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1. 发明授权

US08466478B2 Light emitting device utilizing rod structure 有权
标题翻译：发光装置利用杆结构
公开(公告)号：US08466478B2
公开(公告)日：2013-06-18
申请号：US12876850
申请日：2010-09-07
申请人： Meng Hsin Li , Kuo Hui Yu , Tsung-Hung Lu , Ming-Ji Tsai , Chang Hsin Chu
发明人： Meng Hsin Li , Kuo Hui Yu , Tsung-Hung Lu , Ming-Ji Tsai , Chang Hsin Chu
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/42 , H01L2933/0016 , H01L2933/0091
摘要： In one aspect of the invention, a light emitting device includes an epi layer having multiple layers of semiconductors formed on a substrate, a first electrode and a second electrode having opposite polarities with each other, and electrically coupled to corresponding semiconductor layers, respectively, of the epi layer, and a rod structure formed on the epi layer. The rod structure includes a plurality of rods distanced from each other.
摘要翻译：在本发明的一个方面，一种发光器件包括：具有形成在衬底上的多层半导体的外延层，具有彼此极性的第一电极和第二电极，并分别电耦合到相应的半导体层外延层，以及形成在外延层上的棒状结构。杆结构包括彼此远离的多个杆。

2. 发明授权

US07939834B2 Light- emitting device 失效
标题翻译：发光装置
公开(公告)号：US07939834B2
公开(公告)日：2011-05-10
申请号：US12126482
申请日：2008-05-23
申请人： Shi-Ming Chen , Chang-Hsin Chu
发明人： Shi-Ming Chen , Chang-Hsin Chu
IPC分类号： H01L27/15
CPC分类号： H01L33/642 , H01L33/20
摘要： A light-emitting device includes a substrate having an epitaxial-forming surface and a back surface opposite to the epitaxial-forming surface, the substrate being formed with a recess indented from the back surface, the back surface having a recessed portion that defines the recess, and a planar portion extending outwardly from the recessed portion; an epitaxy layer; a continuous heat-dissipating layer formed on the planar portion and the recessed portion of the back surface of the substrate; and first and second electrodes coupled electrically to the epitaxy layer.
摘要翻译：发光器件包括具有外延形成表面和与外延形成表面相对的后表面的衬底，所述衬底形成有从后表面凹陷的凹部，所述后表面具有限定凹部的凹部和从凹部向外延伸的平面部分; 外延层; 形成在基板的背面的平面部和凹部的连续散热层; 以及与外延层电连接的第一和第二电极。

3. 发明授权

US08119427B1 Light emitting diode die-bonding with magnetic field 失效
标题翻译：发光二极管与磁场密封
公开(公告)号：US08119427B1
公开(公告)日：2012-02-21
申请号：US12985992
申请日：2011-01-06
申请人： Tsung-Hung Lu
发明人： Tsung-Hung Lu
IPC分类号： H01L21/00
CPC分类号： H01L33/44 , H01L24/95 , H01L33/52 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/92247 , H01L2924/181 , H01L2933/0033 , H01L2924/00014 , H01L2924/00012
摘要： In one aspect of the present invention, a method of LED die-bonding includes coating the back side of an LED chip with a magnetic material, placing the LED chip in a packaging cup such that the back side of the LED chip is in contact with the bottom of the packaging cup, applying a magnetic field in a region near the bottom of the packaging cup so as to exert a magnetic force on the LED chip via the magnetic material coated on the back side of the LED chip, thereby holding the LED chip in place against the bottom of the packaging cup, while the magnetic field is applied, bonding one end of a first conductive wire to an anode of the LED and the other end of the first conductive wire to a first electrode, and bonding one end of a second conductive wire to a cathode of the LED and the other end of the second conductive wire to a second electrode, where the first electrode and the second electrode are attached to the packaging cup, and filling the packaging cup with an epoxy, and curing the epoxy.
摘要翻译：在本发明的一个方面中，LED芯片接合的方法包括用磁性材料涂覆LED芯片的背面，将LED芯片放置在包装杯中，使得LED芯片的背面与包装杯的底部，在包装杯底部附近的区域施加磁场，以通过涂覆在LED芯片背面的磁性材料在LED芯片上施加磁力，从而保持LED 在施加磁场的同时将芯片置于适当位置，同时将第一导线的一端接合到LED的阳极，将第一导线的另一端接合到第一电极，并将一端的第二导线连接到LED的阴极并且第二导线的另一端连接到第二电极，其中第一电极和第二电极附接到包装杯，并且用环氧树脂填充包装杯，以及治愈 e环氧树脂。

