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    • 82. 发明申请
    • DIE APPARATUS AND CONTROL METHOD
    • DIE装置和控制方法
    • US20150158072A1
    • 2015-06-11
    • US14559287
    • 2014-12-03
    • MITSUI HIGH-TEC , INC.
    • Daisuke KOMIYA
    • B21D28/14B21D45/00
    • B21D28/14B21D45/006B21D45/06Y10T83/0448Y10T83/217
    • A die apparatus includes a tip end part blanking punch which forms a tip end configuration of a belt-shaped sheet through a punch holding unit in an upper die. The punch holding unit includes a punch plate which holds the tip end part blanking punch, a punch plate moving mechanism which is lowered together with the upper die in a state where the punch plate is separated from the upper die when the tip end configuration of the belt-shaped sheet is formed, and holds the punch plate in a state where the punch plate is allowed to come near to the upper die when the punch plate is lifted, and an actuating mechanism which operates the punch plate moving mechanism in cooperation with a blanking or stamping operation of the upper die only when the tip end configuration of the belt-shaped sheet is formed.
    • 模具装置包括:顶端部冲裁冲头,其通过上模具中的冲头保持单元形成带状薄片的前端构造。 冲头保持单元包括保持前端部冲裁冲头的冲压板,当冲头板与上模分离的状态下与上模一起降低的冲压板移动机构, 形成带状片材,并且当冲压板被提升时将冲头板保持在允许冲头板靠近上模的状态;以及致动机构,其与打孔板移动机构协作操作 仅当形成带状片的顶端构造时,上模的冲切或冲压操作。
    • 84. 发明申请
    • ROTOR CORE AND METHOD OF MANUFACTURING THE SAME
    • 转子芯及其制造方法
    • US20140265718A1
    • 2014-09-18
    • US13829337
    • 2013-03-14
    • MITSUI HIGH-TEC, INC.
    • Daisuke KomiyaToshio Goto
    • H02K15/02H02K1/22
    • H02K15/02H02K1/28Y10T29/49012
    • A method of manufacturing a rotor core includes a first process of punching out punched holes 22, 23 forming outlines of keys 13, 14 in a thin metal strip 18, the holes 22, 23 including inside areas 25 located inside a shaft hole 12 and outside areas 26 continuous from the areas 25 and located outside the hole 12; a second process of punching out the hole 12 including recesses 35, 36 to avoid the keys 13, 14 and communicating with the holes 22, 23; and a third process of punching out an outline of a core sheet 11 having the hole 12 and laminating the sheets 11. Thereby, a shaft hole having keys is formed precisely, a thickness deviation of core sheets is eliminated, and a rotor core having homogeneous magnetism is provided.
    • 制造转子铁芯的方法包括:冲切孔22,23的第一工序,其形成薄金属条18中的键13,14的轮廓;孔22,23包括位于轴孔12内部的内部区域25和外部 从区域25连续并位于孔12外部的区域26; 第二种冲孔方法,包括凹槽35,36,以避开键13,14,并与孔22,23连通; 以及冲压出具有孔12并层压片材11的芯片11的轮廓的第三过程。由此,精确地形成具有键的轴孔,消除了芯片的厚度偏差,并且具有均匀的转子芯 提供磁力。
    • 85. 发明申请
    • METHOD OF MANUFACTURING LAMINATED ROTOR CORE
    • 制造层压转子芯的方法
    • US20140196276A1
    • 2014-07-17
    • US14152014
    • 2014-01-10
    • MITSUI HIGH-TEC, INC.
    • Akira NagaiGo KatoMei Ogata
    • H02K15/03
    • H02K15/03H02K15/12Y10T29/49012
    • There is provided a method of manufacturing a laminated rotor core, including: a mounting step of placing a core body on a carrier tray, the core body having a plurality of magnet insertion holes provided around the shaft hole, the carrier tray having a mount plate and a columnar guide member standing on a front surface of the mount plate 41, the placement of the core body being carried out by fitting the guide member into the shaft hole; an inserting step of inserting permanent magnets respectively in the magnet insertion holes; an injecting step of injecting a liquefied resin material in each of the magnet insertion holes; and a first preheating step of heating the core body before the mounting step, wherein the inserting step and the injecting step are carried out in a state in which the core body is placed on the carrier tray.
