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1. 发明申请

US20190051964A1 WIDEBAND GYSEL POWER DIVIDER 审中-公开
公开(公告)号：US20190051964A1
公开(公告)日：2019-02-14
申请号：US15672611
申请日：2017-08-09
申请人： Anaren, Inc.
发明人： David Senior , Chong Mei
IPC分类号： H01P5/10 , H03H7/48 , H01P5/16 , H01P5/04 , H05K1/02
CPC分类号： H01P5/1007 , H01P5/04 , H01P5/16 , H01P5/187 , H03H7/48 , H05K1/0237
摘要： A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.

2. 发明申请

US20170309983A1 HIGH POWERED RF PART FOR IMPROVED MANUFACTURABILITY 审中-公开
公开(公告)号：US20170309983A1
公开(公告)日：2017-10-26
申请号：US15486361
申请日：2017-04-13
申请人： Anaren, Inc.
发明人： Michael Len , Hans Peter Ostergaard
IPC分类号： H01P1/30 , H05K1/02 , H01P3/08 , H05K1/11 , H05K1/03
CPC分类号： H01P1/30 , H01P5/187 , H05K1/0203 , H05K1/0204 , H05K1/0215 , H05K1/0243 , H05K1/0251 , H05K1/0306 , H05K3/3431 , H05K3/3442
摘要： An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

3. 发明申请

US20170026201A1 WIDEBAND RF DEVICE 有权
标题翻译：宽带射频设备
公开(公告)号：US20170026201A1
公开(公告)日：2017-01-26
申请号：US14803529
申请日：2015-07-20
申请人： Anaren, Inc.
发明人： Chong Mei , Ying Huang
IPC分类号： H04L25/02
CPC分类号： H04L25/0278 , H01F2017/0073 , H01L23/5227 , H01P5/028 , H01P5/10 , H01P5/187 , H03H7/38 , H03H7/42 , H03H2001/0078 , H04L25/0274 , H04L25/0276
摘要： An RF device includes an impedance transformation circuit having a plurality of first RF couplers. Each first RF coupler includes a first portion of a first transmission line winding disposed on at least one first printed circuit board (PCB) and is configured to be electromagnetically coupled to a first portion of a second transmission line winding disposed on at least one second printed circuit board (PCB). The RF device also includes a balun circuit includes a plurality of second RF couplers coupled to balanced port connections, each second RF coupler including a second portion of the first transmission line winding wound around the first portion of a first transmission line winding and configured to be electromagnetically coupled to a second portion of the second transmission line winding wound around the first portion of a second transmission line winding.
摘要翻译： RF装置包括具有多个第一RF耦合器的阻抗变换电路。每个第一RF耦合器包括设置在至少一个第一印刷电路板（PCB）上的第一传输线绕组的第一部分，并且被配置为电磁耦合到设置在至少一个第二印刷电路板上的第二传输线绕组的第一部分电路板（PCB）。 RF设备还包括平衡 - 不平衡变换器电路，其包括耦合到平衡端口连接的多个第二RF耦合器，每个第二RF耦合器包括缠绕在第一传输线绕组的第一部分上的第一传输线绕组的第二部分，并且被配置为电磁耦合到缠绕在第二传输线绕组的第一部分上的第二传输线绕组的第二部分。

4. 发明申请

US20140159836A1 Laminated Ceramic RF Assembly 有权
标题翻译：层压陶瓷射频组件
公开(公告)号：US20140159836A1
公开(公告)日：2014-06-12
申请号：US13803644
申请日：2013-03-14
申请人： ANAREN, INC.
发明人： Benton O'Neil , Adam Cook , Benjamin Shawley
IPC分类号： H01P3/08 , H01P11/00
CPC分类号： H01P3/085 , H01P3/088 , H01P11/003 , Y10T29/49016
摘要： The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
摘要翻译：本发明涉及一种带状线组件，其包括第一预烧结陶瓷基片，其包括设置在第一预烧制陶瓷基片的第一表面上的接地平面。第二预烧结陶瓷基板包括设置在其第一表面上的接地平面和设置在与第一表面相对的第二预烧结陶瓷基板的第二表面上的电路。电路设置在第一预烧结陶瓷基板和第二预烧结陶瓷基板之间。导电接合层设置在电路的周围以及第一预烧结陶瓷基板和第二预烧结陶瓷基板之间。

