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71. 发明授权

US07352257B2 Flexible print cable having alternating signal and ground conductors and connector for the same 有权
标题翻译：灵活的打印电缆和连接器相同
公开(公告)号：US07352257B2
公开(公告)日：2008-04-01
申请号：US11300311
申请日：2005-12-15
申请人： Koki Sato , Koichi Kiryu , Hideo Miyazawa
发明人： Koki Sato , Koichi Kiryu , Hideo Miyazawa
IPC分类号： H01P3/08 , H01P1/04
CPC分类号： H05K1/0219 , H05K1/118 , H05K2201/09236 , H05K2201/097
摘要： A flexible print cable includes signal lines and ground lines. The signal lines and the ground lines are disposed alternately on each of an upper surface and an under surface of a film. The positions of the signal lines on the upper surface correspond to the positions of the ground lines on the under surface. The positions of the signal lines on the under surface correspond to the positions of the ground lines on the upper surface. The ground lines are wider than the signal lines. An edge part of one of the ground lines on the upper surface in a width direction overlaps a part of one of the ground lines on the under surface. Another edge part of the ground line on the upper surface in the width direction overlaps a part of another one of the ground lines on the under surface.
摘要翻译：灵活的打印电缆包括信号线和接地线。信号线和接地线交替地设置在膜的上表面和下表面中的每一个上。上表面上的信号线的位置对应于下表面上的接地线的位置。下表面上的信号线的位置对应于上表面上的接地线的位置。接地线比信号线宽。在宽度方向的上表面上的一条接地线的边缘部分与下表面上的一条接地线的一部分重叠。在宽度方向的上表面上的地线的另一边缘部分与下表面上另一条接地线的一部分重叠。

72. 发明授权

US07315224B2 High data rate interconnecting device 有权
标题翻译：高数据速率互连设备
公开(公告)号：US07315224B2
公开(公告)日：2008-01-01
申请号：US10785724
申请日：2004-02-23
申请人： Dmitry Gurovich , Yaakov Haggay
发明人： Dmitry Gurovich , Yaakov Haggay
IPC分类号： H01P1/10 , H01P1/04 , H01R24/00
CPC分类号： H01R13/6466 , H01R13/6474 , H01R13/719 , H01R2201/04 , H05K1/0228 , H05K2201/10053 , H05K2201/10189
摘要： An interconnect apparatus for providing a communication path for data signals in a predetermined frequency band, that includes a first and a second sections of a transmission line, connected at one end to first and second data transceiving devices, respectively. A switch, such as a mechanical, electro-mechanical, electronic, electro-magnetic and electro-optical switch, having conductive/non-conductive states, is provided for connecting/disconnecting between the other ends of the first and the second sections, for providing a data communication path between the data transceiving devices while being in its conductive state a third and a fourth sections of a transmission line, each of which connected at one end to a contact of the switch and at the other end to a first and a second connector, respectively. A compensation circuitry is provided for compensating, within the frequency band, parasitic effects caused by the switch and/or cord, while the switch is in its conductive state or, while the switch is in its non-conductive state and while a connection between the first and the second connectors is provided by a cord having predetermined characteristics, such that the compensation circuitry compensates the influence of parasitic effects introduced along the communication path by the switch while being in its non-conductive state and while the cord is a part of the communication path or, by the combination of the third and a fourth sections and the connectors while the switch is in its conductive state.
摘要翻译：一种互连装置，用于提供预定频带中的数据信号的通信路径，该通信路径包括一端连接到第一和第二数据收发装置的传输线的第一和第二部分。提供具有导电/非导通状态的诸如机械，机电，电子，电磁和电光开关的开关用于在第一和第二部分的另一端之间的连接/断开，用于在数据收发装置处于其导电状态的同时，在传输线的第三和第四部分提供数据通信路径，每个传输线的一端连接到开关的触点，另一端连接到第一和第二部分第二连接器。提供补偿电路，用于在开关处于其导通状态的同时在频带内补偿由开关和/或线引起的寄生效应，或者当开关处于非导通状态时，第一连接器和第二连接器由具有预定特性的线提供，使得补偿电路在处于非导通状态的同时补偿由开关在通信路径上引入的寄生效应的影响，并且当线是通过第三和第四部分和连接器的组合，同时开关处于其导电状态。

