专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100119811A1 CONDUCTIVE POLISHING PAD AND METHOD FOR MAKING THE SAME 有权
标题翻译：导电抛光垫及其制造方法
公开(公告)号：US20100119811A1
公开(公告)日：2010-05-13
申请号：US12427259
申请日：2009-04-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
IPC分类号： B24B29/00 , B05D1/36 , B05D5/00 , B32B3/26
CPC分类号： B24B37/22 , B23H5/08 , B24B37/24 , B32B3/266 , B32B5/022 , B32B27/08 , B32B27/12 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2255/26 , B32B2307/7265 , B32B2307/728 , D06M15/227 , D06M15/263 , D06M15/507 , D06M15/564 , D06N3/042 , D06N3/045 , D06N3/123 , D06N3/14 , D06N2209/041 , D06N2209/105 , D06N2209/141 , D06N2213/04 , D06P1/5221 , D06P1/5271 , D06P1/5285 , Y10T428/249981
摘要： The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
摘要翻译：导电性抛光垫及其制造方法技术领域本发明涉及导电性抛光垫及其制造方法。导电抛光垫包括底层，导电膜和抛光层。底层包括第一高聚物和纤维基质。第一高分子聚合物覆盖纤维基底，并具有多个第一孔。导电膜设置在底层上。抛光层设置在导电膜上，并包括第二高聚物。第二高分子具有多个第二孔。即使底层和抛光层是不良导体，其导电性也被导电膜提高，因此抛光垫具有良好的导电性。此外，抛光垫具有柔性表面，其防止抛光时工件表面被抛光而被划伤。

2. 发明申请

US20100227118A1 SHEET HAVING DISCONTINUOUS ADHESION POINTS AND METHOD FOR MAKING THE SAME 有权
标题翻译：具有不连续粘合点的片材及其制备方法
公开(公告)号：US20100227118A1
公开(公告)日：2010-09-09
申请号：US12536277
申请日：2009-08-05
申请人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Wen-Chieh Wu
发明人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Wen-Chieh Wu
IPC分类号： B32B5/00 , B32B3/10 , B32B37/00 , B32B38/16
CPC分类号： B32B7/14 , B24B37/30 , B32B27/065 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/32 , B32B27/34 , B32B27/40 , B32B37/1292 , B32B2266/0221 , B32B2266/0228 , B32B2266/0235 , B32B2266/025 , B32B2266/0257 , B32B2266/0278 , B32B2429/00 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2551/00 , Y10T428/24355 , Y10T428/24562
摘要： The present invention relates to a sheet having discontinuous adhesion points and a method for making the same. The sheet includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.
摘要翻译：本发明涉及具有不连续粘合点的片材及其制造方法。片材包括缓冲层，吸附层和粘附层。粘附层设置在缓冲层和吸附层之间。粘合层具有多个粘合点，以将缓冲层和吸附层结合在一起。粘合点是不连续的，并且之间有间隙。因此，当按压片材时，可以通过粘合点之间的间隙排出空气，从而增加吸附力。

3. 发明授权

US07662028B2 Polishing pad having groove structure for avoiding stripping of a polishing surface of the polishing pad 有权
标题翻译：抛光垫具有用于避免剥离抛光垫的抛光表面的凹槽结构
公开(公告)号：US07662028B2
公开(公告)日：2010-02-16
申请号：US12139525
申请日：2008-06-16
申请人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
发明人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
IPC分类号： B24D11/00
CPC分类号： B24B37/26
摘要： A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.
摘要翻译：一种用于避免剥离抛光垫的抛光表面的凹槽结构，所述抛光垫包括基底材料和研磨层。基材具有表面。磨削层设置在表面上，并且暴露基体材料边缘周围的一部分表面。研磨层具有多个第一凹槽和第二凹槽，并且第一凹槽与第二凹槽交叉以限定多个研磨区域。围绕基材边缘的表面的暴露部分位于第一凹槽，第二凹槽和抛光垫的边缘之间。抛光垫包含更多的研磨液，以清洁小磨碎的碎片。研磨层不具有尖锐的结构，并且不容易剥离以形成小的研磨件。因此，磨削质量和磨削效果得到提高。