5. 发明申请

US20140085019A1 SYMMETRICAL HYBRID COUPLER 有权
标题翻译：对称混合耦合器
公开(公告)号：US20140085019A1
公开(公告)日：2014-03-27
申请号：US13840137
申请日：2013-03-15
申请人： ANAREN, INC.
发明人： Chong Mei , Halid Mustacoglu
IPC分类号： H01P5/22
CPC分类号： H01P5/184 , H01P5/187
摘要： The present invention is directed to a hybrid coupler device that includes a first transmission line structure and a second transmission line structure. The first transmission line structure is interdigitally coupled with the second transmission line structure such that each transmission line in the second transmission line structure is disposed adjacent to a transmission line in the first transmission line structure. The coupling or the mutual capacitance Cd between the transmission lines of the present invention need not be equal; in fact, they all can be different.
摘要翻译：本发明涉及一种混合耦合器件，其包括第一传输线结构和第二传输线结构。第一传输线结构与第二传输线结构互指耦合，使得第二传输线结构中的每个传输线被布置为与第一传输线结构中的传输线相邻。本发明的传输线之间的耦合或互电容Cd不必相等; 其实他们都可以有所不同。

6. 发明申请

US20120103169A1 Magnetic Instrument Pickup 有权
标题翻译：磁性仪器拾音器
公开(公告)号：US20120103169A1
公开(公告)日：2012-05-03
申请号：US12915987
申请日：2010-10-29
申请人： Thomas Lingel
发明人： Thomas Lingel
IPC分类号： G10H3/18
CPC分类号： G10H3/08 , G10H3/18 , G10H3/181
摘要： An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.
摘要翻译：一种包括薄层叠印刷电路板堆叠的仪器拾取器。每个层包括具有限定线圈结构的窄线和间隔的蚀刻线圈导体结构。这些层通过通孔连接。蚀刻线小于常规仪器拾取器的绝缘铜线（有时也称为磁线），这意味着拾音器的尺寸，体积和/或高度可相对于传统的绕线乐器拾音器而减小。

7. 发明授权

US08138848B2 Circulator/isolator with an asymmetric resonator 有权
标题翻译：具有非对称谐振器的循环器/隔离器
公开(公告)号：US08138848B2
公开(公告)日：2012-03-20
申请号：US12611517
申请日：2009-11-03
申请人： Thomas Lingel
发明人： Thomas Lingel
IPC分类号： H01P1/387
CPC分类号： H01P1/387
摘要： The present invention is directed to a circulator device that includes a housing defining an interior three-dimensional volume. The housing includes a plurality of port openings disposed therein. A gyromagnetic resonator stack is disposed in the housing. The gyromagnetic resonator stack includes a circuit disposed between a first ferrite disk and a second ferrite disk. The first ferrite disk and the second ferrite disks form a pair of ferrite disks having a ferrite disk centroid and a ferrite disk perimeter. The circuit including an asymmetric center resonator having a eccentric region characterized by a predetermined resonator geometry. The circuit further including an impedance matching transmission line structure coupled to an edge of the eccentric region proximate the ferrite disk perimeter and at least one 50 Ohm transmission line structure coupled to a non-eccentric portion of the asymmetric center resonator. Each of the impedance matching transmission line structure and the at least one 50 Ohm transmission line structure extending through corresponding port openings of the plurality of port openings. The impedance matching transmission line structure is characterized by a section geometry and a predetermined matching impedance. The predetermined matching impedance is a function of the section geometry and at least one performance parameter of the device is a function of the predetermined resonator geometry.
摘要翻译：本发明涉及一种环行器装置，其包括限定内部三维体积的壳体。壳体包括设置在其中的多个端口开口。回转磁共振器堆叠设置在壳体中。回旋磁共振器堆叠包括设置在第一铁氧体磁盘和第二铁氧体磁盘之间的电路。第一铁氧体磁盘和第二铁氧体磁盘形成具有铁氧体磁盘重心和铁氧体磁盘周长的一对铁氧体磁盘。该电路包括具有以预定谐振器几何形状为特征的偏心区域的不对称中心谐振器。电路还包括耦合到靠近铁氧体磁盘周边的偏心区域的边缘的阻抗匹配传输线结构以及耦合到不对称中心谐振器的非偏心部分的至少一个50欧姆传输线结构。每个阻抗匹配传输线结构和至少一个50欧姆传输线结构延伸穿过多个端口开口中的相应端口开口。阻抗匹配传输线结构的特征在于截面几何形状和预定的匹配阻抗。预定匹配阻抗是截面几何的函数，并且装置的至少一个性能参数是预定的谐振器几何形状的函数。