73. 发明申请

US20070085635A1 Waveguide coupler 有权
标题翻译：波导耦合器
公开(公告)号：US20070085635A1
公开(公告)日：2007-04-19
申请号：US11637710
申请日：2006-12-13
申请人： Tsutomu Tamaki
发明人： Tsutomu Tamaki
IPC分类号： H01P1/04
CPC分类号： H01P1/042 , H05K1/0237 , H05K1/0243 , H05K3/368
摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, to reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.
摘要翻译：通常，通过将电介质基板安装在载体上并将其固定到具有螺钉的波导适配器上，形成在多个电介质基板中的波导端子连接在一起。在本发明中，为了降低成本和提高机械加工性，在形成于一个电介质基板1b的波导端子2b周围设置多个焊料7，将具有波导端子2a的另一个电介质基板1a放置在焊料7，从而通过焊接连接波导端子。

74. 发明申请

US20060097828A1 Waveguide coupler 有权
公开(公告)号：US20060097828A1
公开(公告)日：2006-05-11
申请号：US11305166
申请日：2005-12-19
申请人： Tsutomu Tamaki
发明人： Tsutomu Tamaki
IPC分类号： H01P1/04
CPC分类号： H01P1/042 , H05K1/0237 , H05K1/0243 , H05K3/368
摘要： Conventionally, waveguide terminals formed in a plurality of dielectric substrates are joined together by mounting the dielectric substrates on carriers and fastening them to a waveguide adapter with screws. In the present invention, ot reduce cost and improve machinability, a plurality of solders 7 are disposed around the waveguide terminal 2b formed in one dielectric substrate 1b, and the other dielectric substrate 1a having the waveguide terminal 2a is placed across the solders 7 to thereby connect the waveguide terminals by soldering.

75. 发明授权

US06980068B2 System for and method of interconnecting high-frequency transmission lines 有权
标题翻译：互连高频传输线的系统和方法
公开(公告)号：US06980068B2
公开(公告)日：2005-12-27
申请号：US10373067
申请日：2003-02-26
申请人： Yasunori Miyazawa , Katsuji Kaminishi
发明人： Yasunori Miyazawa , Katsuji Kaminishi
IPC分类号： H05K1/14 , H01P1/04 , H01P5/02 , H01P5/08 , H01R9/05 , H05K1/00 , H05K1/02 , H05K3/00 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/42 , H01P3/08
CPC分类号： H05K1/0251 , H01L2224/45144 , H01L2224/48091 , H01P1/047 , H01P5/02 , H01P5/085 , H01R9/0515 , H01R24/50 , H05K1/0222 , H05K1/0298 , H05K3/0052 , H05K3/325 , H05K3/3405 , H05K3/3447 , H05K3/368 , H05K3/403 , H05K3/42 , H05K2201/0311 , H05K2201/0715 , H05K2201/09618 , H05K2201/09809 , H05K2201/10303 , H05K2201/10356 , H01L2924/00014 , H01L2924/00
摘要： A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.
摘要翻译：切割通孔形成在第一传输线的多层电路板的端部，并且在切割通孔和接地图案之间设置间隙，以实现第一和第二传输线之间的阻抗匹配。可以是带状线或微带线的第一传输线的切断通路和第二传输线的电极彼此连接，并且第一和第二传输线的接地图形彼此连接。第一和第二传输线具有彼此基本同轴地定位的各个信号线。