4. 发明授权

US08491359B2 Polishing pad, use thereof and method for making the same 有权
标题翻译：抛光垫及其制造方法
公开(公告)号：US08491359B2
公开(公告)日：2013-07-23
申请号：US12862098
申请日：2010-08-24
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
IPC分类号： B32B5/32 , B24B37/22
CPC分类号： B24B37/22 , B24D18/00 , Y10T428/24983 , Y10T428/249981
摘要： The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
摘要翻译：抛光垫技术领域本发明涉及一种抛光垫，其包括用于研磨基板的抛光片，包括多个孔的缓冲片和用于将缓冲片粘附到抛光片的粘合剂; 其中所述粘合剂通过聚合具有流动性的大分子形成。还提供了一种抛光包括使用抛光垫的基板的方法和用于制造上述抛光垫的方法。

5. 发明申请

US20110045744A1 Polishing Pad, Use Thereof and Method for Making the Same 有权
标题翻译：抛光垫，使用方法和制作方法
公开(公告)号：US20110045744A1
公开(公告)日：2011-02-24
申请号：US12862098
申请日：2010-08-24
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Lyang-Gung Wang , Wen-Chieh Wu
IPC分类号： B24D11/00 , B24B1/00
CPC分类号： B24B37/22 , B24D18/00 , Y10T428/24983 , Y10T428/249981
摘要： The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
摘要翻译：抛光垫技术领域本发明涉及一种抛光垫，其包括用于研磨基板的抛光片，包括多个孔的缓冲片和用于将缓冲片粘附到抛光片的粘合剂; 其中所述粘合剂通过聚合具有流动性的大分子形成。还提供了一种抛光包括使用抛光垫的基板的方法和用于制造上述抛光垫的方法。

6. 发明授权

US08343586B2 Conductive polishing pad and method for making the same 有权
标题翻译：导电抛光垫及其制造方法
公开(公告)号：US08343586B2
公开(公告)日：2013-01-01
申请号：US12427259
申请日：2009-04-21
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Chun-Ta Wang
IPC分类号： B05D1/36 , B05D7/00
CPC分类号： B24B37/22 , B23H5/08 , B24B37/24 , B32B3/266 , B32B5/022 , B32B27/08 , B32B27/12 , B32B27/308 , B32B27/32 , B32B27/36 , B32B27/40 , B32B2255/26 , B32B2307/7265 , B32B2307/728 , D06M15/227 , D06M15/263 , D06M15/507 , D06M15/564 , D06N3/042 , D06N3/045 , D06N3/123 , D06N3/14 , D06N2209/041 , D06N2209/105 , D06N2209/141 , D06N2213/04 , D06P1/5221 , D06P1/5271 , D06P1/5285 , Y10T428/249981
摘要： The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
摘要翻译：导电性抛光垫及其制造方法技术领域本发明涉及导电性抛光垫及其制造方法。导电抛光垫包括底层，导电膜和抛光层。底层包括第一高聚物和纤维基质。第一高分子聚合物覆盖纤维基底，并具有多个第一孔。导电膜设置在底层上。抛光层设置在导电膜上，并包括第二高聚物。第二高分子具有多个第二孔。即使底层和抛光层是不良导体，其导电性也被导电膜提高，因此抛光垫具有良好的导电性。此外，抛光垫具有柔性表面，其防止抛光时工件表面被抛光而被划伤。

7. 发明授权

US08277290B2 Polishing pad and polishing device 有权
标题翻译：抛光垫和抛光装置
公开(公告)号：US08277290B2
公开(公告)日：2012-10-02
申请号：US12550544
申请日：2009-08-31
申请人： Allen Chiu , Yu-Lung Jeng
发明人： Allen Chiu , Yu-Lung Jeng
IPC分类号： B24B5/00
CPC分类号： B24B37/22
摘要： A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.
摘要翻译：在本发明中提供了用于半导体抛光工艺的抛光垫，并且使用压敏粘合剂来连接抛光垫。抛光垫包括基板，并且基板包括抛光表面和对应于抛光表面的反面。抛光垫的特征在于：形成在基板的背面并用于与底层连接的压敏粘合剂，并且压敏粘合剂的水平粘合性高于压敏粘合剂的垂直粘合力。

