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1. 发明授权

US11641617B2 Mechanisms for initial access to a radio access network 有权
公开(公告)号：US11641617B2
公开(公告)日：2023-05-02
申请号：US16339072
申请日：2016-11-10
申请人： Telefonaktiebolaget LM Ericsson (publ)
发明人： Bengt Lindoff , Magnus Åström
IPC分类号： H04W48/16 , H04W36/08 , H04W56/00 , H04W72/04 , H04W88/06 , H04W48/12 , H04W48/18 , H04W72/0453
摘要： There is provided mechanisms for initial access to a radio access network. The method is performed by a wireless device. The wireless device is configured for accessing the radio access network using at least a first cellular RAT and a second cellular RAT. The method comprises obtaining system information using a first carrier frequency and the first RAT. The system information comprises inter-frequency cell information of the second RAT. The method comprises synchronizing with the second RAT using a second carrier frequency based on the obtained system information in order to establish initial access to the radio access network. The second carrier frequency is higher than the first carrier frequency.

2. 发明授权

US11635153B2 Safety device for a gas-conducting device 有权
公开(公告)号：US11635153B2
公开(公告)日：2023-04-25
申请号：US17266434
申请日：2019-07-18
申请人： Truma Gerätetechnik GmbH & Co. KG
发明人： Claudio Peli , Paolo Robolini
IPC分类号： F16K17/36 , F16J3/02 , G05D16/06
摘要： The invention relates to a safety device (2) for interrupting a gas flow within a gas-conducting device (1). An inertia body (32) moves from a resting position in the case of an acceleration above a specifiable acceleration threshold value acting on it. Due to the movement, the inertia mechanism (3) activates a reaction mechanism (4), which interrupts the gas flow within the gas-conducting device (1). In this process, the safety device (2) is free of gas flowing through it.

3. 发明授权

US11632284B2 Dormant mode measurement optimization 有权
公开(公告)号：US11632284B2
公开(公告)日：2023-04-18
申请号：US17318511
申请日：2021-05-12
申请人： Telefonaktiebolaget LM Ericsson (publ)
发明人： Bo Lincoln , Robert Baldemair , Martin Hessler , Eleftherios Karipidis , Torgny Palenius , Eliane Semaan
IPC分类号： H04B7/06 , H04W24/10 , H04L41/0233 , H04W52/02 , H04J11/00 , H04L41/0816 , H04W28/02 , H04W16/28
摘要： Methods performed by a wireless device operating in a dormant mode comprise performing a measurement on each of a plurality of resources from a predetermined set of resources or demodulating and decoding information from each of a plurality of resources from a predetermined set of resources, such as a set of beams. The methods further include evaluating the measurement or the demodulated and decoded information for each of the plurality of resources against a predetermined criterion, and then discontinuing the performing and evaluating of measurements, or discontinuing the demodulating and decoding and evaluation of information, in response to determining that the predetermined criterion is met, such that one or more resources in the predetermined set of resources are neither measured nor demodulated and decoded. The methods further comprise deactivating receiver circuitry, further in response to determining that the predetermined criterion is met.

4. 发明授权

US11627002B2 Cryptographic operation 有权
公开(公告)号：US11627002B2
公开(公告)日：2023-04-11
申请号：US17316146
申请日：2021-05-10
申请人： Infineon Technologies AG
发明人： Thomas Poeppelmann , Rainer Urian
IPC分类号： H04L29/06 , G06F21/00 , H04L9/32 , H04L9/08 , H04L9/30
摘要： A method is suggested for providing a response, wherein the method comprises: obtaining a challenge from a host, determining the response based on the challenge, determining an auxiliary value based on the response or the challenge, providing the auxiliary value to the host, obtaining a random value from the host, checking the validity of the challenge based on the random value, and providing the response to the host only if the challenge is valid. Also, according methods running on the host and system are provided. Further, corresponding devices, hosts and systems are suggested.

5. 发明授权

US11624879B2 Multi-channel optical coupler 有权
公开(公告)号：US11624879B2
公开(公告)日：2023-04-11
申请号：US16967264
申请日：2019-01-31
申请人： Inneos LLC
发明人： Eric Grann , Scott Fluegel , Ihi Nzeadibe
IPC分类号： G02B6/42 , H04J14/02
摘要： Exemplary multi-channel optical couplers include a molded coupling module comprising a first surface, a second surface, a lens array receptacle, and fiber receptacles for optical fibers; an optical arrangement comprising: a particular surface carrying a reflective coating, and a further surface carrying a plurality of optical filters, each configured to pass a single optical wavelength; a first lens array configured such that each lens is optically aligned with the plurality of optical filters via at least the reflective coating, and with a position, within a particular fiber receptacle, corresponding to the end of a particular optical fiber; a second lens array arranged with the second surface such that each lens is optically aligned with an optical filter. The optical block and lens arrays can be configured such that the optical coupler produces no more than −10 dB of crosstalk on any of the optical wavelengths passed by the optical filters.

