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1. 发明申请

US20220246494A1 SYSTEM FOR COOLING SEMICONDUCTOR COMPONENT, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SYSTEM 有权
公开(公告)号：US20220246494A1
公开(公告)日：2022-08-04
申请号：US17519520
申请日：2021-11-04
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa Choi
IPC分类号： H01L23/473 , H01L23/31
摘要： Provided is a system for cooling semiconductor components including: a cover body including at least one upper cover and lower cover, which are separated from each other, face each other, and are combined to form a coolant flow path in an inner space thereof; an inlet combined to one side of the cover body and used for a coolant to flow in; an outlet combined to the other side of the cover body and used for the coolant to be discharged; at least one connecting part pin inserted and arranged toward a flowing direction of the coolant in the inner space of the cover body; and insertion grooves formed for the connecting part pins to be inserted in the inner space of the cover body, wherein the upper cover or the lower cover of the cover body is combined to at least one of the upper surfaces or the lower surfaces of semiconductor components by using connecting members so that heat transmitted from the semiconductor components to the connecting part pins is efficiently radiated by enlarging an area contacting the coolant.

2. 发明授权

US11289397B2 Heat sink board for a semiconductor device 有权
公开(公告)号：US11289397B2
公开(公告)日：2022-03-29
申请号：US16995825
申请日：2020-08-18
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa Choi , Young Hun Kim , Jeonghun Cho , So Young Choi
IPC分类号： H01L23/495 , H01L23/48 , H01L21/00 , H05K7/20 , H05K7/18 , H01L23/367 , H01L23/373 , H01L21/48 , H01L23/00 , H01L25/07 , H01L23/32 , H01L21/56
摘要： A semiconductor package according to an embodiment of the present invention includes: a heat sink board including an insulated board and a first metal layer formed on the insulated board; at least one semiconductor chip placed on the first metal layer; a plurality of lead frames connected to the semiconductor chips used to electrically connect the semiconductor chips to the outside; and a package housing partially covering the heat sink board, wherein both end parts of the insulated board are projected further than both end parts of the first metal layer.

3. 发明申请

US20210358832A1 METAL POST, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20210358832A1
公开(公告)日：2021-11-18
申请号：US17147460
申请日：2021-01-13
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa CHOI
IPC分类号： H01L23/433 , H01L23/498 , H01L23/367
摘要： Provided is a semiconductor package including: a first substrate comprising a specific pattern formed thereon to enable electrical connection; a second substrate, which is spaced apart from and faces the first substrate, comprising a specific pattern formed thereon to enable electrical connection; at least one semiconductor chip attached to the first substrate; at least one metal post formed in a non-vertical structure between the first substrate and the second substrate for dispersing a coefficient of thermal expansion (CTE) stress directly generated from the second substrate, wherein the metal post comprises one end attached on the at least one semiconductor chip, and the other end attached on the pattern of the first substrate or the second substrate; at least one terminal lead electrically connected to the first substrate or the second substrate; and a package housing covering the first and second substrates and exposing the terminal leads to the outside.

4. 发明申请

US20210057313A1 SEMICONDUCTOR PACKAGE HAVING EXPOSED HEAT SINK FOR HIGH THERMAL CONDUCTIVITY 有权
公开(公告)号：US20210057313A1
公开(公告)日：2021-02-25
申请号：US16912724
申请日：2020-06-26
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa CHOI
IPC分类号： H01L23/495 , H01L23/31 , H01L23/367
摘要： Provided is a semiconductor package having an exposed heat sink for high thermal conductivity. The semiconductor package includes at least one semiconductor chip 110, the lead frame 120, a signal line 130, the sealing member 140, and at least one heat sink 150, wherein the lead frame 120 has a first surface, to which the semiconductor chips 110 are attached, and a second surface facing the first surface, the signal line 130 electrically connects the semiconductor chips 110 and the semiconductor chip 110 to the lead frame 120 by wire bonding or clip bonding, the sealing member 140 surrounds areas where the semiconductor chips 110 are attached, except for an external connection terminal 121 of the lead frame 120, and exposes the second surface of the lead frame 120, and the at least one heat sink 150 are attached to the second surface of the exposed lead frame 120. Here, spaces A and B are interposed between the sealing member 140 and the heat sink 150 which face each other, and the heat sink 150 is attached to the second surface of the lead frame 120 after molding of the sealing member 140. Accordingly, the sealing member 140 and the heat sink 150 may be prevented from being warped and thus, stress directly applied to the semiconductor chip 110 is removed. Therefore, reliability and electrical characteristics may be stably secured, and a terminal used in electrical connection may be easily secured through the lead frame 120 exposed to the outside of the sealing member 140.