8. 发明授权

US08044749B1 Coupler device 有权
标题翻译：耦合器装置
公开(公告)号：US08044749B1
公开(公告)日：2011-10-25
申请号：US12392649
申请日：2009-02-25
申请人： Tomasz M. Witas , Michael J. Lugert , Niels H. Kirkeby
发明人： Tomasz M. Witas , Michael J. Lugert , Niels H. Kirkeby
IPC分类号： H01P5/18 , H01P3/08
CPC分类号： H01P5/185
摘要： The present invention is directed to a coupler that includes a coupler structure including at least one first transmission line disposed on a first major surface of a coupler dielectric substrate and at least one second transmission line disposed on a second major surface of the coupler dielectric substrate. The coupler structure includes four symmetric ports such that each port of the four symmetric ports is characterized by substantially identical impedance characteristics. A first ground plane structure is coupled to the coupler structure and including a first outer dielectric material and a first conductive exterior layer disposed substantially parallel to the first major surface. A second ground plane structure is coupled to the coupler structure and including a second outer dielectric material and a second conductive exterior layer disposed substantially parallel to the second major surface. A thermal path is disposed between the coupler structure and at least one of the first conductive exterior layer or second conductive exterior layer. The thermal path is characterized by a thermal resistance substantially within a range between 15 W/mK and 50 W/mK, such that the coupler has a power handling capability of more than 800 W per square inch of heat sink interface.
摘要翻译：本发明涉及一种耦合器，其包括耦合器结构，该耦合器结构包括设置在耦合器电介质基板的第一主表面上的至少一个第一传输线和设置在耦合器电介质基板的第二主表面上的至少一个第二传输线。耦合器结构包括四个对称端口，使得四个对称端口的每个端口的特征在于基本相同的阻抗特性。第一接地平面结构耦合到耦合器结构并且包括基本上平行于第一主表面设置的第一外部介电材料和第一导电外部层。第二接地平面结构耦合到耦合器结构并且包括基本上平行于第二主表面设置的第二外部电介质材料和第二导电外部层。在所述耦合器结构和所述第一导电外层或第二导电外层中的至少一个之间设置热路径。热路径的特征在于基本上在15W / mK和50W / mK之间的范围内的热阻，使得耦合器具有大于800W每平方英寸的散热器接口的功率处理能力。

