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1. 发明授权

US09887106B2 Ejection inspection apparatus and substrate processing apparatus 有权
公开(公告)号：US09887106B2
公开(公告)日：2018-02-06
申请号：US14207232
申请日：2014-03-12
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Itaru Furukawa , Hiroshi Sano
IPC分类号： H01L21/67 , G06T7/00 , G06T7/194
CPC分类号： H01L21/67023 , G06T7/0004 , G06T7/194 , G06T2207/10016 , G06T2207/30148 , H01L21/67051 , H01L21/67253
摘要： An ejection inspection part of a substrate processing apparatus includes a light emitting part and an imaging part. The light emitting part emits light along a predetermined light existing plane to irradiate a processing liquid ejected from outlets of an ejection head with the light. The imaging part captures an image of the processing liquid passing through planar light emitted from the light emitting part to acquire an inspection image including bright dots. In the ejection inspection part, a determination frame setting part sets normal ejection determination frames corresponding to the outlets in the inspection image. The determination part acquires existence information indicating whether or not a bright dot exists in each normal ejection determination frame and uses the existence information to determine the quality of the ejection operation of the outlet corresponding to the normal ejection determination frame. It is thus possible to individually and accurately determine the quality of the ejection operations of the outlets.

2. 发明授权

US09649660B2 Substrate treatment method and substrate treatment apparatus 有权
公开(公告)号：US09649660B2
公开(公告)日：2017-05-16
申请号：US14039710
申请日：2013-09-27
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Tatsuya Fujii
IPC分类号： B08B7/04 , B08B7/00 , B05D3/00 , B05C5/00 , B05D1/00 , H01L21/67
CPC分类号： B05D3/002 , B05C5/00 , B05D1/005 , B08B7/00 , B08B7/04 , H01L21/67028
摘要： A substrate treatment method includes a rinsing step of supplying a rinse liquid to a front surface of a substrate while rotating the substrate at a first rotation speed, a liquid mixture film forming step of forming a liquid film of a liquid mixture of water and an organic solvent having a smaller surface tension than the water on the front surface after the rinsing step by supplying the water and the organic solvent to the front surface while reducing the rotation speed of the substrate from the first rotation speed to a second rotation speed lower than the first rotation speed, and an organic solvent replacing step of replacing the liquid mixture supplied to the front surface with the organic solvent after the liquid mixture film forming step by supplying the organic solvent to the front surface.

3. 发明授权

US09600874B2 Method for evaluating culture quality 有权
公开(公告)号：US09600874B2
公开(公告)日：2017-03-21
申请号：US14275949
申请日：2014-05-13
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Hiroki Fujimoto , Sanzo Moriwaki
IPC分类号： G06K9/00 , G06T7/00 , G06K9/03
CPC分类号： G06T7/0012 , G06K9/00134 , G06K9/03 , G06T2207/10056 , G06T2207/20021 , G06T2207/30024
摘要： A culture quality evaluation method comprises: a first step of culturing a pluripotent stem cell under a predetermined culture condition and creating a sample; a second step of imaging a proliferated cell colony in the sample and accordingly capturing an original image; a third step of dividing the original image into smaller images of a predetermined size and calculating standard deviations of pixel values of pixels of the smaller images; and a fourth step of judging whether the sample is an acceptable sample based upon a ratio of a number of the smaller images whose values of the standard deviations are within a predetermined range to a total number of the smaller images.

4. 发明授权

US09493000B2 Liquid ejecting device, head unit, and liquid ejecting method 有权
标题翻译：液体喷射装置，头部单元和液体喷射方法
公开(公告)号：US09493000B2
公开(公告)日：2016-11-15
申请号：US14498764
申请日：2014-09-26
申请人： Seiko Epson Corporation , DAINIPPON SCREEN MFG. CO., LTD.
发明人： Toshiyuki Yamagata , Toshiki Usui , Naoki Yonekubo , Kiyoomi Mitsuki
IPC分类号： B41J2/045
CPC分类号： B41J2/04588 , B41J2/04573 , B41J2/04581
摘要： A liquid ejecting device includes: a piezoelectric element that is deformed by applying at least one drive waveform among a plurality of drive waveforms to the piezoelectric element, the plurality of drive waveforms including a first drive waveform and a second drive waveform; a cavity that is filled with a liquid and is increased or decreased in internal pressure due to deformation of the piezoelectric element; a nozzle that communicates with the cavity, and ejects the liquid as a liquid droplet; and a selection section that selects at least one drive waveform from the plurality of drive waveforms, the liquid droplet including a first liquid droplet ejected when the first drive waveform has been selected, and a second liquid droplet ejected when the second drive waveform has been selected, an ejection volume of the first liquid droplet being almost equal to an ejection volume of the second liquid droplet.
摘要翻译：一种液体喷射装置，包括：压电元件，其通过在多个驱动波形中施加至少一个驱动波形而变形，所述多个驱动波形包括第一驱动波形和第二驱动波形; 填充有液体的空腔并且由于压电元件的变形而在内部压力中增加或减少; 喷嘴，与所述空腔连通，并将液体喷射成液滴; 以及选择部，其从所述多个驱动波形中选择至少一个驱动波形，所述液滴包括当选择了所述第一驱动波形时喷射的第一液滴，以及当选择所述第二驱动波形时喷射的第二液滴第一液滴的喷射量几乎等于第二液滴的喷射体积。