4. 发明申请

US20120037946A1 LIGHT EMITTING DEVICES 审中-公开
标题翻译：发光装置
公开(公告)号：US20120037946A1
公开(公告)日：2012-02-16
申请号：US12855316
申请日：2010-08-12
申请人： Kuo Hui Yu , Chien-Chun Wang , Chang Hsin Chu
发明人： Kuo Hui Yu , Chien-Chun Wang , Chang Hsin Chu
IPC分类号： H01L33/02 , H01L33/36 , H01L33/00
CPC分类号： H01L33/38 , H01L33/20
摘要： In one aspect of the invention, a light emitting device includes a substrate, and a multilayered structure having an n-type semiconductor layer formed in a light emitting region and a non-emission region on the substrate, an active layer formed in the light emitting region on the n-type semiconductor layer, and a p-type semiconductor layer formed in the light emitting region on the active layer. The light emitting device also includes a p-electrode formed in the light emitting region and electrically coupled to the p-type semiconductor layer, and an n-electrode formed in the non-emission region and electrically coupled to the n-type semiconductor layer. Further, the light emitting device also includes an insulator formed between the n-electrode and the n-type semiconductor layer in the first portion of the non-emission region to define at least one ohmic contact such that the n-electrode in the first portion of the non-emission region is electrically coupled to the n-type semiconductor layer through the at least one ohmic contact.
摘要翻译：在本发明的一个方面中，一种发光器件包括衬底和在衬底上形成于发光区域和非发射区域中的n型半导体层的多层结构，形成在发光区域中的有源层 n型半导体层上的发光区域中形成的p型半导体层。发光器件还包括形成在发光区域中并电耦合到p型半导体层的p电极和形成在非发射区域中并电耦合到n型半导体层的n电极。此外，发光器件还包括形成在非发射区域的第一部分中的n电极和n型半导体层之间的绝缘体，以限定至少一个欧姆接触，使得第一部分中的n电极的非发射区域通过至少一个欧姆接触电耦合到n型半导体层。

5. 发明申请

US20110073894A1 LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：发光二极管及其制造方法
公开(公告)号：US20110073894A1
公开(公告)日：2011-03-31
申请号：US12955369
申请日：2010-11-29
申请人： Chang Hsin Chu , Chi Meng Lu , Yu Ju Chang , Kuo Hui Yu
发明人： Chang Hsin Chu , Chi Meng Lu , Yu Ju Chang , Kuo Hui Yu
IPC分类号： H01L33/10 , H01L33/58 , H01L33/44 , H01L33/00
CPC分类号： H01L33/22 , H01L33/42 , H01L33/44
摘要： In one aspect of the invention, an LED includes a substrate, an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent conductive layer sequentially stacked on the substrate, and p-type and n-type electrodes. The p-type semiconductor layer has a rough surface region and at least one flat surface region. The transparent conductive layer has a rough surface region and a flat surface region corresponding to the rough surface region and the at least one flat surface region of the p-type semiconductor layer, respectively. The p-type electrode is disposed on the flat surface region of the transparent conductive layer. The n-type electrode is electrically couple to the n-type semiconductor layer.
摘要翻译：在本发明的一个方面中，LED包括基板，n型半导体层，发光层，p型半导体层和顺序堆叠在基板上的透明导电层，p型和n型电极。 p型半导体层具有粗糙的表面区域和至少一个平坦表面区域。透明导电层具有分别对应于p型半导体层的粗糙表面区域和至少一个平坦表面区域的粗糙表面区域和平坦表面区域。 p型电极设置在透明导电层的平坦表面区域上。 n型电极电耦合到n型半导体层。

6. 发明申请

US20120056152A1 LIGHT EMITTING DEVICES 有权
标题翻译：发光装置
公开(公告)号：US20120056152A1
公开(公告)日：2012-03-08
申请号：US12876850
申请日：2010-09-07
申请人： Meng Hsin Li , Kuo Hui Yu , Tsung-Hung Lu , Ming-Ji Tsai , Chang Hsin Chu
发明人： Meng Hsin Li , Kuo Hui Yu , Tsung-Hung Lu , Ming-Ji Tsai , Chang Hsin Chu
IPC分类号： H01L33/04 , H01L33/46 , H01L33/36
CPC分类号： H01L33/38 , H01L33/42 , H01L2933/0016 , H01L2933/0091
摘要： In one aspect of the invention, a light emitting device includes an epi layer having multiple layers of semiconductors formed on a substrate, a first electrode and a second electrode having opposite polarities with each other, and electrically coupled to corresponding semiconductor layers, respectively, of the epi layer, and a rod structure formed on the epi layer. The rod structure includes a plurality of rods distanced from each other.
摘要翻译：在本发明的一个方面，一种发光器件包括：具有形成在衬底上的多层半导体的外延层，具有彼此极性的第一电极和第二电极，并分别电耦合到相应的半导体层外延层，以及形成在外延层上的棒状结构。杆结构包括彼此远离的多个杆。

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