6. 发明授权

US11616542B2 Channel-matrix reduction for precoding control 有权
公开(公告)号：US11616542B2
公开(公告)日：2023-03-28
申请号：US17600853
申请日：2019-04-05
申请人： Telefonaktiebolaget LM Ericsson (publ)
发明人： Mohammadreza Malek-Mohammadi , Niklas Jaldén , Karl Werner
IPC分类号： H04B7/04 , H04B7/0456
摘要： A channel matrix representing characteristics of a multi-path channel between a transmitter device (210) equipped with multiple transmitter antennas (211, 212, 213, 214, 215) and a receiver device (220, 230, 240) equipped with multiple receiver antennas (221, 222, 231, 232, 241, 242) is determined. The channel matrix is organized in a first number of channel vectors each associated with a different one of the multiple receiver antennas (221, 222, 231, 232, 241, 242). The channel vectors are combined to a smaller second number of linear combinations of the channel vectors and a reduced channel matrix is composed from the linear combinations of the channel vectors. A precoding matrix is determined based on the reduced channel matrix, and multi-antenna transmission by the transmitter device is controlled based on the determined precoding matrix.

7. 发明授权

US11610976B2 Semiconductor device including a transistor with one or more barrier regions 有权
公开(公告)号：US11610976B2
公开(公告)日：2023-03-21
申请号：US17144193
申请日：2021-01-08
申请人： Infineon Technologies Austria AG
发明人： Caspar Leendertz , Markus Beninger-Bina , Matteo Dainese , Alice Pei-Shan Leendertz , Christian Philipp Sandow
IPC分类号： H01L29/10 , H01L29/06 , H01L29/66 , H01L29/739 , H01L29/40 , H01L29/08 , H01L29/417
摘要： A semiconductor device includes a transistor having a drift region of a first conductivity type in a semiconductor substrate having a first main surface, a body region of a second conductivity type between the drift region and first main surface, and trenches in the first main surface which pattern the substrate into mesas. The trenches include an active trench and first and second source trenches. A source region of the first conductivity type is in a first mesa arranged adjacent to the active trench. A second mesa between the first and second source trenches is in contact with at least one source trench. A barrier region of the first conductivity type at a higher doping concentration than the drift region is arranged between the body and drift regions in the second mesa. A vertical size of the barrier region is at least twice a width of the second mesa.

8. 发明授权

US11610830B2 Power semiconductor module and method for fabricating the same 有权
公开(公告)号：US11610830B2
公开(公告)日：2023-03-21
申请号：US16839683
申请日：2020-04-03
申请人： Infineon Technologies AG
发明人： Christian Schweikert , Juergen Hoegerl , Olaf Hohlfeld , Waldemar Jakobi
IPC分类号： H01L23/34 , H01L23/52 , H01L23/367 , G01K1/14 , H01L21/48
摘要： A power semiconductor module includes a power semiconductor chip arranged between a first substrate and a second substrate and electrically coupled to the substrates, and a temperature sensor arranged between the substrates and laterally besides the power semiconductor chip such that a first side of the temperature sensor faces the first substrate and a second side of the temperature sensor faces the second substrate. A first electrical contact of the temperature sensor is arranged on the first side and electrically coupled to the first substrate. A second electrical contact of the temperature sensor is arranged on the second side and electrically coupled to the second substrate.

9. 发明授权

US11610817B2 Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer 有权
公开(公告)号：US11610817B2
公开(公告)日：2023-03-21
申请号：US17206782
申请日：2021-03-19
申请人： Infineon Technologies Austria AG
发明人： Andreas Kitzler , John Cooper , Jakob Simon Dohr , Michael Knabl , Matic Krivec , Daniel Pieber
IPC分类号： H01L23/544 , H01L21/78 , H01L21/66
摘要： A method of processing a semiconductor wafer includes: forming a first metal layer or metal layer stack on a backside of the semiconductor wafer; forming a plating preventative layer on the first metal layer or metal layer stack, the plating preventative layer being formed at least over a kerf region of the semiconductor wafer and such that part of the first metal layer or metal layer stack is uncovered by the plating preventative layer, wherein the kerf region defines an area for dividing the semiconductor wafer along the kerf region into individual semiconductor dies; and plating a second metal layer or metal layer stack on the part of the first metal layer or metal layer stack uncovered by the plating preventative layer, wherein the plating preventative layer prevents plating of the second metal layer or metal layer stack over the kerf region.

10. 发明授权

US11605577B2 Semiconductor device including a bidirectional switch 有权
公开(公告)号：US11605577B2
公开(公告)日：2023-03-14
申请号：US17540512
申请日：2021-12-02
申请人： Infineon Technologies Austria AG
发明人： Ralf Otremba , Klaus Schiess , Michael Treu
IPC分类号： H01L23/495 , H01L23/00 , H01L23/31 , H01L29/20
摘要： A semiconductor device forming a bidirectional switch includes first and second carriers, first and second semiconductor chips arranged on the first and second carriers, respectively, a first row of terminals arranged along a first side face of the carrier, a second row of terminals arranged along a second side face of the carrier opposite the first side face, and an encapsulation body encapsulating the first and second semiconductor chips. Each row of terminals includes a gate terminal, a sensing terminal and at least one power terminal of the bidirectional switch.

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