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81. 发明授权

US08426276B2 Non-volatile semiconductor storage device and method of manufacturing the same 有权
标题翻译：非易失性半导体存储装置及其制造方法
公开(公告)号：US08426276B2
公开(公告)日：2013-04-23
申请号：US13365600
申请日：2012-02-03
申请人： Masaru Kito , Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Hideaki Aochi , Yasuyuki Matsuoka
发明人： Masaru Kito , Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Hideaki Aochi , Yasuyuki Matsuoka
IPC分类号： H01L21/8234
CPC分类号： H01L29/7881 , H01L27/115 , H01L27/11556
摘要： A non-volatile semiconductor storage device has a plurality of memory strings with a plurality of electrically rewritable memory cells connected in series. Each of the memory strings includes: a first columnar semiconductor layer extending in a direction perpendicular to a substrate; a charge accumulation layer formed on the first columnar semiconductor layer via a first air gap and accumulating charges; a block insulation layer contacting the charge accumulation layer; and a plurality of first conductive layers contacting the block insulation layer.
摘要翻译：非易失性半导体存储装置具有多个具有串联连接的多个电可重写存储单元的存储器串。每个存储器串包括：在垂直于衬底的方向上延伸的第一柱状半导体层; 电荷累积层，经由第一气隙形成在第一柱状半导体层上，并积累电荷; 与电荷累积层接触的块绝缘层; 以及与块绝缘层接触的多个第一导电层。

82. 发明授权

US08350314B2 Semiconductor memory device and method for fabricating semiconductor memory device 有权
标题翻译：半导体存储器件及半导体存储器件的制造方法
公开(公告)号：US08350314B2
公开(公告)日：2013-01-08
申请号：US12325711
申请日：2008-12-01
申请人： Yoshiaki Fukuzumi , Ryota Katsumata , Masaru Kidoh , Masaru Kito , Hiroyasu Tanaka , Hideaki Aochi , Yasuyuki Matsuoka
发明人： Yoshiaki Fukuzumi , Ryota Katsumata , Masaru Kidoh , Masaru Kito , Hiroyasu Tanaka , Hideaki Aochi , Yasuyuki Matsuoka
IPC分类号： H01L29/792
CPC分类号： H01L27/11578 , H01L27/11575 , H01L27/11582
摘要： According to an aspect of the present invention, there is provided a nonvolatile semiconductor memory device, comprising a plurality of memory strings, each of the memory strings being constituted with a plurality of electrically erasable memory cells being serially connected each other, the memory strings comprising: a columnar semiconductor layer perpendicularly extending toward a substrate; a plurality of conductive layers being formed in parallel to the substrate and including a first space between a sidewall of the columnar semiconductor layers; and characteristic change layer being formed on the sidewall of the columnar semiconductor layer faced to the first space or a sidewall of the conductive layer faced to the first space and changing characteristics accompanying with applied voltage; wherein the plurality of the conductive layers have a function of a relative movement to a prescribed direction for the columnar semiconductor layer.
摘要翻译：根据本发明的一个方面，提供了一种非易失性半导体存储器件，包括多个存储器串，每个存储器串由多个电可擦除存储器单元组成，所述多个电可擦除存储器单元串联连接，所述存储器串包括：向衬底垂直延伸的柱状半导体层; 多个导电层平行于衬底形成并且包括柱状半导体层的侧壁之间的第一空间; 并且特征变化层形成在面向面向第一空间的导电层的第一空间或侧壁的柱状半导体层的侧壁上，并且伴随施加电压的变化特性; 其中所述多个所述导电层具有对于所述柱状半导体层相对于规定方向的相对移动的功能。

83. 发明申请

US20110284947A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：非易失性半导体存储器件及其制造方法
公开(公告)号：US20110284947A1
公开(公告)日：2011-11-24
申请号：US13198359
申请日：2011-08-04
申请人： Masaru KITO , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
发明人： Masaru KITO , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
IPC分类号： H01L29/792
CPC分类号： H01L27/11582 , G11C16/0483 , H01L21/8221 , H01L27/0688 , H01L27/105 , H01L27/115 , H01L27/11556 , H01L27/11573 , H01L27/11578
摘要： A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.
摘要翻译：提供了具有新结构的非易失性半导体存储器件，其中以三维状态层叠存储单元，从而可以减小芯片面积。本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

