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1. 发明授权

US11131722B2 Apparatus and method for checking and calibrating a component 有权
公开(公告)号：US11131722B2
公开(公告)日：2021-09-28
申请号：US16718787
申请日：2019-12-18
申请人： TDK—Micronas GmbH
发明人： Oliver Kawaletz , Martin Cornils
IPC分类号： G01R33/31 , G01R33/00
摘要： An apparatus (10) for checking a component (30) is disclosed. The apparatus (10) comprises a sample holder (20) with a module (28) for receiving at least one component (30), at least one magnetic field generator (60a, 60b, 60c) for generating a magnetic field around the module (28), an inlet (40) for feeding a tempered medium into the module (25), and an outlet (45) for discharging a tempered medium from the module (28).

2. 发明授权

US11114501B2 SOI semiconductor structure and method for manufacturing an SOI semiconductor structure 有权
公开(公告)号：US11114501B2
公开(公告)日：2021-09-07
申请号：US16691082
申请日：2019-11-21
申请人： TDK-MICRONAS GMBH
发明人： Christian Sander , Martin Cornils
IPC分类号： H01L27/22 , H01L27/12 , H01L43/04 , H01L43/06 , H01L21/762
摘要： An SOI semiconductor structure, including a substrate layer formed on a back side and a semiconductor layer of a second conductivity type formed on a front side, an insulating layer being disposed between the substrate layer and the semiconductor layer, a three-dimensional Hall sensor structure having a sensor region made up of a monolithic semiconductor body being formed in the semiconductor layer, and the semiconductor body extending from an underside up to the front side, at least three first metallic terminal contacts being formed on the upper side, and at least three second metallic terminal contacts being formed on the underside, the first terminal contacts being offset with respect to the second terminal contacts in a projection perpendicular to the front side, each first terminal contact and each second terminal contact being formed in each case on a highly doped semiconductor contact region of a second conductivity type.

3. 发明授权

US10605625B2 Measuring system 有权
公开(公告)号：US10605625B2
公开(公告)日：2020-03-31
申请号：US15664691
申请日：2017-07-31
申请人： TDK—Micronas GmbH
发明人： Joerg Franke , Timo Kaufmann
IPC分类号： G01D5/14
摘要： A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.

4. 发明授权

US10564003B2 Measuring system for determining the angle of rotation 有权
公开(公告)号：US10564003B2
公开(公告)日：2020-02-18
申请号：US15941825
申请日：2018-03-30
申请人： TDK-Micronas GmbH
发明人： Yan Bondar
IPC分类号： G01D5/14 , G01B7/30
摘要： A measuring system for determining an angle of rotation of a shaft, which is rotatable about an axis of rotation, having a magnetically conductive encoder, which is spaced from the axis of rotation and fixedly connected to the shaft, a magnet unit with a permanent magnet, and an intermediate sensor unit having two magnetic field sensors. The permanent magnet has a magnetization extending parallel to the axis of rotation, and a circular-cylindrical recess having a bottom, an axis of symmetry extending perpendicular to the bottom, and a diameter, the sensor unit being completely arranged within the recess and stationary with respect to the permanent magnet. The first distance of the encoder from the axis of rotation being less than half the diameter of the recess, the encoder being arranged in a direction parallel to the axis of rotation at a second distance from the sensor unit.

5. 发明授权

US10429209B2 Position determining unit 有权
公开(公告)号：US10429209B2
公开(公告)日：2019-10-01
申请号：US15449650
申请日：2017-03-03
申请人： TDK—Micronas GmbH
发明人： Joerg Franke , Klaus Heberle
IPC分类号： G01D5/14 , G01D5/251
摘要： A position determining unit is provided that has a number of sensor units arranged at positions along a path, and a transducer. Each sensor unit has a carrier, a first and second supply voltage connection, a switching output, a measuring unit and a bias magnet comprising two poles. The measuring unit is arranged on the carrier and has at least one magnetic field sensor, wherein the switching output is switched into an On or Off-state as a function of a threshold value exceeding or falling short of a sensor signal. The first supply voltage connection of each sensor unit is connected to a supply voltage, wherein a first sensor unit is arranged at a beginning of the path and a last sensor unit is arranged at the end of the path. The second supply voltage connection of the first sensor unit is connected to a reference potential.

