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71. 发明授权

US08278555B2 Electric wire conductor and a method of producing the same 有权
标题翻译：电线导体及其制造方法
公开(公告)号：US08278555B2
公开(公告)日：2012-10-02
申请号：US12312033
申请日：2007-10-30
申请人： Yasuyuki Otsuka , Yoshihiro Nakai , Taichirou Nishikawa
发明人： Yasuyuki Otsuka , Yoshihiro Nakai , Taichirou Nishikawa
IPC分类号： H01B5/00
CPC分类号： H01B1/023 , C21D9/60 , C22C21/02 , C22C21/08 , C22F1/00 , C22F1/02 , C22F1/04 , Y02P10/253
摘要： A conductor includes elemental wires made from an aluminum alloy containing Si whose content is 0.3-1.2 mass %, Mg whose content makes an Mg/Si weight ratio in a range from 0.8 to 1.8, and a remainder essentially including Al and an unavoidable impurity. The conductor has tensile strength of 240 MPa or more, breaking elongation of 10% or more, impact absorption energy of 8 J/m or more, and electrical conductivity of 40% IACS or more. The production method includes the step of preparing a strand by bunching elemental wires with the above composition, and the step of subjecting the wire to solution treatment, quenching, and aging heat treatment. Solution treatment temperature is 500-580° C., and aging heat treatment temperature is 150-220° C. Heating in solution treatment is high frequency induction heating.
摘要翻译：导体包括由包含Si为0.3-1.2质量％的Si的铝合金制成的元素线，Mg的含量使得Mg / Si重量比在0.8至1.8的范围内，剩余部分基本上包括Al和不可避免的杂质。导体的拉伸强度为240MPa以上，断裂伸长率为10％以上，冲击吸收能量为8J / m以上，导电率为40％IACS以上。制造方法包括通过用上述组成聚束元素线制备股线的步骤，以及对钢丝进行固溶处理，淬火和时效热处理的步骤。固溶处理温度为500-580℃，时效热处理温度为150-220℃。固溶处理中加热是高频感应加热。

72. 发明申请

US20120227481A1 Smooth Wireline 有权
标题翻译：平滑有线
公开(公告)号：US20120227481A1
公开(公告)日：2012-09-13
申请号：US13502183
申请日：2009-08-18
申请人： Daniel F. Dorffer , Lawrence Charles Rose
发明人： Daniel F. Dorffer , Lawrence Charles Rose
IPC分类号： E21B47/00 , H01B5/00
CPC分类号： H01B7/226 , D07B1/08 , D07B1/147 , H01B7/046
摘要： A cable includes a conductor. A plurality of inner armor wires is wrapped around the conductor. At least some of the plurality of inner armor wires have non-circular and non-rectangular cross-sectional shapes. A plurality of outer armor wires are wrapped around the inner armor wires. At least some of the plurality of outer armor wires have non-circular and non-rectangular cross-sectional shapes.
摘要翻译：电缆包括导线。导体周围缠绕着多条内装线。多个内装饰线中的至少一些具有非圆形和非矩形横截面形状。多个外装线缠绕在内装甲线上。多个外护套线中的至少一些具有非圆形和非矩形横截面形状。

73. 发明申请

US20120222885A1 Transparent conductive film for optoelectronic device 审中-公开
标题翻译：透明导电膜用于光电器件
公开(公告)号：US20120222885A1
公开(公告)日：2012-09-06
申请号：US13064727
申请日：2011-04-11
申请人： Wingkeung MAK , Hotong LEE
发明人： Wingkeung MAK , Hotong LEE
IPC分类号： H01B5/00 , B82Y30/00
CPC分类号： H01L51/5212 , G02F1/13439
摘要： A transparent conductive (TC) film includes a main transparent conductive layer and a plurality of conductors electrically contacting with the main transparent conductive layer. The conductors are disposed on the surface of the main transparent conductive layer separately from each other. The transparent conductive film of the present invention has numerous separate conductors to collect electrical current which flow in the TC film, thereby reducing the internal resistance of the TC film while keeping the light transmission unchanged. Furthermore, the new conductor layout reduces the risk of the TC film from high current density damages, thereby achieving better reliability.
摘要翻译：透明导电（TC）膜包括主透明导电层和与主透明导电层电接触的多个导体。导体分别设置在主透明导电层的表面上。本发明的透明导电膜具有许多单独的导体，以收集在TC膜中流动的电流，从而在保持光透射率不变的同时降低TC膜的内阻。此外，新的导体布局降低了TC膜的高电流密度损坏的风险，从而实现更好的可靠性。

