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1. 发明授权

US08664996B2 Clock generator and method of generating clock signal 有权
标题翻译：时钟发生器和产生时钟信号的方法
公开(公告)号：US08664996B2
公开(公告)日：2014-03-04
申请号：US13495004
申请日：2012-06-13
申请人： Chun-Ming Kuo , Wen-Chi Chao , Keng-Jan Hsiao , Song-Yu Yang , Chun-Chi Chen
发明人： Chun-Ming Kuo , Wen-Chi Chao , Keng-Jan Hsiao , Song-Yu Yang , Chun-Chi Chen
IPC分类号： G06F1/04 , H03K3/00
CPC分类号： G06F1/08 , G06F1/3296 , Y02D10/172
摘要： A clock generator utilized for providing a clock signal includes: a first oscillator and a switching circuit. The switching circuit is coupled to the first oscillator and a second oscillator, and utilized for receiving a first oscillating signal generated from the first oscillator and a second oscillating signal generated from the second oscillator, and selecting one of the first oscillating signal and the second oscillating signal as the clock signal according to a status signal.
摘要翻译：用于提供时钟信号的时钟发生器包括：第一振荡器和开关电路。开关电路耦合到第一振荡器和第二振荡器，用于接收从第一振荡器产生的第一振荡信号和从第二振荡器产生的第二振荡信号，并且选择第一振荡信号和第二振荡器之一根据状态信号作为时钟信号。

2. 发明授权

US08579017B2 Heat dissipation device with multiple heat sinks 有权
标题翻译：具有多个散热片的散热装置
公开(公告)号：US08579017B2
公开(公告)日：2013-11-12
申请号：US12620500
申请日：2009-11-17
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
摘要翻译：示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。散热器接合连接板。热管将第一散热器的基板和第二散热器的第二散热器热连接。

3. 发明授权

US08579016B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US08579016B2
公开(公告)日：2013-11-12
申请号：US12688794
申请日：2010-01-15
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
摘要翻译：散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。导热基座牢固地附接到支撑件的底侧并与电子元件热接触。第一翅片组件牢固地附接到支撑件的顶侧。热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

4. 发明申请

US20130255929A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20130255929A1
公开(公告)日：2013-10-03
申请号：US13586902
申请日：2012-08-16
申请人： QIAO-LONG CHEN , ZI-FU YANG , MENG FU , CHUN-CHI CHEN
发明人： QIAO-LONG CHEN , ZI-FU YANG , MENG FU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B23P15/26
CPC分类号： H01L23/4006 , F28D15/0275 , F28F1/32 , F28F2275/14 , H01L21/4878 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.
摘要翻译：散热装置包括基座和多个翅片。两个闩锁部件从基座的顶表面突出，两个闩锁部件协作地在它们之间限定凹部。每个翅片在底部限定榫头。这个榫头有一个配置与这个凹槽的配合。位于两个相邻翅片之间的闩锁部件被冲压以使翅片固定在基座上。

5. 发明申请

US20130240190A1 HEAT SINK AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20130240190A1
公开(公告)日：2013-09-19
申请号：US13650499
申请日：2012-10-12
申请人： QIAO-LONG CHEN , MENG FU , ZI-FU YANG , CHUN-CHI CHEN
发明人： QIAO-LONG CHEN , MENG FU , ZI-FU YANG , CHUN-CHI CHEN
IPC分类号： F28F3/00 , B23P11/00
CPC分类号： B23P15/26 , B23P11/00 , B23P2700/10 , F28F3/048 , F28F3/06 , F28F2275/122 , H01L21/4878 , H01L23/3672 , H01L2924/0002 , Y10T29/49908 , H01L2924/00
摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.
摘要翻译：用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

