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71. 发明申请

US20120263624A1 Ag-Au-Pd TERNARY ALLOY BONDING WIRE 有权
标题翻译： Ag-Au-Pd合金接合线
公开(公告)号：US20120263624A1
公开(公告)日：2012-10-18
申请号：US13496327
申请日：2011-11-01
申请人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
发明人： Jun Chiba , Satoshi Teshima , Tasuku Kobayashi , Yuki Antoku
IPC分类号： C22C5/06
CPC分类号： C22C5/06 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/431 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/48507 , H01L2224/48599 , H01L2224/48624 , H01L2224/48824 , H01L2224/85075 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/00014 , H01L2924/01007 , H01L2924/01046 , H01L2924/01039 , H01L2924/01064 , H01L2924/0106 , H01L2924/01062 , H01L2924/01004 , H01L2924/01083 , H01L2924/00 , H01L2924/00015 , H01L2924/01204 , H01L2924/013 , H01L2924/20759 , H01L2924/2076 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2924/01205 , H01L2924/01022 , H01L2924/01077 , H01L2924/00013
摘要： An Ag—Au—Pd ternary alloy bonding wire for semiconductor devices made from 4-10 mass % of gold having a purity of 99.999 mass % or higher, 2-5 mass % of palladium having a purity of 99.99 mass % or higher, and remaining mass % of silver (Ag) having a purity of 99.999 mass % or higher; and this wire contains 15-70 mass ppm of oxidizing non-noble metallic elements, and is thermally annealed before being continuously drawn through dies, and is thermally tempered after being continuously drawn through the dies, and this wire is useful for ball bonding in a nitrogen atmosphere; Ag2Al and a Pd rich layer produced in the interface between the Ag—Au—Pd ternary alloy wire and an aluminum pad suppress the corrosion development between the Ag2Al intermetallic compound layer and the wire.
摘要翻译：由纯度为99.999质量％以上的4-10质量％的金，纯度为99.99质量％以上的钯的2-5质量％的半导体装置用Ag-Au-Pd三元合金接合线，以及纯度为99.999质量％以上的银（Ag）的剩余质量％该线材含有15-70质量ppm的氧化性非贵金属元素，并且在连续拉伸模具之前进行热退火，并且在连续拉伸模具之后进行热回火，并且该线材可用于球形粘合氮气; 在Ag-Au-Pd三元合金线和铝焊盘之间的界面产生的Ag 2 Al和富Pd层抑制了Ag2Al金属间化合物层和电线之间的腐蚀发展。

72. 发明申请

US20120219453A1 SILVER POWDER AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：银粉及其制造方法
公开(公告)号：US20120219453A1
公开(公告)日：2012-08-30
申请号：US13468468
申请日：2012-05-10
申请人： Takatoshi Fujino , Kozo Ogi
发明人： Takatoshi Fujino , Kozo Ogi
IPC分类号： C22C5/06 , B32B15/02
CPC分类号： H01G4/0085 , B22F1/0011 , B22F9/24 , C01P2006/13 , C22C5/06 , H01B1/22 , H05K1/092 , Y10T428/12014
摘要： After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100° C., and lower than 400° C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50° C. to 800° C., and has no heating peak when the silver powder is heated from 50° C. to 800° C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800° C. The silver powder has a tap density of not less than 2 g/cm3 and a BET specific surface area of not greater than 5 m2/g.
摘要翻译：将还原剂加入到含有银离子的水反应体系中以还原形成银粒子后，将银粒子干燥，得到银粉末，其在高于100℃的温度下进行热处理，低于 400℃。这样热处理的银粉在50℃至800℃的温度下具有不大于1.5％的最大热膨胀系数，并且当银粉从 50℃至800℃。当银粉被点燃直到银粉的重量恒定在800℃时，银粉的灼烧损失不大于1.0％。银粉的振实密度为不小于2g / cm 3，BET比表面积不大于5m 2 / g。

73. 发明申请

US20120148443A1 NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES 审中-公开
公开(公告)号：US20120148443A1
公开(公告)日：2012-06-14
申请号：US13290510
申请日：2011-11-07
申请人： David R. Whitcomb
发明人： David R. Whitcomb
IPC分类号： C22C5/06 , D02G3/00 , C22B11/00 , B82Y30/00
CPC分类号： B22F1/0025 , B22F9/24 , B22F2998/00 , B82Y30/00 , C22C1/0466 , C22C5/06 , Y10T428/298 , B22F2009/245 , B22F2201/02
摘要： Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.