74. 发明申请

US20120211260A1 SHIELD WIRE, METHOD FOR PROCESSING TERMINAL TREATMENT OF BRAID OF THE SAME AND APPARATUS FOR PROCESSING TERMINAL TREATMENT OF BRAID OF THAT 审中-公开
公开(公告)号：US20120211260A1
公开(公告)日：2012-08-23
申请号：US13461246
申请日：2012-05-01
申请人： Nobuhiro KAWASE , Hirofumi HIRAYAMA
发明人： Nobuhiro KAWASE , Hirofumi HIRAYAMA
IPC分类号： H01B5/00
CPC分类号： H01R9/0509 , H01R9/0518 , Y10T29/49174 , Y10T29/49208 , Y10T29/5193 , Y10T29/53209
摘要： For providing a shield wire, in which efficiency of processing terminal treatment of braid can be improved, and an apparatus for processing terminal treatment of braid, an apparatus for processing terminal treatment of braid of a shield wire includes a first hold unit holding a top of the braid covering the electric wire, a second hold unit holding a far-side of the braid, a push unit pushing the top toward the far-side so as to fold a part of braid from the top to form an overlap portion, and a forming unit forming the overlap portion into a cone shape, in which the top is located. The formed overlap portion is clamped by a set of inner and outer ring brackets.

75. 发明申请

US20120204924A1 Photovoltaic module and method 审中-公开
标题翻译：光伏组件及方法
公开(公告)号：US20120204924A1
公开(公告)日：2012-08-16
申请号：US12932019
申请日：2011-02-15
申请人： Michael J. Nowlan , Robert D. Bradford , Jason S. Chalfant
发明人： Michael J. Nowlan , Robert D. Bradford , Jason S. Chalfant
IPC分类号： H01L31/05 , H01L31/18 , H01B5/00
CPC分类号： H01L31/0201 , Y02E10/50
摘要： A photovoltaic module has solar cells electrically interconnected by string ribbons and bus ribbons adhered to a dielectric strip are located on both ends of the solar cell strings and are electrically connected to the string ribbons. The bus ribbon assembly includes a dielectric strip having a length for disposal coextensively with the photovoltaic module side and the bus ribbons are configured on the dielectric strip to register with corresponding string ribbons when the dielectric strip is disposed coextensively with the photovoltaic module.
摘要翻译：光伏模块具有通过串带电互连的太阳能电池，并且粘附到介质条的总线带位于太阳能电池串的两端并且电连接到串带。总线带组件包括具有用于与光伏模块侧共同处理的长度的介质条，并且当介质条与光伏模块共同设置时，在介质条上配置总线带以与对应的串带对准。

76. 发明申请

US20120175148A1 Electrical Contact for Relay and Method of Manufacturing Therefor (as amended) 有权
标题翻译：继电器电气接点及其制造方法（修订）
公开(公告)号：US20120175148A1
公开(公告)日：2012-07-12
申请号：US13497632
申请日：2010-10-15
申请人： Akihiko Inaba , Noriaki Murahashi , Masayuki Shibuta , Yasuhiro Sekino , Takahiro Yamada
发明人： Akihiko Inaba , Noriaki Murahashi , Masayuki Shibuta , Yasuhiro Sekino , Takahiro Yamada
IPC分类号： H01B5/00 , B32B37/14
CPC分类号： H01H1/0237 , H01H1/02372 , H01H11/041 , H01H50/54
摘要： A rivet-shaped electrical contact for relay is used as a movable contact for the relay. The rivet-shaped electrical contact includes a heavy-load contact portion formed of a first silver-oxide type contact material; and a light-load contact portion formed of a second silver-oxide type contact material. The hardness of the first silver-oxide type contact material is set to be higher than that of the second silver-oxide type contact material.
摘要翻译：用于继电器的铆钉形电触点用作继电器的可动触点。铆钉形电接触包括由第一氧化银型接触材料形成的重负载接触部分; 以及由第二氧化银型接触材料形成的轻负载接触部。第一氧化银型接触材料的硬度设定为高于第二氧化银型接触材料的硬度。

77. 发明申请

US20120168200A1 METHOD FOR MANUFACTURING JOINT STRUCTURE OF STEEL SHEET AND ALUMINUM SHEET, AND JOINT STRUCTURE OF STEEL SHEET AND ALUMINUM SHEET MANUFACTURED BY THE METHOD 审中-公开
标题翻译：制造钢板和铝板的接头结构的方法，以及由该方法制造的钢板和铝板的接合结构
公开(公告)号：US20120168200A1
公开(公告)日：2012-07-05
申请号：US13395904
申请日：2010-12-03
申请人： Masatoshi Iwai , Shoji Hisano , Takeshi Ohwaki , Shinji Sakashita , Kasumi Yanagisawa , Akihiko Tatsumi
发明人： Masatoshi Iwai , Shoji Hisano , Takeshi Ohwaki , Shinji Sakashita , Kasumi Yanagisawa , Akihiko Tatsumi
IPC分类号： H01B5/00 , H01R4/04
CPC分类号： B23K11/115 , B23K11/166 , B23K11/20 , B23K2101/006 , B23K2101/18 , B23K2101/34 , B23K2103/04 , B23K2103/10 , B23K2103/20
摘要： A process for producing a joint structure of a steel sheet and an aluminum sheet, in which the steel sheet and the aluminum sheet are joined to each other so as to be electrically connected to each other. The process is characterized by comprising a step of forming at least one resin coating film in a thickness of 0.1 to 5.0 μm on a contact surface on the steel sheet side, wherein the resin is selected from the group consisting of a polyolefin resin, a polyurethane resin and an epoxy resin.
摘要翻译：钢板和铝板的接合结构的制造方法，其中钢板和铝板彼此接合以彼此电连接。该方法的特征在于包括在钢板侧的接触表面上形成厚度为0.1至5.0μm的至少一种树脂涂膜的步骤，其中树脂选自聚烯烃树脂，聚氨酯树脂和环氧树脂。