84. 发明授权

US07936004B2 Nonvolatile semiconductor memory device and manufacturing method thereof 有权
标题翻译：非易失性半导体存储器件及其制造方法
公开(公告)号：US07936004B2
公开(公告)日：2011-05-03
申请号：US11654551
申请日：2007-01-18
申请人： Masaru Kito , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
发明人： Masaru Kito , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
IPC分类号： H01L27/115
CPC分类号： H01L27/11582 , G11C16/0483 , H01L21/8221 , H01L27/0688 , H01L27/105 , H01L27/115 , H01L27/11556 , H01L27/11573 , H01L27/11578
摘要： A nonvolatile semiconductor memory device includes a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; a second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory string and the first to nth electrodes of at least two other memory strings which are adjacent to the memory string in two directions are shared as first to nth conductor layers spread in two dimensions.
摘要翻译：非易失性半导体存储器件包括其中多个可电可编程存储器单元串联连接的多个存储器串。存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。存储器串的第一或第n电极以及在两个方向上与存储器串相邻的至少两个其它存储器串的第一至第n电极被共享为在二维上扩展的第一至第n导体层。

85. 发明申请

US20100219465A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100219465A1
公开(公告)日：2010-09-02
申请号：US12773038
申请日：2010-05-04
申请人： Hiroyasu TANAKA , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Yoshiaki Fukuzumi , Masaru Kito , Yasuyuki Matsuoka
发明人： Hiroyasu TANAKA , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Yoshiaki Fukuzumi , Masaru Kito , Yasuyuki Matsuoka
IPC分类号： H01L29/78
CPC分类号： H01L29/792 , H01L21/28282 , H01L27/11578 , H01L27/11582 , H01L29/0649 , H01L29/7923 , H01L29/7926
摘要： A semiconductor device has a substrate, a source region formed on the surface portion of the substrate, a first insulating layer formed on the substrate, a gate electrode formed on the first insulating layer, a second insulating layer formed on the gate electrode, a body section connected with the source region, penetrating through the first insulating layer, the gate electrode and the second insulating layer, and containing a void, a gate insulating film surrounding the body section, and formed between the body section and the gate electrode, and a drain region connected with the body section.
摘要翻译：半导体器件具有衬底，形成在衬底的表面部分上的源极区域，形成在衬底上的第一绝缘层，形成在第一绝缘层上的栅电极，形成在栅电极上的第二绝缘层，主体与源极区域连接，穿过第一绝缘层，栅电极和第二绝缘层，并且包含空隙，围绕主体部分的栅极绝缘膜，并且形成在主体部分和栅电极之间，并且漏极区域与主体部分连接。

86. 发明申请

US20090294844A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090294844A1
公开(公告)日：2009-12-03
申请号：US12132181
申请日：2008-06-03
申请人： Hiroyasu TANAKA , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Yoshiaki Fukuzumi , Masaru Kito , Yasuyuki Matsuoka
发明人： Hiroyasu TANAKA , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Yoshiaki Fukuzumi , Masaru Kito , Yasuyuki Matsuoka
IPC分类号： H01L29/739
CPC分类号： H01L29/792 , H01L21/28282 , H01L27/11578 , H01L27/11582 , H01L29/0649 , H01L29/7923 , H01L29/7926
摘要： A semiconductor device has a substrate, a source region formed on the surface portion of the substrate, a first insulating layer formed on the substrate, a gate electrode formed on the first insulating layer, a second insulating layer formed on the gate electrode, a body section connected with the source region, penetrating through the first insulating layer, the gate electrode and the second insulating layer, and containing a void, a gate insulating film surrounding the body section, and formed between the body section and the gate electrode, and a drain region connected with the body section.
摘要翻译：半导体器件具有衬底，形成在衬底的表面部分上的源极区域，形成在衬底上的第一绝缘层，形成在第一绝缘层上的栅电极，形成在栅电极上的第二绝缘层，主体与源极区域连接，穿过第一绝缘层，栅电极和第二绝缘层，并且包含空隙，围绕主体部分的栅极绝缘膜，并且形成在主体部分和栅电极之间，并且漏极区域与主体部分连接。

