会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Methods for controlling microloading variation in semiconductor wafer layout and fabrication
    • 用于控制半导体晶片布局和制造中的微加载变化的方法
    • US09122832B2
    • 2015-09-01
    • US12512932
    • 2009-07-30
    • Brian ReedMichael C. SmaylingScott T. Becker
    • Brian ReedMichael C. SmaylingScott T. Becker
    • G06F17/50
    • G06F17/5081G06F2217/12Y02P90/265
    • Problematic open areas are identified in a semiconductor wafer layout. The problematic open areas have a size variation relative to one or more neighboring open areas of the layout sufficient to cause adverse microloading variation. In one embodiment, the adverse microloading variation is controlled by shifting a number of layout features to interdict the problematic open areas. In another embodiment, the adverse microloading variation is controlled by defining and placing a number of dummy layout features to shield actual layout features that neighbor the problematic open areas. In another embodiment, the adverse microloading variation is controlled by utilizing sacrificial layout features which are actually fabricated on the wafer temporarily to eliminate microloading variation, and which are subsequently removed from the wafer to leave behind the desired permanent structures.
    • 在半导体晶片布局中识别有问题的开放区域。 有问题的开放区域相对于布局的一个或多个相邻开放区域具有尺寸变化,足以导致不利的微加载变化。 在一个实施例中,通过移动多个布局特征来阻止有问题的开放区域来控制不利的微加载变化。 在另一个实施例中,通过限定和放置多个虚拟布局特征来屏蔽相邻有问题的开放区域的实际布局特征来控制不利的微加载变化。 在另一个实施例中,通过利用实际上在晶片上制造的牺牲布局特征来暂时控制不利的微加载变化,以消除微载荷变化,并且随后从晶片中移除留下期望的永久结构。