5. 发明授权

US09466513B2 Treatment liquid supply apparatus and substrate treatment apparatus including the same 有权
标题翻译：处理液供给装置及包括其的基板处理装置
公开(公告)号：US09466513B2
公开(公告)日：2016-10-11
申请号：US14483556
申请日：2014-09-11
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Hiroshi Yoshida
IPC分类号： H01L21/67 , B08B3/00 , B08B3/02 , B08B3/14
CPC分类号： H01L21/67051 , B08B3/00 , B08B3/02 , B08B3/14 , H01L21/67017 , H01L21/67248
摘要： A treatment liquid supply apparatus supplies a treatment liquid to a predetermined object for treatment of a substrate, and recovers the supplied treatment liquid for reuse. The apparatus includes: a first tank in which the treatment liquid to be supplied to the object is stored; a second tank in which the treatment liquid recovered from the object is stored; a transfer unit which transfers the treatment liquid from the second tank to the first tank; a first temperature regulating unit which regulates the temperature of the treatment liquid to be supplied from the first tank to the object; and a second temperature regulating unit which regulates the temperature of the treatment liquid to be transferred from the second tank to the first tank by the transfer unit.
摘要翻译：处理液供给装置向处理基板的规定对象供给处理液，回收供给的处理液再利用。该装置包括：第一罐，其中存储供给到物体的处理液体; 存储从物体回收的处理液的第二罐; 转移单元，其将处理液体从第二罐转移到第一罐; 第一温度调节单元，其调节从第一罐供给到物体的处理液的温度; 以及第二温度调节单元，其通过所述传送单元来调节要从所述第二箱转移到所述第一箱的处理液的温度。

6. 发明授权

US09436087B2 Substrate processing apparatus with a cleaning processing section for cleaning a chemical liquid processing section 有权
标题翻译：具有清洗处理部的基板处理装置，用于清洗药液处理部
公开(公告)号：US09436087B2
公开(公告)日：2016-09-06
申请号：US14322982
申请日：2014-07-03
申请人： DAINIPPON SCREEN MFG. CO., LTD. , SOKUDO CO., LTD.
发明人： Kazuo Morioka , Masanori Imamura , Satoshi Yamamoto , Hideki Shimizu
IPC分类号： B08B3/08 , B08B3/04 , B05B15/00 , H01L21/67 , B05C11/10 , G03F7/16 , B05B15/02 , B08B9/02 , G03F7/42
CPC分类号： G03F7/16 , B05B15/55 , B08B3/04 , B08B3/08 , B08B9/02 , G03F7/42 , H01L21/67017 , H01L21/6715 , H01L21/67253
摘要： Each chemical processing section includes a chemical liquid bottle, a buffer tank, a pump, a filter, a discharge valve and a discharge nozzle. A chemical liquid stored in the chemical liquid bottle is led to the discharge nozzle and is discharged from the discharge nozzle to a substrate. A cleaning processing section includes a solvent bottle, a cleaning liquid bottle, the buffer tank and the pump. A solvent stored in the solvent bottle, a cleaning liquid stored in the cleaning liquid bottle and a gas supplied from a gas supply source are selectively led to the discharge nozzle in each chemical liquid processing section.
摘要翻译：每个化学处理部分包括化学液体瓶，缓冲罐，泵，过滤器，排放阀和排出喷嘴。存储在药液瓶中的化学液体被引导到排出喷嘴，并从排出喷嘴排出到基板。清洗处理部包括溶剂瓶，清洗液瓶，缓冲罐和泵。存储在溶剂瓶中的溶剂，存储在清洗液体瓶中的清洗液和从气体供给源供给的气体被选择性地引导到每个化学液体处理部中的排出喷嘴。

7. 发明授权

US09390904B2 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US09390904B2
公开(公告)日：2016-07-12
申请号：US13957869
申请日：2013-08-02
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Toshimitsu Namba
IPC分类号： H01L21/02 , H01L21/687 , H01L21/67
摘要： A substrate processing apparatus includes a substrate holding part, a substrate rotating mechanism, and a chamber. The substrate rotating mechanism incudes an annular rotor part disposed in an internal space of the chamber and a stator part disposed around the rotor part outside the chamber. The substrate holding part is attached to the rotor part in the internal space of the chamber. In the substrate rotating mechanism, a rotating force is generated about a central axis between the stator part and the rotor part. The rotor part is thereby rotated about the central axis, being in a floating state, together with a substrate and the substrate holding part. In the substrate processing apparatus, the substrate can be easily rotated in the internal space having excellent sealability. As a result, it is possible to easily perform single-substrate processing in a sealed internal space.