76. 发明授权

US06933813B2 Interconnection structure with etch stop 有权
标题翻译：具有蚀刻停止的互连结构
公开(公告)号：US06933813B2
公开(公告)日：2005-08-23
申请号：US10714376
申请日：2003-11-12
申请人： William Edward Burdick, Jr. , James Wilson Rose , Kevin Matthew Durocher , Raymond Albert Fillion
发明人： William Edward Burdick, Jr. , James Wilson Rose , Kevin Matthew Durocher , Raymond Albert Fillion
IPC分类号： H01L23/52 , H01H20060101 , H01L21/3205 , H01L21/48 , H01L21/60 , H01L23/12 , H01L23/34 , H01L23/50 , H01L23/538 , H01P1/04 , H05K3/06 , H05K3/38
CPC分类号： H01L27/14636 , H01L24/19 , H01L24/82 , H01L27/14618 , H01L2224/04105 , H01L2224/18 , H01L2224/92144 , H01L2924/01004 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： An interconnection structure includes: a dielectric layer; a first metallization pattern on the dielectric layer, the first metallization pattern including at least one etch stop having a perimeter defining at least one etch stop opening; a cured adhesive on a portion of the dielectric layer, the adhesive not present in an area aligned with the at least one etch stop; and at least one electrical device being attached to the dielectric layer by the adhesive such that an active area of the at least one electrical device is aligned with the etch stop perimeter. The active area of the at least one electrical device may further be aligned with at least one predetermined area defined by an optional additional portion of cured adhesive, the additional portion of the cured adhesive being adhesively attached to the dielectric layer and not adhesively attached to the at least one electrical device.
摘要翻译：互连结构包括：介电层; 所述第一金属化图案包括至少一个具有限定至少一个蚀刻停止开口的周边的蚀刻停止件; 在所述电介质层的一部分上的固化的粘合剂，所述粘合剂不存在于与所述至少一个蚀刻停止件对准的区域中; 并且至少一个电气装置通过所述粘合剂附接到所述电介质层，使得所述至少一个电气装置的有效面积与所述蚀刻停止周界对准。至少一个电气装置的活动区域还可以与由固化的粘合剂的任选的附加部分限定的至少一个预定区域对准，固化的粘合剂的附加部分粘合地附着到电介质层上，而不粘附到至少一个电气设备。

77. 发明授权

US06933450B2 High-frequency signal transmitting device 有权
标题翻译：高频信号发送装置
公开(公告)号：US06933450B2
公开(公告)日：2005-08-23
申请号：US10603256
申请日：2003-06-25
申请人： Takehiro Okumichi , Hiroyuki Tanaka , Yuji Kishida
发明人： Takehiro Okumichi , Hiroyuki Tanaka , Yuji Kishida
IPC分类号： H01L23/498 , H01L23/552 , H01L23/66 , H01P1/04 , H01R12/04 , H05K1/02 , H05K1/11 , H05K7/06
CPC分类号： H01L23/552 , H01L23/49827 , H01L23/66 , H01L24/48 , H01L2223/6616 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/16195 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01P1/047 , H05K1/0222 , H05K1/0251 , H05K1/115 , H05K2201/096 , H05K2201/09618 , H05K2201/09809 , H05K2201/09845 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Signal wiring conductors are provided at opposing positions on the upper surface of the uppermost dielectric layer and on the lower surface of the bottommost dielectric layer, and grounding conductors surrounding grounding-conductor non-forming areas are provided on the upper surfaces of intermediate dielectric layers and the bottommost dielectric layer. These grounding conductors form an electromagnetically shielded space by being connected by grounding-conductor via conductors vertically penetrating the respective dielectric layers around the grounding-conductor non-forming areas, and signal via conductors are so provided in the respective dielectric layers as to penetrate this electromagnetically shielded space. A signal via conductor of the uppermost dielectric layer is connected with the signal wiring conductor on the upper surface thereof via a signal-wiring connecting conductor, and a signal via conductor of the bottommost dielectric layer is connected with the signal wiring conductor on the lower surface thereof via a signal-wiring connecting conductor.
摘要翻译：信号布线导体设置在最上层电介质层的上表面和最下面的电介质层的下表面的相对位置处，并且在中间电介质层的上表面上设置有围绕接地导体非形成区域的接地导体，最底层的介电层。这些接地导体通过接地导体形成电磁屏蔽空间，该导体通过垂直地穿过接地导体非形成区域周围的各个介电层的导体连接，并且信号通孔导体设置在相应的电介质层中，以贯穿该电磁屏蔽空间。最上面的电介质层的信号通孔导体经由信号布线连接导体与其上表面的信号布线导体连接，最下面的电介质层的信号通孔导体与下表面的信号布线导体连接通过信号线连接导体。

