号： B01F15/00 , B01F15/04 , G05D11/13 , B01F15/02
CPC分类号： B01F15/0429 , B01F15/0022 , B01F15/00233 , B01F15/00246 , B01F15/00253 , B01F15/00259 , B01F15/00285 , B01F15/00292 , B01F15/026 , B01F2015/0221 , G05D11/138
摘要： Embodiments provide mixing methods, systems, apparatuses, devices and assemblies that enable high-accuracy mixing of two or more substances in a manner that controls the concentrations of one or more substances in the resulting mixture. A mixing apparatus (100) may enable mixing of two or more substances at a mixing zone or conduit (112). The mixing apparatus may include one or more sensors (120) for detecting one or more characteristics of the mixture during the mixing process. The sensors may detect the mixture characteristics continuously, at intervals or as prompted by a user. The mixture characteristics may be used, in the sensors or in control circuitry, to generate an indication of the concentration of a first constituent substance in the mixture. Based on the detected concentration, the mixing apparatus may automatically adjust a supply of the first substance to the mixing zone or conduit (112).

72. 发明授权

US10043696B2 Wafer container with tubular environmental control components 有权
公开(公告)号：US10043696B2
公开(公告)日：2018-08-07
申请号：US14337039
申请日：2014-07-21
申请人： ENTEGRIS, INC.
发明人： James A. Watson , John Burns , Martin L. Forbes , Matthew A. Fuller , Mark V. Smith
IPC分类号： B65D85/00 , H01L21/673
摘要： A wafer container utilizes a rigid polymer tubular tower with slots and a “getter” therein for absorbing and filtering moisture and vapors within the wafer container. The tower preferably utilizes a purge grommet at the base of the container and may have a check valve therein to control the flow direction of gas (including air) into and out of the container and with respect to the tower. The tower is sealingly connected with the grommet. The tower may have a getter media piece rolled in an elongate circular fashion forming or shaped as a tube and disposed within the tower and may have axially extending. The media can provide active and/or passive filtration as well as having capabilities to be recharged. Front opening wafer containers for 300 mm sized wafers generally have a pair of recesses on each of the left and right side in the inside rear of the container portions. These recesses are preferably utilized for elongate towers, such towers extending substantially from a bottom wafer position to a top wafer position. In alternative embodiment, a tubular shape of getter material is exposed within the front opening container without containment of the getter other than at the ends. The tubular getter form is preferably supported at discrete locations to maximize exposure to the internal container environment. A blocker member can selectively close the apertures. An elastomeric cap can facilitate securement of the tubular component in the container portion.

73. 外观设计

USD815385S1 Wafer support ring 有权
公开(公告)号：USD815385S1
公开(公告)日：2018-04-10
申请号：US29580872
申请日：2016-10-13
申请人： Entegris, Inc.
设计人： Eric Kirkland

74. 发明授权

US09802749B2 Liner-based liquid storage and dispensing systems with empty detection capability 有权
公开(公告)号：US09802749B2
公开(公告)日：2017-10-31
申请号：US14688778
申请日：2015-04-16
申请人： ENTEGRIS, INC
发明人： Minna Hovinen , John R. Kingery , Glenn M. Tom , Kevin T. O'Dougherty , Kirk Mikkelsen , Donald D. Ware , Peter C. Van Buskirk
IPC分类号： B65D83/00 , B01J4/02 , G01F23/18
CPC分类号： B65D83/0061 , B01J4/02 , B01J2219/00065 , B01J2219/00067 , B01J2219/00069 , B01J2219/00164 , G01F23/18
摘要： Fluid supply systems for storage and dispensing of chemical reagents and compositions, e.g., high purity liquid reagents and chemical mechanical polishing compositions used to manufacture microelectronic device products, having capability for detection of an empty or near-empty condition when the contained liquid is at or approaching depletion during dispensing operation. Fluid delivery systems employing empty detect arrangements are described, including pressure transducer monitoring of dispensed material intermediate the supply package and a servo-hydraulic dispense pump, or monitoring of dispenser chamber replenishment times in a dispenser being replenished on a cyclic schedule to flow material from the dispenser to a downstream tool utilizing the dispensed material.

75. 发明授权

US09765288B2 Compositions for cleaning III-V semiconductor materials and methods of using same 有权
公开(公告)号：US09765288B2
公开(公告)日：2017-09-19
申请号：US14648815
申请日：2013-12-04
申请人： ENTEGRIS, INC. , ATMI TAIWAN CO., LTD
发明人： Emanuel I. Cooper , Hsing-Chen Wu , Min-Chieh Yang , Sheng-Hung Tu , Li-Min Chen
IPC分类号： C11D7/04 , C11D7/26 , C11D7/32 , C11D3/00 , C11D7/08 , C11D11/00
CPC分类号： C11D7/04 , C11D3/0073 , C11D7/08 , C11D7/26 , C11D7/265 , C11D7/3209 , C11D7/3281 , C11D11/0047
摘要： Liquid compositions useful for the cleaning of residue and contaminants from a III-V microelectronic device material, such as InGaAs, without substantially removing the III-V material. The liquid compositions are improvements of the SC1 and SC2 formulations.

76. 发明授权

US09761417B2 AION coated substrate with optional yttria overlayer 有权
公开(公告)号：US09761417B2
公开(公告)日：2017-09-12
申请号：US14234023
申请日：2012-08-09
申请人： Nilesh Gunda
发明人： Nilesh Gunda
IPC分类号： H01J37/32 , C23C14/00 , C23C14/06 , C23C14/08 , C23C14/34 , C23C14/35
CPC分类号： H01J37/32495 , C23C14/0021 , C23C14/0676 , C23C14/083 , C23C14/3485 , C23C14/35 , H01J37/32477 , Y10T428/265
摘要： A fluorine plasma resistant coating on a substrate being a component in a semiconductor manufacturing system is disclosed. In one embodiment the composition includes an AlON coating that overlies a substrate, and an optional yttria coating layer that overlies the AlON coating, with a total coating thickness of about 5-6 microns.

