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1. 发明授权

US09832911B2 Air handling unit and method of operating the same 有权
公开(公告)号：US09832911B2
公开(公告)日：2017-11-28
申请号：US14878307
申请日：2015-10-08
申请人： Airedale International Air Conditioning Ltd.
发明人： Patrick Cotton , David Wilks , Michael Parker , Steven Charlton
IPC分类号： F25B29/00 , F24H3/02 , F24F11/04 , H05K5/00 , F24F7/00 , F24F13/00 , F25D17/08 , H05K7/20 , F24F5/00 , F24F12/00 , F24F13/02 , F24F13/08 , F24F11/00
CPC分类号： H05K7/20745 , F24F5/0007 , F24F5/0035 , F24F12/001 , F24F12/006 , F24F13/02 , F24F13/08 , F24F2011/0002 , H05K7/20836 , Y02B30/542 , Y02B30/563
摘要： An air handling unit, particularly for data center cooling, operates to cool a flow of return air from a conditioned space using a flow of ambient air. The return air is recirculated to the conditioned space as supply air. The flow of ambient air can be adiabatically cooled to a lower temperature to provide additional cooling. A flow of makeup air can be joined with the cooled return air to form the supply air, and can be sourced from the ambient environment directly or from the heated flow of ambient air.

2. 发明授权

US10893633B2 Method of cooling an electronics cabinet 有权
公开(公告)号：US10893633B2
公开(公告)日：2021-01-12
申请号：US16662891
申请日：2019-10-24
申请人： Airedale International Air Conditioning Ltd.
发明人： David Samuel Wilks , Nino Veselinov Nenchev
IPC分类号： H05K7/20
摘要： A method of cooling an electronics cabinet includes inducing a flow of cooling air to enter into the electronics cabinet, passing the flow of cooling air over electronic modules arranged within the electronics cabinet to convectively transfer heat to the flow of cooling air from the electronic modules, and directing the flow of cooling air through a door heat exchanger at an end of the electronics cabinet to exhaust the flow of cooling air from the cabinet. A first coolant flow is directed through the door heat exchanger, and heat is transferred from the flow of cooling air to the first coolant flow as they pass through the door heat exchanger. A second coolant flow is circulated through a coolant loop that is arranged within the electronics cabinet, and passes though cold plates that are joined to at least some of the electronic modules to transfer heat from those modules to the second coolant flow. Heat from the second coolant flow is transferred to the first coolant flow in a coolant-to-coolant heat exchanger arranged within the electronics cabinet. Heat is subsequently rejected from the first coolant flow at a location remote from the electronics cabinet.

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