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1. 发明申请

US20210249391A1 OPTICAL COUPLING DEVICE AND HIGH FREQUENCY DEVICE 有权
公开(公告)号：US20210249391A1
公开(公告)日：2021-08-12
申请号：US17014382
申请日：2020-09-08
申请人： Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
发明人： Mami Fujihara , Naoya Takai , Kazuki Tanaka , Takenori Yasuzumi , Yoshio Noguchi , Tsuyoshi Tokiwa
IPC分类号： H01L25/16 , H01L23/00 , H01L31/02 , H01L33/62
摘要： An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

2. 发明申请

US20150303180A1 PHOTOCOUPLER 审中-公开
公开(公告)号：US20150303180A1
公开(公告)日：2015-10-22
申请号：US14755581
申请日：2015-06-30
申请人： Kabushiki Kaisha Toshiba
发明人： Yoshio Noguchi , Mami Yamamoto , Naoya Takai
IPC分类号： H01L25/16 , H01L31/02 , H01L31/16
CPC分类号： H01L25/167 , H01L31/02002 , H01L31/14 , H01L31/162 , H01L31/167 , H01L2224/48247 , H01L2924/00 , H01L2924/13091
摘要： A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.

3. 发明授权

US11462525B2 Optical coupling device and high frequency device 有权
公开(公告)号：US11462525B2
公开(公告)日：2022-10-04
申请号：US17014382
申请日：2020-09-08
申请人： Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
发明人： Mami Fujihara , Naoya Takai , Kazuki Tanaka , Takenori Yasuzumi , Yoshio Noguchi , Tsuyoshi Tokiwa
IPC分类号： H01L27/15 , H01L29/161 , H01L31/12 , H01L33/00 , H01L31/153 , H01L25/16 , H01L23/00 , H01L33/62 , H01L31/02
摘要： An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

4. 发明授权

US09171969B2 Mounting member having die pad unit and terminals, and photocoupler having the mounting member 有权
标题翻译：具有管芯焊盘单元和端子的安装构件和具有安装构件的光电耦合器
公开(公告)号：US09171969B2
公开(公告)日：2015-10-27
申请号：US14162145
申请日：2014-01-23
申请人： Kabushiki Kaisha Toshiba
发明人： Mami Yamamoto , Yoshio Noguchi
IPC分类号： H01L27/15 , H01L29/16 , H01L31/12 , H01L33/00 , H01L23/48 , H01L23/52 , H01L29/40 , G02B27/00 , G02B6/26 , G02B6/42 , H01L31/02 , H01L31/173
CPC分类号： H01L31/173 , H01L23/49575 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/167 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
摘要翻译：安装构件包括：绝缘基板，第一管芯焊盘单元，第一端子和第二端子。绝缘基板具有矩形的第一表面，第二表面，第一侧表面，第二侧表面，第三侧表面和第四侧表面。从第一表面到第二表面设置有通孔。第一管芯焊盘单元设置在第一表面上。第一端子具有覆盖第一侧表面，第一表面和第二表面的导电区域。第二端子具有覆盖第二侧表面和第二表面的导电区域，其通过设置在通孔中或通孔侧壁上的导电材料连接到第一管芯焊盘单元。第一管芯焊盘单元，第一端子和第二端子彼此分开。

5. 发明申请

US20150069423A1 MOUNTING MEMBER AND PHOTOCOUPLER 有权
标题翻译：安装会员和照片
公开(公告)号：US20150069423A1
公开(公告)日：2015-03-12
申请号：US14162145
申请日：2014-01-23
申请人： Kabushiki Kaisha Toshiba
发明人： Mami Yamamoto , Yoshio Noguchi
IPC分类号： H01L31/02 , H01L31/173
CPC分类号： H01L31/173 , H01L23/49575 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/167 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
摘要翻译：安装构件包括：绝缘基板，第一管芯焊盘单元，第一端子和第二端子。绝缘基板具有矩形的第一表面，第二表面，第一侧表面，第二侧表面，第三侧表面和第四侧表面。从第一表面到第二表面设置有通孔。第一管芯焊盘单元设置在第一表面上。第一端子具有覆盖第一侧表面，第一表面和第二表面的导电区域。第二端子具有覆盖第二侧表面和第二表面的导电区域，其通过设置在通孔中或通孔侧壁上的导电材料连接到第一管芯焊盘单元。第一管芯焊盘单元，第一端子和第二端子彼此分开。

6. 发明申请

US20200161494A1 PHOTOCOUPLER 审中-公开
公开(公告)号：US20200161494A1
公开(公告)日：2020-05-21
申请号：US16562585
申请日：2019-09-06
申请人： Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
发明人： Mami Fujihara , Yoshio Noguchi , Naoya Takai
IPC分类号： H01L31/167 , H01L31/02 , H01L23/31 , H01L23/00 , H01L25/16 , H01L23/495
摘要： A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

7. 发明授权

US09722127B2 Photocoupler having light receiving element, light emitting element and MOSFET on a die pad unit of a mounting member that includes terminals with multiplied conductive regions 有权
公开(公告)号：US09722127B2
公开(公告)日：2017-08-01
申请号：US15165218
申请日：2016-05-26
申请人： Kabushiki Kaisha Toshiba
发明人： Mami Yamamoto , Yoshio Noguchi
IPC分类号： H01L31/173 , H01L31/02 , H01L23/495 , H01L31/167 , H01L25/16 , H01L31/0203
CPC分类号： H01L31/173 , H01L23/49575 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/167 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.