5. 发明申请

US20200185845A1 PRESS-FIT PIN, SEMICONDUCTOR PACKAGE HAVING THE SAME AND METHOD FOR MANUFACTURING THE PRESS-FIT PIN 审中-公开
公开(公告)号：US20200185845A1
公开(公告)日：2020-06-11
申请号：US16563957
申请日：2019-09-09
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa Choi , Soon Seong Choi , Jeong Hun Cho
IPC分类号： H01R12/58 , H01L23/495 , H01L23/498 , H01R12/70
摘要： Provided is a press-fit pin. The press-fit pin according to an embodiment of the present invention includes: a press unit press-fitted into a through hole formed on a board, which is press-fitted into an inner surface of the board including the through hole, pressurized toward a long hole formed inside the press unit, applies a repulsive force to the inner surface of the board through an elastic force, and maintains a contact with the inner surface of the board; a first terminal which is extended for a predetermined length from one side of the press unit along a longitudinal direction of the press unit and is disposed at the upper side of the board when press fitting the press unit; and a second terminal which is extended for a predetermined length from the other side of the press unit along the longitudinal direction of the press unit and is disposed at the lower side of the board, when press fitting the press unit, wherein the press unit includes a plurality of press-fit parts which faces each other along a width direction of the press unit based on the long hole, is pressurized to the inside along the width direction of the press unit and a thickness direction of the press unit, which crosses the width direction of the press unit, when the plurality of press-fit parts is press-fitted into the through hole, and applies a repulsive force toward the width direction of the press unit and the thickness direction of the press unit using an elastic force.

6. 发明授权

US11367666B2 Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same 有权
公开(公告)号：US11367666B2
公开(公告)日：2022-06-21
申请号：US16638135
申请日：2018-08-23
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa Choi , Jeong Hun Cho , Soon Seong Choi
IPC分类号： H01L23/13 , H01L23/31 , H01L23/495
摘要： Provided is a semiconductor package. More particularly, the present invention relates to a clip, a lead frame, and a substrate used in a semiconductor package having engraved patterns formed on surfaces thereof so as to increase an adhesive force and a corrosion resistant performance, thereby improving reliability of the semiconductor package, and the semiconductor package including the same.

7. 发明申请

US20210335691A1 METHOD OF MANUFACTURING SEMICONDUCTOR HAVING DOUBLE-SIDED SUBSTRATE 有权
公开(公告)号：US20210335691A1
公开(公告)日：2021-10-28
申请号：US17237046
申请日：2021-04-22
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa CHOI
IPC分类号： H01L23/367 , H01L25/07 , H01L23/00 , H01L23/373 , H01L23/31 , H01L21/48 , H01L21/56 , H01L25/00
摘要： Provided is a method of manufacturing a semiconductor having a double-sided substrate including preparing a first substrate on which a specific pattern is formed to enable electrical connection, preparing at least one semiconductor chip bonded to a metal post, bonding the at least one semiconductor chip to the first substrate, bonding a second substrate to the metal post, forming a package housing by packaging the first substrate and the second substrate to expose a lead frame, and forming terminal leads toward the outside of the package housing. Accordingly, the semiconductor chip and the metal post are previously joined to each other and are respectively bonded to the first substrate and the second substrate so that damage generated while bonding the semiconductor chip may be minimized and electrical properties and reliability of the semiconductor chip may be improved.

8. 发明申请

US20210249342A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20210249342A1
公开(公告)日：2021-08-12
申请号：US17105630
申请日：2020-11-27
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa CHOI , Younghun KIM , Jeonghun CHO
IPC分类号： H01L23/495 , H01L23/498
摘要： The present invention provides a semiconductor package including: a lead frame comprising at least one terminal pad and at least one first terminal lead structurally connected to the terminal pads; at least one semiconductor chip attached to the upper surfaces of the terminal pads by using a conductive first adhesive; at least one heat radiation board attached to the lower surfaces of the terminal pads by using a second adhesive; at least one second terminal lead electrically connected to the semiconductor chips, spaced apart from the terminal pads at regular intervals, and separated from the heat radiation boards; and a package housing covering parts of the first and second terminal leads, the semiconductor chips, and the terminal pads.

9. 发明申请

US20210143076A1 HEAT SINK BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 有权
公开(公告)号：US20210143076A1
公开(公告)日：2021-05-13
申请号：US16995825
申请日：2020-08-18
申请人： JMJ Korea Co., Ltd.
发明人： Yun Hwa CHOI , Young Hun KIM , Jeonghun CHO , So Young CHOI
IPC分类号： H01L23/367 , H01L23/373 , H01L25/07 , H01L23/00 , H01L21/48
摘要： A semiconductor package according to an embodiment of the present invention includes: a heat sink board including an insulated board and a first metal layer formed on the insulated board; at least one semiconductor chip placed on the first metal layer; a plurality of lead frames connected to the semiconductor chips used to electrically connect the semiconductor chips to the outside; and a package housing partially covering the heat sink board, wherein both end parts of the insulated board are projected further than both end parts of the first metal layer.

10. 发明授权

US10256207B2 Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package 有权
公开(公告)号：US10256207B2
公开(公告)日：2019-04-09
申请号：US15958581
申请日：2018-04-20
申请人： JMJ Korea Co., Ltd.
发明人： Yunhwa Choi
IPC分类号： H01L23/495 , H01L23/00 , H01L23/433
摘要： A clip-bonded semiconductor chip package comprises a lead frame having a pad and a lead; a semiconductor chip bonded onto the pad of the lead frame; a bonding pad on the semiconductor chip; metal bumps formed on the bonding pad; a clip having first and second portions coupled to each other wherein the first portion is bonded to the bonding pad via the metal bumps, wherein the second portion is bonded to the lead of the lead frame; and a package body made of a molding material around the lead frame, the semiconductor chip and the clip.

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