9. 发明授权

US07659792B2 Circulator device and a method for assembly 失效
标题翻译：循环装置和组装方法
公开(公告)号：US07659792B2
公开(公告)日：2010-02-09
申请号：US12055717
申请日：2008-03-26
申请人： Karen N. Kocharyan , Bradley J. Wright
发明人： Karen N. Kocharyan , Bradley J. Wright
IPC分类号： H01P1/36
CPC分类号： H01P1/383 , H01P11/00 , Y10T29/49016
摘要： The present invention is directed to a circulator/isolator device that includes a housing having a substantially planar base portion integrally connected to a segmented flexible wall structure extending in a direction normal thereto. The substantially planar base portion and the segmented flexible wall structure forms an interior housing volume having a predetermined geometry. The segmented flexible wall structure includes a plurality of port apertures disposed therein. The plurality of port apertures are separated from each other and disposed at predetermined locations in the segmented flexible wall structure. A central stack is disposed within the interior housing volume at a predetermined position on the base portion. The central stack includes a substantially flat conductor having a plurality of port structures extending therefrom. Each of the plurality of port structures are disposed at predetermined positions at a perimeter portion of the substantially flat conductor. The predetermined positions substantially conform to the predetermined locations such that each of the plurality of port structures extend through the segmented flexible wall structure at a corresponding one of the plurality of port apertures. A cover member is disposed within the housing at one end thereof, opposite the base portion, such that an exterior major surface of the cover is accessible via an exterior of the device and an interior major surface of the cover is disposed adjacent the central stack. A retaining member is disposed around a perimeter of the segmented flexible wall structure at the one end. The retaining member is configured to apply a substantially uniform radial compressive force to the segmented flexible wall structure to retain the cover member there within. The cover member applies a registration force to the central stack assembly to maintain the central stack assembly at the predetermined position.
摘要翻译：本发明涉及一种循环器/隔离器装置，其包括壳体，该壳体具有与沿其垂直方向延伸的分段柔性壁结构一体地连接的基本平坦的基部。基本平坦的基部和分段的柔性壁结构形成具有预定几何形状的内部壳体。分段柔性壁结构包括设置在其中的多个端口孔。多个端口孔彼此分离并且设置在分段的柔性壁结构中的预定位置处。中央堆叠体设置在内部容纳体积内的基部上的预定位置处。中心堆叠包括具有从其延伸的多个端口结构的基本扁平的导体。多个端口结构中的每一个设置在基本平坦的导体的周边部分的预定位置处。预定位置基本上符合预定位置，使得多个端口结构中的每一个在多个端口孔中的对应的一个端口孔处延伸穿过分段的柔性壁结构。盖构件在其一端处设置在壳体内，与基部相对，使得盖的外部主表面可经由装置的外部接近，并且盖的内部主表面邻近中心堆叠设置。保持构件在一端设置在分段的柔性壁结构的周边周围。保持构件被构造成向分段的柔性壁结构施加基本均匀的径向压缩力，以将覆盖构件保持在其中。盖构件向中央堆叠组件施加配准力以将中央堆叠组件保持在预定位置。

10. 发明申请

US20100007433A1 Power Splitter/Combiner 有权
公开(公告)号：US20100007433A1
公开(公告)日：2010-01-14
申请号：US12501171
申请日：2009-07-10
申请人： Hans Jensen
发明人： Hans Jensen
IPC分类号： H03H7/00
CPC分类号： H01P5/16 , H03H7/463 , H03H7/48
摘要： The present invention is directed to a system that includes a front-end interface device having a first front-end interface port, a second front-end interface port and a third front-end interface port. The front-end interface device is configured to split a first signal directed into the first front-end interface port into a second signal provided at the second front-end interface port and a third signal provided at the third front-end interface port. The first signal has a first bandwidth, the second signal has a second bandwidth and the third signal has a third bandwidth. The second bandwidth is substantially disposed in a relatively high frequency portion of the first bandwidth and the third bandwidth is substantially disposed in a relatively low frequency portion of the first bandwidth. An N-way high-band device includes a first high-band device port coupled to the second front-end interface port and N second high band ports. N is an integer greater than or equal to two (2). The N-way high-band device is configured to split the second signal into N-high band signals and direct the N-high band signals out of corresponding ones of the N-second high band ports. An N-way low-band device includes a first low-band device port coupled to the third front-end interface port and N-second low band ports. The N-way low-band device is configured to split the third signal into N-low band signals and direct the N-low band signals out of corresponding ones of the N-second low band ports. N back-end interface devices are coupled to the N-way high-band device and the N-way low-band device. Each back-end interface device of the N back-end interface devices includes a first back-end interface port coupled to a corresponding one of the N second high band ports, a second back-end interface port coupled to a corresponding one of the N second low band ports, and a third back-end interface port. Each back-end interface is configured to combine one of the N-high band signals and one of the N-low band signals to form a fourth signal directed out of the third back-end interface port such that N-fourth signals are directed out of the N back-end interface devices. The fourth signal has a fourth bandwidth. The fourth signal is a version of the first signal such that the fourth bandwidth and the first bandwidth are substantially identical.

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