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81. 发明授权

US10568205B2 Ceramic and polymer composite, and uses thereof 有权
公开(公告)号：US10568205B2
公开(公告)日：2020-02-18
申请号：US15656657
申请日：2017-07-21
申请人： Corning Incorporated
发明人： Weiguo Miao , Manuela Ocampo , Michael Lesley Sorensen , James William Zimmermann
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , C04B35/117 , C04B41/48 , C08K3/22 , H05K3/00
摘要： A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.

82. 发明申请

US20200032966A1 LED TUBE LAMP 审中-公开
公开(公告)号：US20200032966A1
公开(公告)日：2020-01-30
申请号：US16587812
申请日：2019-09-30
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming Xiong , Xintong Liu
IPC分类号： F21K9/278 , H05B33/08 , H05K1/00 , F21V23/00 , F21V25/02 , F21K9/272 , F21V29/70 , F21V23/02 , F21K9/275 , F21V15/015 , F21V3/06
摘要： A light-emitting diode (LED) tube lamp comprising a tube, end caps with contact pins and located on both ends of the tube, a first rectifying circuit and a second rectifying circuit and a filtering circuit that are coupled with the contact pins on the two end caps respectively, and a switch circuitry that is located between the rectifying circuits and the filtering circuit characterized in that the switch circuitry is capable of detecting whether the LED tube lamp is correctly installed on a lamp socket so as to reduce the risk of electric shock.

83. 发明授权

US10542617B2 Electronic device and method for manufacturing the same 有权
公开(公告)号：US10542617B2
公开(公告)日：2020-01-21
申请号：US15426705
申请日：2017-02-07
申请人： Samsung Electronics Co., Ltd.
发明人： Hwa-Joong Jung , Man-Ho Kim , Hyung-Jin Rho , Dong-Youl Park , Ki-Huk Lee , Yong-Hwan Choi
IPC分类号： H05K1/00 , H05K1/02 , H05K13/00 , H04N5/225 , H05K1/14 , H05K1/18 , H05K5/02 , H05K5/04
摘要： An electronic device is provided. The electronic device includes a printed circuit board having a terminal formed thereon, an image sensor electrically connected to the terminal, and a metal casing enclosing a surface of the image sensor, wherein the metal casing comprises a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance.

84. 发明授权

US10485110B2 Electrical connection method of printed circuit and electrical connection structure of printed circuit 有权
公开(公告)号：US10485110B2
公开(公告)日：2019-11-19
申请号：US16040596
申请日：2018-07-20
申请人： Yazaki Corporation
发明人： Mizuki Shirai , Hiroki Kondo
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/36 , H05K3/40 , H05K3/42 , H05K3/46 , H01R4/04 , H01R12/52 , H05K1/09 , H05K3/12
摘要： An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

85. 发明授权

US10483673B2 Interposer device 有权
公开(公告)号：US10483673B2
公开(公告)日：2019-11-19
申请号：US15543193
申请日：2015-01-28
申请人： Hewlett-Packard Development Company, L.P.
发明人： Byron A Alcorn , Shane Ward , Peter Andrew Seiler
IPC分类号： H01R12/00 , H05K1/00 , H01R12/77 , G06F1/18 , H05K1/14 , H05K3/36 , H05K7/14 , H01R12/70 , H01R12/79 , H01R13/35 , G06F13/40 , H05K1/11
摘要： An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

86. 发明授权

US10477680B2 Ink composition for light sintering, wiring board using same and manufacturing method therefor 有权
公开(公告)号：US10477680B2
公开(公告)日：2019-11-12
申请号：US16118096
申请日：2018-08-30
申请人： Korea Electronics Technology Institute
发明人： Yoonjin Kim , Jinwoo Cho , Kwonwoo Shin , Yonggon Seo , Yeonwon Kim , Sanghyeon Jang , Namje Jo
IPC分类号： H01B1/20 , H05K1/00 , C09D11/00 , H05K1/09 , B22F9/24 , C09D11/52 , H01B1/22 , B22F1/00 , B22F1/02 , C09D11/037 , H05K3/02 , H05K3/12 , H05K3/22
摘要： The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.

87. 发明申请

US20190331305A1 LED TUBE LAMP 审中-公开
公开(公告)号：US20190331305A1
公开(公告)日：2019-10-31
申请号：US16436454
申请日：2019-06-10
申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
发明人： Aiming Xiong , Xintong Liu
IPC分类号： F21K9/278 , F21V15/015 , F21V25/04 , F21V3/06 , F21V23/00 , H05B33/08 , H05K1/00 , F21K9/272 , F21K9/275 , F21V23/02 , F21V29/70 , F21V25/02
摘要： A ballast-bypass light-emitting diode (LED) tube lamp includes at least a first and second external connection terminal, the first and second external connection terminals respectively connected to opposite sides of the ballast by-pass LED tube lamp. The tube lamp includes an LED module, configured to emit light in response to a driving current, and a power supply module, electrically connected to the first and second external connection terminals for receiving an AC driving signal and configured to provide the driving current to the LED module. The power supply module comprises a rectifying circuit, a filtering circuit, a driving circuit, and a circuit electrically connected to the driving circuit and configured to operate in response to whether a foreign external impedance is connected to the LED tube lamp. When part of the LED tube lamp is electrically connected to an external power source and the foreign external impedance is electrically connected to the LED tube lamp, the first circuit disables the driving circuit so as to limit the generation of the driving current to prevent the LED module from emitting light based on the driving current. When both ends of the LED tube lamp are electrically connected to an external power source and the foreign external impedance is not electrically connected to the LED tube lamp, the first circuit enables the driving circuit so as to not limit the generation of the driving current in order to allow the LED module to emitting light based on the driving current

88. 发明授权

US10439379B2 Substrate unit 有权
公开(公告)号：US10439379B2
公开(公告)日：2019-10-08
申请号：US16062997
申请日：2017-06-07
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Hideaki Tahara , Arinobu Nakamura , Kazuyoshi Ohara , Munsoku O
IPC分类号： H02G3/16 , H05K7/06 , H01R25/16 , H05K5/02 , B60R16/023 , H05K1/00 , H05K5/00 , H01R12/71 , H01R12/70 , H01R12/72 , H02G3/08
摘要： A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.

89. 发明授权

US10396432B2 Antenna-integrated radio frequency module 有权
公开(公告)号：US10396432B2
公开(公告)日：2019-08-27
申请号：US15817329
申请日：2017-11-20
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Hong In Kim , Thomas A Kim , Ho Kyung Kang
IPC分类号： H01Q1/38 , H01Q1/22 , H01Q21/06 , H01L23/66 , H01Q1/48 , H05K1/00
摘要： An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.

90. 发明授权

US10393330B2 LED lighting system incorporating folded light sheets 有权
公开(公告)号：US10393330B2
公开(公告)日：2019-08-27
申请号：US16027660
申请日：2018-07-05
申请人： Michael A. Tischler
发明人： Michael A. Tischler
IPC分类号： H01L33/62 , F21S4/20 , F21K9/90 , H05K1/00 , H05K1/02 , H05K1/18 , F21Y105/10 , F21Y103/10 , F21Y115/10
摘要： In accordance with certain embodiments, flexible light sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.

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