78. 发明申请

US20050151604A1 Triangular conforming transmission structure 审中-公开
标题翻译：三角形符合传输结构
公开(公告)号：US20050151604A1
公开(公告)日：2005-07-14
申请号：US11023878
申请日：2004-12-23
申请人： David Brunker
发明人： David Brunker
IPC分类号： H01P1/04 , H01P3/02 , H05K1/02 , H05K3/10 , H01P7/10
CPC分类号： H05K1/0219 , H01P3/02 , H05K1/024 , H05K3/107 , H05K2201/09036 , H05K2201/09236
摘要： A reduced-cross-sectional area, triad transmission line is formed by plating or metallizing surface area of a substrate, along the edge of a slot cut through the substrate. The cross-sectional area of such conductors that faces each other is reduced, reducing the signal coupling between them when they are carrying high-frequency signals. An intervening ground plane between them is provided by metallization on the slot bottom that is held at ground potential.
摘要翻译：通过沿着穿过衬底切割的槽的边缘电镀或金属化衬底的表面积来形成截面积减小的三线形传输线。相互面对的这种导体的横截面积减小，当它们承载高频信号时，减小它们之间的信号耦合。它们之间的中间接地平面由保持在地电位的槽底上的金属化提供。

79. 发明授权

US06917265B2 Microwave frequency surface mount components and methods of forming same 有权
标题翻译：微波频率表面贴装元件及其形成方法
公开(公告)号：US06917265B2
公开(公告)日：2005-07-12
申请号：US10443510
申请日：2003-05-22
申请人： Antonio Almeida , Shankar Joshi , Meta Rohde , Mahadevan Sridharan
发明人： Antonio Almeida , Shankar Joshi , Meta Rohde , Mahadevan Sridharan
IPC分类号： H01P1/04 , H11P5/08
CPC分类号： H01P1/047
摘要： A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.
摘要翻译：微波频率装置包括：具有电介质层和布置在电介质层的相对的第一和第二侧上的导电膜的第一衬底，第一衬底的电介质层的第一侧上的导电膜包括至少一条信号线 ; 以及具有电介质层的第二基板，设置在所述电介质层的第一和第二相对侧中的至少一个上的导电膜，以及已经去除所述电介质层和导电膜的至少一个切口，其中所述第一和第二衬底被结合在一起以形成接合组件，使得（i）第一衬底的信号线的一部分被夹在第一和第二衬底的电介质层之间，并且（ii）至少一个切口露出一个信号线的一部分，从而形成微带部分。还公开了一种形成方法。

80. 发明授权

US06894590B2 Apparatus and method to introduce signals into a shielded RF circuit 失效
标题翻译：将信号引入屏蔽RF电路的装置和方法
公开(公告)号：US06894590B2
公开(公告)日：2005-05-17
申请号：US10449544
申请日：2003-05-30
申请人： Lewis R. Dove , Robert E. Alman , James P. Stephens , Michael T. Powers , Michael B. Whitener
发明人： Lewis R. Dove , Robert E. Alman , James P. Stephens , Michael T. Powers , Michael B. Whitener
IPC分类号： H01P5/08 , H01P1/04
CPC分类号： H01P5/085 , Y10T29/49117
摘要： An interface to a microcircuit formed on a substrate supporting a ground plane. The substrate supports a dielectric structure having gold coated sloped sidewalls electrically connected to the ground plane. A transmission line, connected to the microcircuit, is supported by the dielectric structure. A coaxial cable is connected to the transmission line. The coaxial cable having an end stripped at an angle substantially the same as the sloped side walls of the dielectric structure, wherein the exposed length of the center conductor is bonded to the transmission line, and the outer conductor of the coax cable is bonded to the gold plating on the dielectric structure such that the angled portion of the coax cable mates with the bevel of the thick film dielectric.
摘要翻译：与支撑地平面的基板上形成的微电路的界面。衬底支撑具有电连接到接地平面的金涂覆的倾斜侧壁的电介质结构。连接到微电路的传输线由电介质结构支撑。同轴电缆连接至传输线。所述同轴电缆的端部以与所述电介质结构的倾斜侧壁大致相同的角度剥离，其中所述中心导体的所述暴露长度结合到所述传输线，并且所述同轴电缆的外导体被接合到在电介质结构上镀金，使得同轴电缆的倾斜部分与厚膜电介质的斜面配合。

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