6. 发明授权

US08411420B2 Electronic device assembly with two-part bracket 失效
标题翻译：具有两部分支架的电子设备组件
公开(公告)号：US08411420B2
公开(公告)日：2013-04-02
申请号：US12914988
申请日：2010-10-28
申请人： Meng Fu , Chun-Chi Chen , Bang-Jie Xie
发明人： Meng Fu , Chun-Chi Chen , Bang-Jie Xie
IPC分类号： H05K7/12
CPC分类号： F16M13/00 , F16M2200/08 , G06F1/1632 , H04R5/02
摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.
摘要翻译：电子设备组件包括电子设备和固定电子设备的支架。托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

7. 发明申请

US20130048244A1 HEAT DISSIPATION APPARATUS WITH HEAT PIPE 有权
标题翻译：热管散热装置
公开(公告)号：US20130048244A1
公开(公告)日：2013-02-28
申请号：US13271162
申请日：2011-10-11
申请人： CHUN-CHI CHEN , XING-HUA HE
发明人： CHUN-CHI CHEN , XING-HUA HE
IPC分类号： F28F9/007 , F28D15/04
CPC分类号： H01L23/3672 , F28D15/0275 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar.
摘要翻译：示例性的散热装置包括多个翅片和热管。每个翅片在其中限定通孔。套环从通孔的边缘处的每个翅片延伸。衣领向通孔的中心倾斜。颈圈的内径沿散热片的方向逐渐减小。当套管处于自然状态时，热管的直径大于套环的最小内径。当热管延伸穿过翅片的通孔时，套管被热管推动以向外扩张，使得热管紧密接触套环的内表面。

8. 发明授权

US08251741B2 Electrical connector integrally formed with screw holes 有权
标题翻译：电连接器与螺丝孔一体形成
公开(公告)号：US08251741B2
公开(公告)日：2012-08-28
申请号：US12786451
申请日：2010-05-25
申请人： Wen-Huei Yang , Chun-Chi Chen
发明人： Wen-Huei Yang , Chun-Chi Chen
IPC分类号： H01R13/73
CPC分类号： H01R12/7047 , H01R12/724 , Y10T29/49208
摘要： An electrical connector includes a plurality of terminals and an insulating housing loading terminals and defining a pair of mounting portions. Each of mounting portions has a screw hole extending along an upper to lower direction in which the electrical connector is mounted. The hole is divided into at least a first segment and a second segment below the first segment. The first segment and the second segment are tapped with a plurality of threads thereinside and open in opposite directions along a front and rear direction respectively.
摘要翻译：电连接器包括多个端子和绝缘壳体装载端子并限定一对安装部分。每个安装部分具有沿安装电连接器的上下方向延伸的螺孔。孔被分成至少第一段和第一段下面的第二段。第一段和第二段分别与其内部的多个螺纹分接，并沿着前后方向在相反的方向上打开。

9. 发明授权

US08251132B2 Heat sink assembly and method for manufacturing the same 有权
标题翻译：散热器组件及其制造方法
公开(公告)号：US08251132B2
公开(公告)日：2012-08-28
申请号：US12056298
申请日：2008-03-27
申请人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F1/32 , F28D15/02
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

10. 发明授权

US08240185B2 Method for manufacturing cover of electronic device and cover obtained thereby 失效
标题翻译：制造电子装置盖的方法和由此得到的盖
公开(公告)号：US08240185B2
公开(公告)日：2012-08-14
申请号：US12495685
申请日：2009-06-30
申请人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
发明人： Feng Jin , Gen-Ping Deng , Chun-Chi Chen
IPC分类号： B21D41/00 , B23D23/00
CPC分类号： B21D19/08 , Y10T29/49828
摘要： A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.
摘要翻译：一种用于制造电子设备的盖的方法，包括提供金属绿色部件的步骤，所述金属生片包括顶板，底板和互连顶板和底板侧的连接板; 提供型材成型插入件和下模具，所述型材成形插入件形成成形表面，所述下模具限定用于接收所述生坯件的端部的空腔; 将型材成型插入件放入绿色件中，成型模制插入件的成形表面朝着绿色件的端部定向; 将生坯件的端部插入下模具的腔体中并冲压下模具，使得在成型件的端部处的顶板和底板沿着型材成型件的成形表面彼此朝向彼此弯曲。

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