87. 发明申请

US20090230462A1 NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非挥发性半导体存储器件及其制造方法
公开(公告)号：US20090230462A1
公开(公告)日：2009-09-17
申请号：US12393509
申请日：2009-02-26
申请人： Hiroyasu Tanaka , Masaru Kidoh , Ryota Katsumata , Masaru Kito , Yoshiaki Fukuzumi , Hideaki Aochi , Yasuyuki Matsuoka
发明人： Hiroyasu Tanaka , Masaru Kidoh , Ryota Katsumata , Masaru Kito , Yoshiaki Fukuzumi , Hideaki Aochi , Yasuyuki Matsuoka
IPC分类号： H01L29/792 , H01L21/28
CPC分类号： H01L27/11578 , H01L27/11582
摘要： Each of the memory strings includes: a first columnar semiconductor layer extending in a vertical direction to a substrate; a plurality of first conductive layers formed to sandwich an insulation layer with a charge trap layer and expand in a two-dimensional manner; a second columnar semiconductor layer formed in contact with the top surface of the first columnar semiconductor layer and extending in a vertical direction to the substrate; and a plurality of second conductive layers formed to sandwich an insulation layer with the second columnar semiconductor layer and formed in a stripe pattern extending in a first direction orthogonal to the vertical direction. Respective ends of the plurality of first conductive layers in the first direction are formed in a stepwise manner in relation to each other, entirety of the plurality of the second conductive layers are formed in an area immediately above the top layer of the first conductive layers, and the plurality of first conductive layers and the plurality of second conductive layers are covered with a protection insulation layer that is formed continuously with the plurality of first conductive layers and the second conductive layers.
摘要翻译：每个存储器串包括：在垂直方向上延伸到衬底的第一柱状半导体层; 多个第一导电层，其形成为夹着具有电荷陷阱层的绝缘层并以二维方式扩展; 第二柱状半导体层，其与所述第一柱状半导体层的顶表面接触并且在垂直方向上延伸到所述衬底; 以及多个第二导电层，其形成为与第二柱状半导体层夹着绝缘层，并且形成为沿与垂直方向正交的第一方向延伸的条纹图案。多个第一导电层的第一方向的端部相对于彼此分步地形成，多个第二导电层的整体形成在第一导电层的顶层的正上方的区域中，并且多个第一导电层和多个第二导电层被与多个第一导电层和第二导电层连续形成的保护绝缘层覆盖。

88. 发明申请

US20080315291A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非易失性半导体存储器件及其制造方法
公开(公告)号：US20080315291A1
公开(公告)日：2008-12-25
申请号：US12140734
申请日：2008-06-17
申请人： Masaru KITO , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka
发明人： Masaru KITO , Hideaki Aochi , Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka
IPC分类号： H01L29/00 , H01L21/31
CPC分类号： H01L27/105 , H01L21/02161 , H01L21/02164 , H01L21/0217 , H01L21/31645 , H01L27/11568 , H01L27/11578 , H01L27/11582 , H01L29/66833 , H01L29/792 , H01L29/7926
摘要： A nonvolatile semiconductor memory device has a plurality of memory strings each including a plurality of electrically rewritable memory cells serially connected. The memory string includes a columnar semiconductor portion extending in the vertical direction from a substrate, a first charge storage layer formed adjacent to the columnar semiconductor portion and configured to accumulate charge, a first block insulator formed adjacent to the first charge storage layer, and a first conductor formed adjacent to the first block insulator.
摘要翻译：非易失性半导体存储器件具有多个存储串，每个存储串包括串联连接的多个电可重写存储器单元。存储器串包括从基板沿垂直方向延伸的柱状半导体部分，与柱状半导体部分相邻形成并构成为积蓄电荷的第一电荷存储层，与第一电荷存储层相邻形成的第一块绝缘体，第一导体与第一块绝缘体相邻形成。