8. 发明申请

US20160268241A1 SEMICONDUCTOR DEVICE HAVING A MOUNTING MEMBER THAT INCLUDES A DIE PAD UNIT AND TERMINALS WITH MULTIPLE CONDUCTIVE REGIONS 审中-公开
标题翻译：具有安装构件的安装构件的半导体装置，包括具有多个导电区域的模板单元和终端
公开(公告)号：US20160268241A1
公开(公告)日：2016-09-15
申请号：US15165218
申请日：2016-05-26
申请人： Kabushiki Kaisha Toshiba
发明人： Mami Yamamoto , Yoshio Noguchi
IPC分类号： H01L25/16 , H01L31/02 , H01L31/0203 , H01L31/167
CPC分类号： H01L31/173 , H01L23/49575 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/167 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
摘要翻译：安装构件包括：绝缘基板，第一管芯焊盘单元，第一端子和第二端子。绝缘基板具有矩形的第一表面，第二表面，第一侧表面，第二侧表面，第三侧表面和第四侧表面。从第一表面到第二表面设置有通孔。第一管芯焊盘单元设置在第一表面上。第一端子具有覆盖第一侧表面，第一表面和第二表面的导电区域。第二端子具有覆盖第二侧表面和第二表面的导电区域，其通过设置在通孔中或通孔侧壁上的导电材料连接到第一管芯焊盘单元。第一管芯焊盘单元，第一端子和第二端子彼此分开。

9. 发明申请

US20160013353A1 MOUNTING MEMBER HAVING DIE PAD UNIT AND TERMINALS, AND PHOTOCOUPLER HAVING THE MOUNTING MEMBER 审中-公开
标题翻译：带安装件和端子的安装构件，以及具有安装构件的光电隔离器
公开(公告)号：US20160013353A1
公开(公告)日：2016-01-14
申请号：US14860486
申请日：2015-09-21
申请人： Kabushiki Kaisha Toshiba
发明人： Mami Yamamoto , Yoshio Noguchi
IPC分类号： H01L31/167 , H01L23/495
CPC分类号： H01L31/173 , H01L23/49575 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/167 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/00012
摘要： A mounting member includes: an insulating substrate, a first die pad unit, first and second terminals. The insulating substrate has a rectangular first surface, a second surface, a first side surface, a second side surface, a third side surface, and a fourth side surface. A through hole is provided from the first surface to the second surface. The first die pad unit is provided on the first surface. The first terminal has a conductive region covering the first side surface, the first surface, and the second surface. The second terminal has a conductive region covering the second side surface and the second surface, connected to the first die pad unit by conductive material provided in the through hole or on a side wall of the through hole. The first die pad unit, the first terminal, and the second terminal are apart from one another.
摘要翻译：安装构件包括：绝缘基板，第一管芯焊盘单元，第一端子和第二端子。绝缘基板具有矩形的第一表面，第二表面，第一侧表面，第二侧表面，第三侧表面和第四侧表面。从第一表面到第二表面设置有通孔。第一管芯焊盘单元设置在第一表面上。第一端子具有覆盖第一侧表面，第一表面和第二表面的导电区域。第二端子具有覆盖第二侧表面和第二表面的导电区域，其通过设置在通孔中或通孔侧壁上的导电材料连接到第一管芯焊盘单元。第一管芯焊盘单元，第一端子和第二端子彼此分开。

10. 发明授权

US09099602B2 Photocoupler 有权
标题翻译：光电耦合器
公开(公告)号：US09099602B2
公开(公告)日：2015-08-04
申请号：US14161872
申请日：2014-01-23
申请人： Kabushiki Kaisha Toshiba
发明人： Yoshio Noguchi , Mami Yamamoto , Naoya Takai
IPC分类号： H01L31/16 , H01L31/14 , H01L25/16
CPC分类号： H01L25/167 , H01L31/02002 , H01L31/14 , H01L31/162 , H01L31/167 , H01L2224/48247 , H01L2924/00 , H01L2924/13091
摘要： A photocoupler includes: a support substrate; a MOSFET; a light receiving element; a light emitting element; and a bonding layer. The support substrate includes an insulating layer, input and output terminals. The MOSFET is bonded to the support substrate. The MOSFET has a first surface having an operation region. The light receiving element includes p-n junction and is bonded to the MOSFET. The light receiving element has first and second surfaces. The first surface includes a light reception region, a first electrode, and a second electrode. The light emitting element is connected to the input terminal. The light emitting element has first and second surfaces. The first surface includes first and second electrodes. The second surface has a light emitting region. The bonding layer is configured to bond the light emitting element to the light reception region.
摘要翻译：光电耦合器包括：支撑衬底; 一个MOSFET; 光接收元件; 发光元件; 和粘结层。支撑基板包括绝缘层，输入和输出端子。 MOSFET结合到支撑衬底。 MOSFET具有具有操作区域的第一表面。光接收元件包括p-n结并且结合到MOSFET。光接收元件具有第一和第二表面。第一表面包括光接收区域，第一电极和第二电极。发光元件连接到输入端子。发光元件具有第一和第二表面。第一表面包括第一和第二电极。第二表面具有发光区域。接合层被配置为将发光元件结合到光接收区域。

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