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81. 发明授权

US10531565B2 Multilayer capacitor built-in substrate 有权
公开(公告)号：US10531565B2
公开(公告)日：2020-01-07
申请号：US15830233
申请日：2017-12-04
申请人： Murata Manufacturing Co., Ltd.
发明人： Yukihiro Fujita
IPC分类号： H05K1/02 , H05K1/11 , H05K1/16 , H05K1/18 , H01G4/08 , H01G4/12 , H01G4/30 , H01G4/38 , H01G4/228 , H01G4/232 , H01G2/02 , H01G2/06 , H01G4/248 , H01G4/012
摘要： A multilayer capacitor built-in substrate includes a core substrate, a multilayer capacitor mounted on one principal surface of the core substrate, and a burying layer provided on the one principal surface of the core substrate to bury the multilayer capacitor. The multilayer capacitor includes a laminated body in which dielectric layers and internal electrode layers are laminated, and first and second external electrodes. The laminated body includes an effective region in which internal electrode layers respectively connected to the first external electrode and the second external electrode are laminated with a dielectric layer located therebetween, and a non-effective region surrounding the effective region. The core substrate includes, on the one principal surface, a first land electrode electrically connected to the first external electrode and a second land electrode electrically connected to the second external electrode.

82. 发明授权

US10314209B2 Systems and methods for cooling of power electronic devices 有权
公开(公告)号：US10314209B2
公开(公告)日：2019-06-04
申请号：US15818457
申请日：2017-11-20
申请人： Clean Wave Technologies, Inc.
发明人： Rudolph Garriga , Michael Kubic
IPC分类号： H05K5/00 , H05K7/00 , H05K7/20 , H01L23/367 , H01G2/02 , H01G2/08 , H01L23/488
摘要： The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.

83. 发明授权

US09953765B2 Laminated ceramic electronic component mounting structure 有权
公开(公告)号：US09953765B2
公开(公告)日：2018-04-24
申请号：US14702881
申请日：2015-05-04
申请人： Murata Manufacturing Co., Ltd.
发明人： Shunsuke Takeuchi , Masashi Nishimura
IPC分类号： H01G4/30 , H01G4/228 , H01G4/005 , H01G2/02 , H01G4/012 , H01G4/248 , H05K1/18 , H05K1/11 , H01G4/232 , H01G2/06 , H01G4/12
CPC分类号： H01G4/005 , H01G2/02 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015
摘要： A laminated ceramic electronic component mounting structure includes a laminated ceramic electronic component including a ceramic body, first and second inner electrodes in the ceramic body including opposed portions including at least portions of which are opposed to each other in a thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode; and a circuit board including first and second electrode lands electrically connected to the first and second terminal electrodes and on which the laminated ceramic electronic component is mounted, wherein widths of the first and second electrode lands are smaller than widths of the first and second inner electrodes at the opposed portions.

84. 发明申请

US20170150639A1 SYSTEMS AND METHODS FOR COOLING OF POWER ELECTRONIC DEVICES 有权
公开(公告)号：US20170150639A1
公开(公告)日：2017-05-25
申请号：US15340336
申请日：2016-11-01
申请人： Clean Wave Technologies, Inc.
发明人： Rudolph Garriga , Michael Kubic
IPC分类号： H05K7/20 , H01G2/02 , H01G2/08 , H01L23/367 , H01L23/488
CPC分类号： H05K7/209 , H01G2/02 , H01G2/08 , H01L23/367 , H01L23/3675 , H01L23/488 , H01L2924/0002 , H05K7/2039 , H01L2924/00
摘要： The invention provides systems and methods for cooling of power electronic devices with an optimized electromechanical structure. A power electronic device may comprise one or more power transistor components, one or more capacitor components, one or more power interconnect components that may be in electrical communication with the one or more power transistor components and the one or more capacitor components, and one or more heat sink components. The one or more power transistor components and the one or more capacitor components may be in thermal communication with the one or more heat sink components, and each may be located on substantially opposite sides of the one or more heat sink components, such that heat may be transferred from the one or more power transistor components and the one or more capacitor components to the same one or more heat sink components.