74. 发明申请

US20120148438A1 NANOWIRE PREPARATION METHODS, COMPOSITIONS, AND ARTICLES 有权
公开(公告)号：US20120148438A1
公开(公告)日：2012-06-14
申请号：US13290062
申请日：2011-11-05
申请人： David R. Whitcomb
发明人： David R. Whitcomb
IPC分类号： C22C9/00 , C22B15/00 , C22C5/02 , C22B11/00 , C22C5/06
CPC分类号： B22F1/0025 , B22F9/24 , B22F2998/00 , B82Y30/00 , C22C1/0466 , C22C5/06 , B22F2009/245 , B22F2201/02
摘要： Nanomaterial preparation methods, compositions, and articles are disclosed and claimed. Such methods can provide nanomaterials with improved morphologies relative to previous methods. Such materials are useful in electronic applications.

75. 发明授权

US08136370B2 Silver-palladium alloy 有权
标题翻译：银 - 钯合金
公开(公告)号：US08136370B2
公开(公告)日：2012-03-20
申请号：US12371396
申请日：2009-02-13
申请人： Charles Bennett
发明人： Charles Bennett
IPC分类号： C22C5/06
CPC分类号： C22C5/08 , A44C27/003 , C22C5/06
摘要： A silver-palladium alloy formulated to provide an alloy with a whiter color and superior casting and fabrication properties as compared to nickel-based white gold and also to impart to an article of jewelry or the like favorable properties afforded by white gold. The alloy generally includes silver and palladium, with silver being the predominant component. In some embodiments, the alloy contains about 75%-85% silver and about 5%-15% palladium by weight.
摘要翻译：一种银 - 钯合金配制成提供与镍基白金相比更白和更优异的铸造和制造性能的合金，并且还赋予由白金提供的优质的首饰等物品。合金通常包括银和钯，银是主要成分。在一些实施方案中，合金含有约75％-85％的银和约5％-15％的钯。

76. 发明申请

US20110250290A1 DISINFECTANT COMPOSITIONS 审中-公开
标题翻译：消毒剂组合物
公开(公告)号：US20110250290A1
公开(公告)日：2011-10-13
申请号：US11913161
申请日：2011-01-14
申请人： Lyriam L. Marques , Merle E. Olson , Michael W. Harding
发明人： Lyriam L. Marques , Merle E. Olson , Michael W. Harding
IPC分类号： A01N59/16 , A01P1/00 , C22C5/06
CPC分类号： A01N59/16 , A23B7/157 , A23B9/30 , A23V2002/00 , A61L2/0082 , A61L2/16 , A61L2/238 , C02F1/505 , C02F2303/20 , A01N25/34 , A01N2300/00
摘要： The invention is a method and composition for treating biofilm using a silver deposition compound. In preferred embodiments of the invention, the anti-biofilm agent is used to preserve or disinfect plant material, including seeds, leaves, stems, vessels, flowers, roots and fruits.
摘要翻译：本发明是一种使用银沉积化合物处理生物膜的方法和组合物。在本发明的优选实施方案中，抗生物膜剂用于保存或消毒植物材料，包括种子，叶，茎，血管，花，根和果实。

77. 发明申请

US20110101543A1 CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE 有权
标题翻译：连接材料和半导体器件
公开(公告)号：US20110101543A1
公开(公告)日：2011-05-05
申请号：US12990082
申请日：2009-04-28
申请人： Hiroki Hayashi , Kaoru Konno , Ayako Taira
发明人： Hiroki Hayashi , Kaoru Konno , Ayako Taira
IPC分类号： H01L23/488 , C09K5/00 , C22C5/06 , B32B5/16
CPC分类号： H05K3/321 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01L23/295 , H01L23/49513 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L33/62 , H01L2224/04026 , H01L2224/05639 , H01L2224/2731 , H01L2224/27318 , H01L2224/2732 , H01L2224/2929 , H01L2224/29294 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/2939 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/83464 , H01L2224/8384 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H05K2201/0224 , H05K2203/1131 , Y10T428/2982 , H01L2924/00012 , H01L2224/29298 , H01L2924/00 , H01L2224/2919 , H01L2224/29101 , H01L2924/3512 , H01L2224/45099 , H01L2224/05599 , H01L2924/00011
摘要： The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.
摘要翻译：本发明提供了一种连接材料，其包括通过X射线光电子能谱法测量的氧状态比小于15％的金属颗粒，特别是包括已经经过去除表面氧化膜的处理的金属颗粒的连接材料，为了提供具有高导热系数的连接材料的目的，即使在高达200℃的固化温度下接合而不施加负载，并且具有足够的接合强度即使固化产物已经在260℃加热，以及使用它的半导体器件也是如此。