77. 发明申请

US20170200601A1 AQUEOUS AND SEMI-AQUEOUS CLEANERS FOR THE REMOVAL OF POST-ETCH RESIDUES WITH TUNGSTEN AND COBALT COMPATIBILITY 审中-公开
公开(公告)号：US20170200601A1
公开(公告)日：2017-07-13
申请号：US15324588
申请日：2015-06-24
申请人： Entegris, Inc.
发明人： Lingyan SONG , Steven LIPPY , Emanuel I. COOPER
IPC分类号： H01L21/02 , C11D3/24 , C11D3/04 , C11D3/36 , C11D1/66 , C11D3/43 , C11D3/30 , B08B3/08 , C11D11/00
CPC分类号： H01L21/02068 , B08B3/08 , C11D1/008 , C11D1/667 , C11D3/042 , C11D3/046 , C11D3/245 , C11D3/30 , C11D3/361 , C11D3/3707 , C11D3/43 , C11D7/08 , C11D7/10 , C11D7/28 , C11D11/0047 , H01L21/02063
摘要： Cleaning compositions and processes for cleaning post-plasma etch residue from a microelectronic device having said residue thereon. The composition achieves highly efficacious cleaning of the residue material, including titanium-containing, copper-containing, tungsten-containing, and/or cobalt-containing post-etch residue from the microelectronic device while simultaneously not damaging the interlevel dielectric, metal interconnect material, and/or capping layers also present thereon.

78. 发明授权

US09691629B2 Compositions and methods for the selective removal of silicon nitride 有权
公开(公告)号：US09691629B2
公开(公告)日：2017-06-27
申请号：US14880698
申请日：2015-10-12
申请人： Entegris, Inc.
发明人： Emanuel I. Cooper , Eileen Sparks , William R. Bowers , Mark A. Biscotto , Kevin P. Yanders , Michael B. Korzenski
IPC分类号： H01L21/311 , C09K13/08 , B65D85/00 , G03F7/42 , H01L21/02
CPC分类号： H01L21/31111 , B65D85/70 , C09K13/08 , G03F7/422 , H01L21/0206 , H01L2924/0002 , H01L2924/00
摘要： Compositions useful for the selective removal of silicon nitride materials relative to polysilicon, silicon oxide materials and/or silicide materials from a microelectronic device having same thereon. The removal compositions include fluorosilicic acid, silicic acid, and at least one organic solvent. Typical process temperatures are less than about 100° C. and typical selectivity for nitride versus oxide etch is about 200:1 to about 2000:1. Under typical process conditions, nickel-based silicides as well as titanium and tantalum nitrides are largely unaffected, and polysilicon etch rates are less than about 1 Å min−1.

79. 再颁专利

USRE46427E1 Antioxidants for post-CMP cleaning formulations 有权
公开(公告)号：USRE46427E1
公开(公告)日：2017-06-06
申请号：US14595758
申请日：2015-01-13
申请人： ADVANCED TECHNOLOGY MATERIALS, INC.
发明人： David Angst , Peng Zhang , Jeffrey Barnes , Prerna Sonthalia , Emanuel Cooper , Karl Boggs
IPC分类号： C11D7/50 , C11D11/00 , C11D3/00 , C11D7/32
CPC分类号： C11D11/0047 , C11D3/0073 , C11D3/0078 , C11D3/0084 , C11D7/265 , C11D7/267 , C11D7/32 , C11D7/3209 , C11D7/3281
摘要： An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

80. 发明授权

US09650169B2 Nested blow molded liner and overpack and methods of making same 有权
公开(公告)号：US09650169B2
公开(公告)日：2017-05-16
申请号：US14950658
申请日：2015-11-24
申请人： ENTEGRIS, INC.
发明人： Glenn Tom , Greg Nelson , Wei Liu , Amy Koland , Don Ware , Daniel J. Durham , Tracy M. Momany , Chantel Ortega
IPC分类号： A47J41/02 , B65D1/02 , B65D77/06 , B65D83/00 , B67D1/04 , B67D7/02 , B29C49/24 , B29C49/58 , B65D23/02 , B29D22/00 , B65D83/38 , B65D53/02 , B67D1/08 , B65D83/14 , B29L31/00 , B29C49/06 , B29L9/00 , B29K103/04 , B29K105/12 , B29K309/08
CPC分类号： B65D1/0215 , B29C49/06 , B29C49/24 , B29C49/58 , B29C2049/2404 , B29C2049/2477 , B29C2049/5837 , B29C2049/5841 , B29D22/003 , B29K2103/04 , B29K2105/12 , B29K2309/08 , B29K2995/0067 , B29K2995/0069 , B29L2009/001 , B29L2031/712 , B29L2031/7158 , B65D1/023 , B65D23/02 , B65D53/02 , B65D77/06 , B65D83/0055 , B65D83/14 , B65D83/38 , B67D1/0462 , B67D7/025 , B67D2001/0828
摘要： The present disclosure relates to an integrated liner-based system having an overpack and a liner provided within the overpack, the liner comprising a mouth and a liner wall forming an interior cavity of the liner and having a thickness such that the liner is substantially self-supporting in an expanded state, but is collapsible at a pressure of less than about 20 psi. The liner and overpack may be made by blow molding the liner and the overpack at the same time using nested preforms.

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