8. 发明授权

US09389601B2 Substrate processing apparatus, substrate processing system, control method for substrate processing apparatus and storage medium 有权
标题翻译：基板处理装置，基板处理系统，基板处理装置的控制方法和存储介质
公开(公告)号：US09389601B2
公开(公告)日：2016-07-12
申请号：US14061495
申请日：2013-10-23
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Yasunori Nakamura , Nobuhiko Nakagawa , Naohiko Kawashima
IPC分类号： G06F17/00 , G05B15/02
CPC分类号： G05B15/02 , G05B19/41865 , G05B2219/32021 , G05B2219/34306 , G05B2219/45031 , Y02P70/161 , Y02P70/163 , Y02P70/605 , Y02P80/114 , Y02P90/02 , Y02P90/20 , Y02P90/205
摘要： A substrate processing apparatus includes a plurality of functional sections 200, 300, 400 and 500 each of which is selectively set in an operating state where an assigned processing thereof is executable on a substrate and a standby state where an energy consumption amount is less than in the operating state, and an apparatus controller 50 which controls a state of each functional section 200, 300, 400, 500 between the operating state and the standby state and causes the functional section in charge of the assigned processing corresponding to a recipe to be set in the operating state and perform the assigned processing in executing the recipe specifying a processing procedure on the substrate. If an execution planned recipe, which is the recipe planned to be executed later, is given, the apparatus controller 50 specifies the functional section capable of being in charge of the assigned processing corresponding to the execution planned recipe out of the plurality of functional sections 200, 300, 400 and 500 and obtains a resource consumption amount necessary to recover the specified functional section specified by the specifying operation to the operating state.
摘要翻译：衬底处理装置包括多个功能部件200,300,400和500，每个功能部件200,300,400和500被选择性地设置在其中在基板上执行分配处理的操作状态和能量消耗量小于操作状态，以及控制操作状态和待机状态之间的各功能部200,300,400,500的状态的装置控制器50，并且使负责与配方对应的分配处理的功能部设定在操作状态下执行分配处理，执行在基板上指定处理步骤的配方。如果给出计划稍后执行的配方的执行计划配方，则设备控制器50指定能够负责与多个功能部件200中的执行计划配方相对应的分配处理的功能部件，300,400和500，并且获得将通过指定操作指定的指定功能部分恢复到操作状态所需的资源消耗量。

9. 发明授权

US09340761B2 Substrate processing method and substrate processing apparatus 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US09340761B2
公开(公告)日：2016-05-17
申请号：US14475069
申请日：2014-09-02
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Sei Negoro , Ryo Muramoto , Yasuhiko Nagai , Tsutomu Osuka , Keiji Iwata
IPC分类号： B44C1/22 , C23F1/00 , C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461 , C11D11/00 , H01L21/67 , C11D3/00
CPC分类号： B08B3/08 , B08B3/02 , B08B3/10 , C11D3/0052 , C11D11/0047 , C11D11/0064 , C11D11/007 , H01L21/67028 , H01L21/67051
摘要： A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off a liquid remaining on the substrate, and a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate.
摘要翻译：基板处理方法包括：向基板的上表面供给具有高温的SPM的SPM供给工序; DIW供给工序，在SPM供给工序后，将具有室温的DIW供给到所述基板的上表面，进行冲洗剩余在基板上的液体，以及过氧化氢水供给步骤，在SPM供给工序后和DIW供给工序之前，供给液温低于SPM的温度以上且不低于室温的过氧化氢水，在SPM保持在基板上的状态下到基板的上表面。

10. 发明授权

US09318365B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US09318365B2
公开(公告)日：2016-04-19
申请号：US14150910
申请日：2014-01-09
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Takahiro Yamaguchi
IPC分类号： B05C5/02 , H01L21/687 , H01L21/67 , G03F7/30 , G03F7/16
CPC分类号： H01L21/68728 , B05C5/02 , G03F7/162 , G03F7/3021 , H01L21/67051 , H01L21/6715
摘要： A substrate processing apparatus for processing a substrate comprises: a plurality of chuck pins each having an accommodating groove for accommodating a portion of peripheral part of the substrate, holding the substrate at a hold position in a horizontal posture by pressing inner faces of the accommodating grooves toward portions of peripheral part of the substrate; and a plurality of guide members, being disposed on or above the respective plurality of chuck pins, guiding process liquid discharged from the substrate to a surrounding area of the substrate; wherein each of the plurality of guide member includes: an inner-edge guide disposed at a position inward and above the accommodating groove; and an outer-edge guide disposed at a position level with or below the inner-edge guide and outward the chuck pin.
摘要翻译：一种用于处理基板的基板处理装置，包括：多个卡盘销，每个卡盘销具有用于容纳基板的周边部分的一部分的容纳槽，通过按压容纳槽的内表面将基板保持在水平姿势的保持位置朝向基板的周边部分的部分; 以及多个引导构件，设置在所述多个卡盘销上或上方，将从所述基板排出的处理液引导到所述基板的周围区域; 其中，所述多个引导构件中的每一个包括：内边缘引导件，设置在所述容纳槽的内部和上方的位置; 以及外缘引导件，其设置在与所述内缘引导件的内侧或下方的位置处，并且位于所述卡盘销的外侧。

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