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1. 发明授权

US11536765B2 Probing apparatus 有权
公开(公告)号：US11536765B2
公开(公告)日：2022-12-27
申请号：US16892076
申请日：2020-06-03
申请人： MPI Corporation
发明人： Kang-Yen Fu , Ya-Hung Lo , Shou-Jen Tsai , Wei-Cheng Ku
IPC分类号： G01R31/28 , H01L21/67 , G01R1/073
摘要： A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

2. 发明授权

US11460498B2 Adjustable probe device for impedance testing for circuit board 有权
公开(公告)号：US11460498B2
公开(公告)日：2022-10-04
申请号：US17034741
申请日：2020-09-28
申请人： MPI CORPORATION
发明人： Yang-Hung Cheng , Ya-Hung Lo , Chien-Hsun Chen , Chia-Nan Chou , Chung-Yen Huang , Shou-Jen Tsai , Fuh-Chyun Tang
IPC分类号： G01R31/28 , G01R1/073
摘要： An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

3. 发明申请

US20220299564A1 WAFER INSPECTION SYSTEM 有权
公开(公告)号：US20220299564A1
公开(公告)日：2022-09-22
申请号：US17699610
申请日：2022-03-21
申请人： MPI CORPORATION
发明人： YI-HSUAN CHENG , HUNG-I LIN , PO-HAN PENG
IPC分类号： G01R31/28 , G01R1/067 , G01R1/073
摘要： A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

4. 发明授权

US11348221B2 Wafer testing method 有权
公开(公告)号：US11348221B2
公开(公告)日：2022-05-31
申请号：US17079030
申请日：2020-10-23
申请人： MPI Corporation
发明人： Chien-Yu Chen , Han-Yu Chuang , Po-Han Peng
IPC分类号： G01N21/95 , G06T7/00
摘要： A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

5. 发明授权

US11346789B2 Optical inspection system 有权
公开(公告)号：US11346789B2
公开(公告)日：2022-05-31
申请号：US17117477
申请日：2020-12-10
申请人： MPI CORPORATION
发明人： Ping-Ying Wu , Chiu-Wang Chen , Yung-Chin Liu
IPC分类号： G01N21/88
摘要： An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.

6. 发明申请

US20220155365A1 SEMICONDUCTOR INSPECTING METHOD FOR ENSURING SCRUBBING LENGTH ON PAD 有权
公开(公告)号：US20220155365A1
公开(公告)日：2022-05-19
申请号：US17524788
申请日：2021-11-12
申请人： MPI Corporation
发明人： Volker Hansel , Sebastian Giessmann , Frank Fehrmann , Chien-Hung Chen
IPC分类号： G01R31/28 , H01L21/66
摘要： A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

7. 发明申请

US20220074970A1 PROBE ASSEMBLY 有权
公开(公告)号：US20220074970A1
公开(公告)日：2022-03-10
申请号：US17469412
申请日：2021-09-08
申请人： MPI Corporation
发明人： Ming-Hsiang Hsieh , Chia-Nan Chou , Hao Wei , Chia-Jung Liu , Chia-An Yu
IPC分类号： G01R1/067
摘要： A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.

8. 发明申请

US20210333219A1 METHOD OF DETERMINING DISTANCE BETWEEN PROBE AND WAFER HELD BY WAFER PROBE STATION 有权
公开(公告)号：US20210333219A1
公开(公告)日：2021-10-28
申请号：US16858711
申请日：2020-04-27
申请人： MPI Corporation
发明人： Frank FEHRMANN , Chien-Hung CHEN , Ching-Yang YANG
IPC分类号： G01N21/95 , G01C3/02 , G02B21/00
摘要： A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.

9. 发明申请

US20210185211A1 LIGHT EMITTING ELEMENT DETECTING METHOD AND EQUIPMENT 有权
公开(公告)号：US20210185211A1
公开(公告)日：2021-06-17
申请号：US17118037
申请日：2020-12-10
申请人： MPI CORPORATION
发明人： PING-YING WU , YUNG-CHIN LIU , HSUAN-CHIAO HUANG
IPC分类号： H04N5/235 , G06T7/00
摘要： A light emitting element detecting method and a light emitting element detecting equipment adapted for the method are discloses. The method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.

10. 发明申请

US20210181237A1 POSITIONABLE PROBE CARD AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20210181237A1
公开(公告)日：2021-06-17
申请号：US17118564
申请日：2020-12-10
申请人： MPI Corporation
发明人： Zhi-Wei SU , Tzung-Je TZENG , Wen-Chi CHEN , Huo-Kang HSU , Hsueh-Chih WU , Sheng-Wei LIN , Chin-Yi LIN , Che-Wei LIN , Jian-Kai HONG , Shu-Jui CHANG
IPC分类号： G01R1/073 , G01R1/067 , G01R31/28
摘要： A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

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