85. 发明授权

US09484154B2 Capacitor device and method for manufacturing same 有权
标题翻译：电容器及其制造方法
公开(公告)号：US09484154B2
公开(公告)日：2016-11-01
申请号：US13816388
申请日：2011-07-20
申请人： Ikufumi Honda , Nobukatsu Abe , Tsubasa Abe
发明人： Ikufumi Honda , Nobukatsu Abe , Tsubasa Abe
IPC分类号： H05K7/00 , H01G4/38 , H01G2/04 , H01G2/10 , H01G11/10 , H01G11/82 , H01G2/02
CPC分类号： H01G4/38 , H01G2/02 , H01G2/04 , H01G2/10 , H01G11/10 , H01G11/82 , Y02E60/13 , Y10T29/43
摘要： An object of the invention is to provide a capacitor device that can be made slimmer and lighter and that enables the strength and heat dissipation properties to be improved. A capacitor device (1) has a plurality of capacitor units (2) integrally housed within a housing case (3), the housing case (3) having cylindrical housing sections (5) for housing the capacitor bodies. The housing sections (5) are longitudinally aligned in the same direction and are joined together as an integrated whole. A capacitor unit (2) is inserted via an opening (9) at one end of each of the housing sections (5) so that the entire circumference of the capacitor unit (2) is covered by the corresponding housing section (5). The housing sections (5) have a uniform thickness at least on the outer side along the outer periphery of the capacitor units.
摘要翻译：本发明的一个目的是提供一种可以变得更薄和更轻的电容器装置，并且能够提高强度和散热性能。电容器装置（1）具有一体地容纳在壳体（3）内的多个电容器单元（2），壳体（3）具有用于容纳电容器体的圆柱形壳体部分（5）。壳体部分（5）在相同的方向上纵向排列并且作为整体结合在一起。电容器单元（2）经由每个壳体部分（5）的一端处的开口（9）插入，使得电容器单元（2）的整个圆周被相应的容纳部分（5）覆盖。壳体部分（5）至少沿着电容器单元的外周的外侧具有均匀的厚度。

86. 发明授权

US09460866B2 Method of forming a surface mount component having magnetic layer thereon 有权
标题翻译：在其上形成具有磁性层的表面安装部件的方法
公开(公告)号：US09460866B2
公开(公告)日：2016-10-04
申请号：US13771022
申请日：2013-02-19
申请人： Intel Corporation
发明人： Haixiao Sun
IPC分类号： H05K3/34 , H01G13/00 , H05K3/30 , H01G2/02 , H05K3/24
CPC分类号： H01G13/00 , H01G2/02 , H01L2924/0002 , H05K3/244 , H05K3/303 , H05K3/3442 , H05K2201/083 , H05K2201/10909 , H05K2203/043 , Y02P70/613 , Y10T428/24826 , H01L2924/00
摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.
摘要翻译：微电子组件，表面安装部件和提供表面安装部件的方法。组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力在焊接之前和期间将表面安装部件保持在基板上。

87. 发明申请

US20150003031A1 VERTICALLY MOUNTED CAPACITOR ASSEMBLY 有权
标题翻译：垂直安装电容器总成
公开(公告)号：US20150003031A1
公开(公告)日：2015-01-01
申请号：US14487014
申请日：2014-09-15
申请人： Dale W. Massolle, JR.
发明人： Dale W. Massolle, JR.
IPC分类号： H01G4/38 , H01G2/02
CPC分类号： H01G4/38 , H01G2/02 , H01G2/06 , H01G9/26
摘要： A capacitor assembly comprises a plurality of capacitor elements, a clamping assembly, and a conductive path. The clamping assembly retains the plurality of capacitor elements longitudinally perpendicular to an adjacent mounting surface. The conductive path electrically connects the plurality of capacitor elements to one or more circuit elements disposed proximate the adjacent mounting surface. The clamping assembly includes a base with a central strut and a plurality of peripheral struts projecting perpendicularly therefrom, and the clamping assembly also includes a central conductive path.
摘要翻译：电容器组件包括多个电容器元件，夹紧组件和导电路径。夹持组件将多个电容器元件纵向垂直于相邻的安装表面保持。导电路径将多个电容器元件电连接到邻近相邻安装表面设置的一个或多个电路元件。夹紧组件包括具有中心支柱的基座和与其垂直突出的多个外围支柱，并且夹紧组件还包括中心导电路径。