89. 发明申请

US20080180994A1 MEMORY SYSTEM, SEMICONDUCTOR MEMORY DEVICE AND METHOD OF DRIVING SAME 有权
标题翻译：存储器系统，半导体存储器件及其驱动方法
公开(公告)号：US20080180994A1
公开(公告)日：2008-07-31
申请号：US11955900
申请日：2007-12-13
申请人： Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Masaru Kito , Hideaki Aochi , Yoshiaki Fukuzumi , Yasuyuki Matsuoka
发明人： Ryota Katsumata , Masaru Kidoh , Hiroyasu Tanaka , Masaru Kito , Hideaki Aochi , Yoshiaki Fukuzumi , Yasuyuki Matsuoka
IPC分类号： G11C11/34 , H01L29/76 , G11C8/00
CPC分类号： H01L27/115 , G11C7/18 , G11C8/08 , H01L27/11526 , H01L27/11529
摘要： A semiconductor memory device has a semiconductor substrate, first select transistors formed on the surface of said semiconductor substrate, first dummy transistors formed above said first select transistors, a plurality of memory cell transistors formed above said first dummy transistors so as to extend in a direction perpendicular to the surface of said semiconductor substrate, each of said memory cell transistor including an insulating layer having a charge-accumulating function, second dummy transistors formed above said memory cell transistors, and second select transistors formed above said second dummy transistors; wherein a first potential is provided to the gate electrodes of said first select transistors and the gate electrodes of said first dummy transistors and a second potential is provided to the gate electrodes of said second select transistors and the gate electrodes of said second dummy transistors at the time of write operation to write data to said memory cell transistors.
摘要翻译：半导体存储器件具有半导体衬底，形成在所述半导体衬底的表面上的第一选择晶体管，形成在所述第一选择晶体管上方的第一虚拟晶体管，形成在所述第一虚拟晶体管上方的多个存储单元晶体管，垂直于所述半导体衬底的表面，每个所述存储单元晶体管包括具有电荷累积功能的绝缘层，形成在所述存储单元晶体管上方的第二虚拟晶体管以及形成在所述第二虚设晶体管上方的第二选择晶体管; 其中第一电位被提供给所述第一选择晶体管的栅电极和所述第一虚拟晶体管的栅电极，并且第二电位被提供给所述第二选择晶体管的栅极和所述第二虚设晶体管的栅电极写入操作的时间将数据写入到所述存储单元晶体管。

90. 发明申请

US20070252201A1 Nonvolatile semiconductor memory device and manufacturing method thereof 有权
标题翻译：非易失性半导体存储器件及其制造方法
公开(公告)号：US20070252201A1
公开(公告)日：2007-11-01
申请号：US11654551
申请日：2007-01-18
申请人： Masaru Kito , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
发明人： Masaru Kito , Hideaki Aochi , Ryota Katsumata , Akihiro Nitayama , Masaru Kidoh , Hiroyasu Tanaka , Yoshiaki Fukuzumi , Yasuyuki Matsuoka , Mitsuru Sato
IPC分类号： H01L29/76
CPC分类号： H01L27/11582 , G11C16/0483 , H01L21/8221 , H01L27/0688 , H01L27/105 , H01L27/115 , H01L27/11556 , H01L27/11573 , H01L27/11578
摘要： A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the chip area may be reduced. The nonvolatile semiconductor memory device of the present invention is a nonvolatile semiconductor memory device that has a plurality of the memory strings, in which a plurality of electrically programmable memory cells is connected in series. The memory strings comprise a pillar shaped semiconductor; a first insulation film formed around the pillar shaped semiconductor; a charge storage layer formed around the first insulation film; the second insulation film formed around the charge storage layer; and first or nth electrodes formed around the second insulation film (n is natural number more than 1). The first or nth electrodes of the memory strings and the other first or nth electrodes of the memory strings are respectively the first or nth conductor layers that are spread in a two dimensional state.
摘要翻译：提供了具有新结构的非易失性半导体存储器件，其中以三维状态层叠存储单元，从而可以减小芯片面积。本发明的非易失性半导体存储装置是具有串联连接有多个电可编程存储单元的多个存储串的非易失性半导体存储装置。存储器串包括柱形半导体; 形成在柱状半导体周围的第一绝缘膜; 形成在所述第一绝缘膜周围的电荷存储层; 形成在电荷存储层周围的第二绝缘膜; 并且形成在第二绝缘膜周围的第一或第n电极（n是大于1的自然数）。存储器串的第一或第n电极和存储器串的其它第一或第n电极分别是以二维状态扩展的第一或第n导体层。

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