78. 发明申请

US20120160539A1 CONDUCTIVE ADHESIVE TAPE 审中-公开
标题翻译：导电胶带
公开(公告)号：US20120160539A1
公开(公告)日：2012-06-28
申请号：US13331388
申请日：2011-12-20
申请人： Takahiro NONAKA , Noritsugu DAIGAKU , Ai MURAKAMI , Kota NAKAO , Hiroshi YAMAZAKI
发明人： Takahiro NONAKA , Noritsugu DAIGAKU , Ai MURAKAMI , Kota NAKAO , Hiroshi YAMAZAKI
IPC分类号： H01B5/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/264 , C09J7/28 , C09J7/29 , C09J2201/20 , C09J2201/32 , C09J2201/602 , C09J2203/326 , C09J2400/163 , C09J2433/00 , C22C12/00 , H01L2924/00013 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： A conductive adhesive tape includes a conductive layer, and an adhesive layer formed on the surface of the conductive layer. In the adhesive layer, an adhesive layer through-hole penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer includes a conductive layer passage portion formed in the adhesive layer through-hole. A low melting point metal layer is provided at an end face of the conductive layer passage portion, the end face reaching surface of the adhesive layer.
摘要翻译：导电胶带包括导电层和形成在导电层的表面上的粘合层。在粘合剂层中，形成在其厚度方向上穿透粘合剂层的粘合剂层通孔。导电层包括形成在粘合剂层通孔中的导电层通路部分。在导电层通路部分的端面，粘合剂层的端面到达表面设置低熔点金属层。

79. 发明申请

US20120152304A1 TABBING RIBBON, PHOTOVOLTAIC SOLAR PANEL, METHOD FOR MANUFACTURING A SOLAR CELL TABBING RIBBON, MACHINE FOR MANUFACTURING A SOLAR CELL TABBING RIBBON 有权
标题翻译：太阳能太阳能电池板，制造太阳能电池板的方法，用于制造太阳能电池板的机器RIBBON
公开(公告)号：US20120152304A1
公开(公告)日：2012-06-21
申请号：US13326364
申请日：2011-12-15
申请人： Olaf Storbeck , Harald Hahn
发明人： Olaf Storbeck , Harald Hahn
IPC分类号： H01L31/05 , B21D31/00 , B29D11/00 , B29C53/02 , B21D5/08 , H01B5/00
CPC分类号： H01L31/0508 , B21D13/04 , H01L31/0547 , Y02E10/52 , Y10T29/532
摘要： In various embodiments, a tabbing ribbon for connecting at least one solar cell is provided, wherein the tabbing ribbon at least partially extends in a non-planar manner and includes a non-planar section.
摘要翻译：在各种实施例中，提供用于连接至少一个太阳能电池的标签带，其中，所述带状带至少部分地以非平面方式延伸并且包括非平面部分。

80. 发明申请

US20120125659A1 COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF, COPPER CONDUCTOR WIRING AND MANUFACTURING METHOD THEREOF, AND TREATMENT SOLUTION 有权
标题翻译：铜导体膜及其制造方法，导电基板及其制造方法，铜导体布线及其制造方法及处理方案
公开(公告)号：US20120125659A1
公开(公告)日：2012-05-24
申请号：US12808768
申请日：2008-12-17
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： H01B5/00 , C22B15/00 , C09K3/00 , B05D3/00 , B32B15/20 , C22C9/00 , B05D5/12
CPC分类号： H05K3/182 , C23C18/1601 , C23C18/1603 , C23C18/1633 , C23C18/1635 , C23C18/1637 , C23C18/1824 , C23C18/1872 , C23C18/30 , C23C18/40 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29294 , H01L2224/29347 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/203 , H05K3/105 , H05K3/1241 , H05K2203/0315 , H05K2203/0709 , H05K2203/1157 , H05K2203/125 , Y10T428/12014 , Y10T428/12903 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/0002
摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.
摘要翻译：提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

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