88. 发明申请

US20140343648A1 CONTACTING ARRANGEMENT COMPRISING A FEEDTHROUGH AND A FILTER STRUCTURE AND METHOD OF MAKING 审中-公开
标题翻译：包括有效的连接布置和过滤器结构及其制造方法
公开(公告)号：US20140343648A1
公开(公告)日：2014-11-20
申请号：US14359732
申请日：2012-11-13
申请人： Heraeus Precious Metals GmbH & Co., KG
发明人： Heiko Specht , Andreas Reisinger , Goran Pavlovic , Christina Modes , Frieder Gora , Frederik Roth
IPC分类号： A61N1/375 , B29C65/48 , H01G2/02 , A61N1/362
CPC分类号： A61N1/3754 , A61N1/362 , B29C65/48 , B29L2031/34 , H01G2/02 , H01G4/0085 , H01G4/30 , H01G4/35
摘要： One aspect relates to a contacting arrangement for use in a housing of a medically implantable apparatus. Said contacting arrangement includes an electrical feedthrough device that includes at least one electrically insulating main feedthrough member and at least one electrical conducting element. The conducting element is designed to establish at least one electrically conducting connection between an interior of the housing and an exterior through the main feedthrough member. The conducting element is hermetically sealed with respect to the main feedthrough member. The at least one conducting element comprises at least one cermet. The contacting arrangement further includes an electrical filter structure which is arranged on a face of the feedthrough device. Furthermore, said filter structure is connected to the conducting element by means of at least one electrical surface connection.
摘要翻译：一个方面涉及一种用于医用可植入装置的壳体中的接触装置。所述接触装置包括电馈通装置，其包括至少一个电绝缘主馈通构件和至少一个导电元件。导电元件设计成在壳体的内部和通过主馈通构件的外部之间建立至少一个导电连接。导电元件相对于主馈通构件气密密封。所述至少一个导电元件包括至少一个金属陶瓷。接触装置还包括布置在馈通装置的表面上的电过滤器结构。此外，所述滤波器结构通过至少一个电气表面连接连接到导电元件。

89. 发明申请

US20140284091A1 LAMINATED ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF 审中-公开
标题翻译：层压电子元件及其安装结构
公开(公告)号：US20140284091A1
公开(公告)日：2014-09-25
申请号：US14202457
申请日：2014-03-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuo FUJII
IPC分类号： H01G2/02 , H01G4/12
CPC分类号： H01G2/06 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/181 , H05K3/3442 , H05K2201/0311 , H05K2201/10015 , H05K2201/10636 , H05K2201/10962 , Y02P70/611
摘要： A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.
摘要翻译：层叠电子部件包括层叠体，其包括交替层叠的内部电极和电介质层，以及第一主面，连续地覆盖层叠体的长度方向的至少一个端面的外部电极和与第一主表面相邻的部分的外部电极一个端面，以及在外部电极覆盖第一主表面的部分中的至少在第一主表面的角部处连接到外部电极的导电弹性结构。所述弹性结构包括与所述外部电极连接的基部，沿着所述第一主表面延伸，以及从所述基部分支并在与所述第一主表面间隔开的位置延伸以连接到另一电极并具有弹性的分支部。

90. 发明申请

US20130163142A1 SURFACE MOUNT COMPONENT HAVING MAGNETIC LAYER THEREON AND METHOD OF FORMING SAME 审中-公开
标题翻译：具有磁性层的表面安装部件及其形成方法
公开(公告)号：US20130163142A1
公开(公告)日：2013-06-27
申请号：US13771022
申请日：2013-02-19
申请人： Haixiao Sun
发明人： Haixiao Sun
IPC分类号： H01G13/00 , H01G2/02
CPC分类号： H01G13/00 , H01G2/02 , H01L2924/0002 , H05K3/244 , H05K3/303 , H05K3/3442 , H05K2201/083 , H05K2201/10909 , H05K2203/043 , Y02P70/613 , Y10T428/24826 , H01L2924/00
摘要： A microelectronic assembly, a surface mount component and a method of providing the surface mount component. The assembly comprises: a substrate having bonding pads disposed on a mounting surface thereof, the bonding pads including a ferromagnetic material therein; solidified solder disposed on the bonding pads; and a surface mount component bonded to the substrate by way of the solidified solder and including a magnetic layer disposed on a substrate side thereof, the magnetic layer being adapted to cooperate with the ferromagnetic material in the bonding pads to establish a magnetic force of a sufficient magnitude to hold the surface mount component on the substrate before and during soldering.
摘要翻译：微电子组件，表面安装部件和提供表面安装部件的方法。组件包括：具有设置在其安装表面上的接合焊盘的衬底，所述接合焊盘在其中包括铁磁材料; 设置在接合焊盘上的固化焊料; 以及表面安装部件，其通过固化的焊料结合到基板，并且包括设置在其基板侧上的磁性层，所述磁性层适于与焊盘中的铁磁材料配合以建立足够的磁力在焊接之前和期间将表面安装部件保持在基板上。

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