8. 发明申请

US20100099343A1 POLISHING PAD HAVING ABRASIVE GRAINS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有磨粒的抛光垫及其制造方法
公开(公告)号：US20100099343A1
公开(公告)日：2010-04-22
申请号：US12493491
申请日：2009-06-29
申请人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Kun-Cheng Tsai , Chih-Yi Lin
发明人： Chung-Chih Feng , I-Peng Yao , Yung-Chang Hung , Kun-Cheng Tsai , Chih-Yi Lin
IPC分类号： B24D11/00
CPC分类号： B24B37/245
摘要： The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers.
摘要翻译：本发明涉及一种具有磨粒的抛光垫及其制造方法。具有磨粒的抛光垫包括多根纤维，多个磨粒和高聚物。纤维彼此相交以形成纤维基质。磨粒附着在纤维上。高分子聚合物覆盖纤维和磨粒。由于纤维的柔韧性，磨粒不容易划伤待抛光的工件的表面。

9. 发明授权

US09889630B2 Polishing equipment having discontinuous adhesion points and method for making the sheet 有权
公开(公告)号：US09889630B2
公开(公告)日：2018-02-13
申请号：US12536277
申请日：2009-08-05
申请人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Wen-Chieh Wu
发明人： Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Wen-Chieh Wu
IPC分类号： B32B7/14 , B32B27/40 , B32B27/34 , B32B27/32 , B32B27/30 , B32B27/06 , B24B37/30 , B32B37/12
CPC分类号： B32B7/14 , B24B37/30 , B32B27/065 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/32 , B32B27/34 , B32B27/40 , B32B37/1292 , B32B2266/0221 , B32B2266/0228 , B32B2266/0235 , B32B2266/025 , B32B2266/0257 , B32B2266/0278 , B32B2429/00 , B32B2457/00 , B32B2457/08 , B32B2457/202 , B32B2551/00 , Y10T428/24355 , Y10T428/24562
摘要： The sheet of a polishing equipment of the present invention includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.

10. 发明授权

US08123597B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08123597B2
公开(公告)日：2012-02-28
申请号：US12325376
申请日：2008-12-01
申请人： Allen Chiu , Shao-Yu Chen , Yu-Lung Jeng
发明人： Allen Chiu , Shao-Yu Chen , Yu-Lung Jeng
IPC分类号： B24B7/22
CPC分类号： B24B37/26 , Y10S451/921
摘要： The polishing pad includes a polishing surface, on which is formed with a plurality of first grooves and a plurality of second grooves, wherein the characteristic of the polishing pad is in that: the first grooves are connected to the second grooves, the width of first grooves are larger than that of the second grooves, the depth of first grooves are larger than that of the second grooves, the density of first grooves are larger than that of the second grooves, and the first grooves and the second grooves are uniformly distributed over the polishing surface respectively. Therefore when the polishing step is performed using the polishing pad, smaller scraps produced after polishing or smaller polishing particles in the slurry or more turbid slurry can flow out of the polishing pad via the second groove, and larger scraps or particles can flow out of the polishing pad via the first groove.
摘要翻译：抛光垫包括抛光表面，其上形成有多个第一凹槽和多个第二凹槽，其中抛光垫的特征在于：第一凹槽连接到第二凹槽，第一凹槽的宽度槽比第二槽大，第一槽的深度大于第二槽的深度，第一槽的密度大于第二槽的密度，并且第一槽和第二槽均匀地分布在抛光面。因此，当使用抛光垫进行抛光步骤时，在浆料或更混浊的浆料中抛光后产生的较小的废料或较小的抛光颗粒可以经由第二槽流出抛光垫，并且较大的碎屑或颗粒可以从抛光垫经由第一槽。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式