78. 发明申请

US20110064603A1 PROCESS FOR PREPARING NANOPARTICLES 有权
标题翻译：制备纳米颗粒的方法
公开(公告)号：US20110064603A1
公开(公告)日：2011-03-17
申请号：US12735100
申请日：2008-12-22
申请人： Damian John Aherne , Deirdre Marie Ledwith , John Moffat Kelly
发明人： Damian John Aherne , Deirdre Marie Ledwith , John Moffat Kelly
IPC分类号： B22F9/24 , C22C5/06 , B82Y20/00
CPC分类号： B22F9/24 , B22F1/0018 , B22F2001/0037 , B22F2301/255 , B82Y30/00 , B82Y40/00 , Y10S977/896
摘要： A process for producing nanoparticles comprises the steps of preparing silver seeds in the presence of a water soluble polyanionic polymer and growing the silver seeds to form nanoparticles. The polyanionic polymer may be poly (sodium styrenesulphonate).
摘要翻译：制备纳米颗粒的方法包括以下步骤：在水溶性聚阴离子聚合物的存在下制备银晶种，并生长银晶种以形成纳米颗粒。聚阴离子聚合物可以是聚（苯乙烯磺酸钠）。

79. 发明申请

US20110048982A1 NANOSTRUCTURED SORBENT MATERIALS FOR CAPTURING ENVIRONMENTAL MERCURY VAPOR 有权
公开(公告)号：US20110048982A1
公开(公告)日：2011-03-03
申请号：US12919831
申请日：2008-10-07
申请人： Robert H. Hurt , Steven P. Hamburg , Love Sarin , Indrek Kulaots
发明人： Robert H. Hurt , Steven P. Hamburg , Love Sarin , Indrek Kulaots
IPC分类号： B65D69/00 , C01B17/00 , C01B19/02 , B01J20/00 , C22C9/00 , C22C5/06 , C22C19/03 , C22C18/00 , B82Y30/00
CPC分类号： H01J61/26 , B01D39/2006 , B01J20/0262 , B32B1/02 , B32B5/18 , B32B5/24 , B32B7/00 , B32B7/02 , B32B27/06 , B32B29/002 , B32B2255/00 , B32B2260/00 , B32B2264/10 , B32B2264/105 , B32B2264/108 , B32B2266/0228 , B32B2307/554 , B32B2432/00 , B32B2439/46 , B32B2439/62 , B65D85/42 , C22B3/24 , C22B7/001 , C22B43/00 , Y02P10/214 , Y02P10/234 , Y10S977/773
摘要： The present invention is a method and material for using a sorbent material to capture and stabilize mercury. The method for using sorbent material to capture and stabilize mercury contains the following steps. First, the sorbent material is provided. The sorbent material, in one embodiment, is nano-particles. In a preferred embodiment, the nano-particles are unstabilized nano-Se. Next, the sorbent material is exposed to mercury in an environment. As a result, the sorbent material captures and stabilizes mercury from the environment. In the preferred embodiment, the environment is an indoor space in which a fluorescent has broken.

80. 发明申请

US20110030853A1 METHOD OF PRODUCING PRECIOUS METAL ALLOY OBJECTS 审中-公开
标题翻译：生产精密金属合金物体的方法
公开(公告)号：US20110030853A1
公开(公告)日：2011-02-10
申请号：US12936967
申请日：2009-03-26
申请人： Bo Carlsson
发明人： Bo Carlsson
IPC分类号： C22C5/00 , B22D23/00 , C22C5/02 , C22C5/06
CPC分类号： C22C5/02 , B22D27/003 , B23K35/383 , C21D1/74 , C22C1/02 , C22C5/06 , C22F1/14
摘要： The present invention provides a method for manufacturing a biocompatible precious metal alloy object. According to a first aspect melting of alloying elements and casting of the biocompatible precious metal alloy are carried out in a process chamber (11) being provided with a process gas of predetermined composition. A burning flame (19) of a hydrocarbon-containing gas provides low oxygen and water content. According to a second aspect post-processing of a precious metal alloy is made in atmosphere provided by the process gas to form the biocompatible precious metal alloy object. The biocompatible precious metal alloy object manufactured according to the invention has a low probability of causing sensitisation when in contact with the human body.
摘要翻译：本发明提供一种制造生物相容性贵金属合金物体的方法。根据第一方面，合金元素的熔化和生物相容性贵金属合金的铸造在具有预定组成的工艺气体的处理室（11）中进行。含烃气体的燃烧火焰（19）提供低的氧和水含量。根据第二方面，在由工艺气体提供的气氛中制备贵金属合金的后处理以形成生物相容的贵金属合金物体。根据本发明制造的生物相容性贵金属合金物体在与人体接触时具有低致敏性的可能性。

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