    • 提供了一种制造叠层转子芯的方法,包括:将芯体放置在托架上的安装步骤,所述芯体具有围绕所述轴孔设置的多个磁体插入孔,所述托架具有安装板 以及立柱引导构件,其竖立在安装板41的前表面上,通过将引导构件装配到轴孔中来进行芯体的放置; 插入步骤,分别将永磁体插入磁体插入孔中; 在每个磁体插入孔中注入液化树脂材料的注入工序; 以及在所述安装步骤之前加热所述芯体的第一预热步骤,其中所述插入步骤和所述注射步骤在所述芯体放置在所述载体托盘上的状态下进行。
    • 86. 发明申请
    • MANUFACTURING METHOD OF LAMINATED IRON CORE
    • 层压铁芯的制造方法
    • US20130186158A1
    • 2013-07-25
    • US13742640
    • 2013-01-16
    • MITSUI HIGH-TEC , INC.
    • Iwao MYOJIN
    • H02K15/02
    • H02K15/02H02K15/03
    • There is provided a manufacturing method of a laminated iron core which is formed of a strip-shaped iron core piece. The strip-shaped iron core piece includes segment iron core pieces connected through a joint positioned in a radial outside, and each of the segment iron core pieces has an artuate shape. The joint by which adjacent segment iron core pieces are connected is folded and lateral ends of the adjacent segment iron core pieces are aligned. The strip-shaped iron core piece is spirally wound while circumferentially shifting mutual joints formed on vertical adjacent layers. Crush processing is performed for flattening a bulged portion in a thickness direction of the segment iron core pieces formed at a time of folding the joint, and the crush processing is performed simultaneously with a time when or after mutual segment iron core pieces arranged vertically are crimped and laminated.
    • 提供了由带状铁芯片形成的层叠铁芯的制造方法。 带状铁芯片包括通过位于径向外侧的接头连接的段铁芯片,并且每个铁芯片都具有艺术形状。 相邻段铁芯片连接的接头被折叠,相邻的段铁芯片的侧端对准。 带状铁芯片螺旋卷绕,同时在垂直相邻层上形成的相互接合的周向移动。 进行压碎处理,以使在折叠接合时形成的段铁芯片的厚度方向上的凸出部分变平,并且在垂直布置的相互分段铁芯片被卷曲之后或之后的时间同时进行挤压加工 并层压。
    • 87. 发明申请
    • Lead frame for a semiconductor device and a semiconductor device incorporating the lead frame
    • 用于半导体器件的引线框架和结合引线框架的半导体器件
    • US20030155634A1
    • 2003-08-21
    • US10322900
    • 2002-12-18
    • Mitsui High-tec, Inc.
    • Shoshi YasunagaTakahiro IshibashiHiroaki Narimatsu
    • H01L023/495
    • H01L23/49541H01L23/49551H01L24/97H01L2924/181H01L2924/00
    • A lead frame for a semiconductor device. The lead frame has opposite first and second sides bounded respectively by first and second parallel reference planes between which a thickness is defined. The lead frame has a support with a surface at the first side of the lead frame for receiving a semiconductor chip. A plurality of leads are spaced from the support to be electrically connected to a semiconductor chip on the support. A first lead in the plurality of leads has a length between first and second ends and a width taken transversely to the length. The first end of the first lead has a first region that has a thickness less than the thickness of the first lead at the second end of the first lead so that at least a part of the first region is offset from the second reference plane toward the first reference plane. The first end of the first lead has at least a first protrusion projecting away from the first reference plane.
    • 一种用于半导体器件的引线框架。 引线框架具有分别由第一和第二平行参考平面限定的相对的第一和第二侧,其间限定了厚度。 引线框架具有在引线框架的第一侧具有用于接收半导体芯片的表面的支撑。 多个引线与支撑件间隔开以与支撑件上的半导体芯片电连接。 多个引线中的第一引线具有第一和第二端之间的长度以及横向于该长度的宽度。 第一引线的第一端具有第一区域,该第一区域的厚度小于第一引线的第二端处的第一引线的厚度,使得第一区域的至少一部分从第二参考平面朝向 第一参考平面 第一引线的第一端具有至少一个远离第一参考平面突出的第一突起。