6. 发明授权

US10379138B2 Adapter for receiving an integrated circuit 有权
公开(公告)号：US10379138B2
公开(公告)日：2019-08-13
申请号：US15403098
申请日：2017-01-10
申请人： TDK-Micronas GmbH
发明人： Stefan Albrecht , Christian Schladebach , Dominik Zimmermann
IPC分类号： G01R1/04 , G01R31/28 , G01R33/07 , H01L43/06 , H01L43/04
摘要： An adapter for receiving at least one integrated circuit with a Hall sensor in a housing. The adapter has a cavity for receiving the at least one integrated circuit in the housing, at least one opening connected with the cavity, and a magnetic-field generating apparatus for generating a magnetic field in the cavity. The adapter is used in a system for detecting the strength of a magnetic field.

7. 发明申请

US20190063953A1 DISTANCE MEASURING DEVICE 审中-公开
公开(公告)号：US20190063953A1
公开(公告)日：2019-02-28
申请号：US16173509
申请日：2018-10-29
申请人： TDK-Micronas GmbH
发明人： Joerg FRANKE
IPC分类号： G01D5/14 , G01R33/06 , G01B7/14
摘要： A distance measuring device with two magnetic field sensors and a permanent magnet and a semiconductor body is provided. The device includes a monolithically integrated evaluation circuit, and a difference signal can be determined by means of the magnetic field sensors and provides an output signal as a result of the determination. The value of the output signal based on the neutralization of a magnetic-flux-free region is a function of a distance of a ferromagnetic sensing element from the two magnetic field sensors. The semiconductor body is arranged between U-shaped pole shanks of the magnet, which is magnetized in the X direction, wherein the first magnetic field sensor is arranged in an area located between two opposing shanks of the first pole, and the second magnetic field sensor is arranged in an area located between two opposing shanks of the second pole.

8. 发明授权

US10080288B2 Circuit package 有权
公开(公告)号：US10080288B2
公开(公告)日：2018-09-18
申请号：US14939409
申请日：2015-11-12
申请人： Micronas GmbH
发明人： Thilo Rubehn
IPC分类号： H05K1/18 , G01R33/00
CPC分类号： H05K1/18 , G01R33/0047 , H01L2224/05554 , H01L2224/48091 , H01L2224/4813 , H01L2224/49113 , H01L2924/00014
摘要： A circuit package having a first semiconductor body with a first monolithic integrated circuit having a first signal output that is interconnected with a bonding surface, and a first signal input that is interconnected with a bonding surface. The circuit package also has a second semiconductor body with a second monolithic integrated circuit having a second signal output that is interconnected with a bonding surface, and a second signal input that is interconnected with a bonding surface. The circuit package further features a contact element with at least one bonding surface, and a carrier element, wherein the bonding surface of the first signal output and the bonding surface of the second signal input are interconnected with the contact element so that an electrical connection exists between the first signal output and the second signal input, and a portion of the contact element penetrates the circuit package.

9. 发明申请

US20180233658A1 COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE 审中-公开
公开(公告)号：US20180233658A1
公开(公告)日：2018-08-16
申请号：US15950429
申请日：2018-04-11
申请人： TDK-Micronas GmbH
发明人： Marc Baumann , Thilo Rubehn , Christian Joos , Jochen Stephan
IPC分类号： H01L43/06 , H01L43/04 , H01L27/22 , G01R33/07 , G01R33/00
摘要： A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.

10. 发明授权

US10026684B2 IC package 有权
公开(公告)号：US10026684B2
公开(公告)日：2018-07-17
申请号：US15863245
申请日：2018-01-05
申请人： TDK-Micronas GmbH
发明人： Klaus Heberle , Joerg Franke , Thomas Leneke
IPC分类号： H01L23/498 , H01L23/31 , H01L23/00 , H01L21/56 , H01L23/24 , H01L23/495
摘要： An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

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