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1. 发明授权

US10397676B2 Speaker module 有权
公开(公告)号：US10397676B2
公开(公告)日：2019-08-27
申请号：US15542866
申请日：2015-11-18
申请人： Goertek.Inc
发明人： Minghui Shao , Jianbin Yang
IPC分类号： H04R1/02 , H04R7/12 , H04R7/18 , H04R9/02 , H04R9/06 , H04R31/00 , B29C45/00 , B29K105/16 , B29L31/34
摘要： The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.

2. 发明授权

US10273150B2 Integrated structure of MEMS microphone and pressure sensor and manufacturing method for the integrated structure 有权
公开(公告)号：US10273150B2
公开(公告)日：2019-04-30
申请号：US15554653
申请日：2015-12-14
申请人： Goertek.Inc
发明人： Yanmei Sun
IPC分类号： H04R31/00 , G01L7/08 , B81B7/02 , H04R19/04 , B81C1/00 , H04R19/00
摘要： The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a sacrificial layer and a second polycrystalline silicon layer in sequence on a shared substrate; etching the second polycrystalline silicon layer to form a vibrating diaphragm and an upper electrode; eroding the sacrificial layer to form a containing cavity of a microphone and a pressure sensor, and etching the sacrificial layer between the microphone and the pressure sensor; etching the first polycrystalline silicon layer to form a back electrode of the microphone and a lower electrode of the pressure sensor; etching a position of the shared substrate below a back electrode of the microphone to form a back cavity; and etching away the region of the insulating layer below the back electrode. A capacitance structure of a MEMS microphone and that of a pressure sensor are integrated on a shared substrate, improving integration of a MEMS microphone and a pressure sensor, and greatly reducing a size of a whole packaging structure; in addition, a microphone and a pressure sensor can be simultaneously manufactured on a shared substrate to improve the efficiency of production.

3. 发明授权

US10063208B2 Speaker device and method for reducing distortion degree of speaker 有权
公开(公告)号：US10063208B2
公开(公告)日：2018-08-28
申请号：US15551244
申请日：2015-11-16
申请人： Goertek.Inc
发明人： Dan Han , Yun Yang
IPC分类号： H03G11/04 , H04R3/00 , H04R9/06 , H04R29/00
CPC分类号： H03G11/04 , H04R3/00 , H04R3/08 , H04R9/041 , H04R9/06 , H04R29/001 , H04R29/003 , H04R2499/11
摘要： The present invention discloses a speaker device and electronic equipment. The speaker device comprises a speaker body, an audio signal input terminal connected with the speaker body, and a DC voltage signal input terminal connected with the speaker body. The electronic equipment comprises the speaker device and a DC voltage signal output circuit. The present invention further discloses a method for reducing a low frequency distortion degree of the speaker of the electronic equipment, and the method is realized by additionally providing a DC voltage signal to the input end of the speaker. In the present invention, a distortion degree of the speaker device at a low-frequency working condition can be reduced, and inconsistency of low frequency distortion of the speaker device, caused by mass production, can be reduced.

4. 发明授权

US10407300B2 Integrated structure of mems pressure sensor and mems inertia sensor 有权
公开(公告)号：US10407300B2
公开(公告)日：2019-09-10
申请号：US15554652
申请日：2015-12-14
申请人： Goertek.Inc
发明人： Guoguang Zheng
IPC分类号： B81B7/02 , G01L9/12 , G01P15/125 , G01P15/02 , B81B3/00 , B81B7/00 , B81C1/00 , G01L19/04
摘要： An integrated structure of an MEMS pressure sensor and an MEMS inertia sensor are provided, comprising: an insulating layer formed on a substrate, a first lower electrode and a second lower electrode both formed on the insulating layer, further comprising a first upper electrode forming an air pressure-sensitive capacitor together with the first lower electrode, and a second upper electrode forming a reference capacitor together with the second lower electrode; further comprising an inertia-sensitive structure supported above the substrate by a third support part, and a fixed electrode plate forming an inertia detecting capacitor of an inertia sensor together with the inertia-sensitive structure; and a cover body which packages the inertia detecting capacitor composed of the inertia-sensitive structure and the fixed electrode plate on the substrate.

5. 发明授权

US10277985B2 Speaker module 有权
公开(公告)号：US10277985B2
公开(公告)日：2019-04-30
申请号：US15542858
申请日：2015-11-18
申请人： Goertek.Inc
发明人： Zhibing Zhang , Gang Chen
IPC分类号： H04R9/06 , H04R1/02 , H04R7/12 , H04R9/02 , H04R31/00 , H04R9/04
摘要： The present invention discloses a speaker module. The speaker module comprises an inner cavity defined by a shell, and a first induction coil. A single speaker piece is provided in the inner cavity of the shell, the first induction coil is configured to be electrically connected with a terminal device, and a second induction coil, which corresponds to the first induction coil and is configured to be electrically connected with a voice coil in the single speaker piece, is also provided on the shell. According to the speaker module, an output end of a complete machine and the voice coil are conducted through the first induction coil and the second induction coil; and by the adoption of such a structure, the space of the module can be greatly saved, and a lighter and thinner complete machine can be developed. In addition, the problems, such as poor performance due to the change of the resistance value in a traditional electro-acoustic connection way, can be solved. By the adoption of the structure, the first induction coil is allowed to be provided outside the inner cavity, the shell can be sealed at a time, wiring from the outside to the inside is not needed any more. In this way, secondary sealing of a lead position is avoided, production and transportation of the speaker module are greatly simplified, and assembly between the speaker module and the terminal device is also greatly simplified.

6. 发明申请

US20170332161A1 MICROPHONE WITH DUSTPROOF THROUGH HOLES 审中-公开
公开(公告)号：US20170332161A1
公开(公告)日：2017-11-16
申请号：US15521151
申请日：2015-01-05
申请人： Goertek.Inc
发明人： Guanxun QIU , Qinglin SONG
IPC分类号： H04R1/08 , H04R1/02 , H04R19/04
CPC分类号： H04R1/083 , H04R1/02 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

7. 发明申请

US20170280218A1 MEMS DEVICE WITH A VALVE MECHANISM 审中-公开
公开(公告)号：US20170280218A1
公开(公告)日：2017-09-28
申请号：US15505001
申请日：2014-08-27
申请人： Goertek.Inc
发明人： Zhe Wang , Quanbo Zou , Jifang Tao
IPC分类号： H04R1/08 , H04R19/04 , H04R19/01
CPC分类号： H04R1/083 , H04R1/023 , H04R3/007 , H04R19/005 , H04R19/016 , H04R19/04 , H04R2201/003
摘要： The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

8. 发明授权

US10533911B2 Signal processing device, air pressure sensor assembly and electronics apparatus 有权
公开(公告)号：US10533911B2
公开(公告)日：2020-01-14
申请号：US15553093
申请日：2016-11-04
申请人： GOERTEK.INC
发明人： Li-Te Wu , Ching-Tzung Lin , Ssu-Ying Chen
IPC分类号： G01L19/00 , G01L9/00 , G01C5/06
摘要： The present invention discloses a signal processing device, an air pressure sensor assembly and an electronics apparatus. The signal processing device for a sensing signal comprises: an input unit, which is configured to receive the sensing signal; and a processing unit, which is configured to attenuate a higher frequency component of the sensing signal so that the value of the higher frequency component when the sensing signal is stable is lower than that when the sensing signal is changing. According to an embodiment of this invention, the present invention can reduce the noise in a sensing signal from an air pressure sensor during a stable state.

9. 发明授权

US10277968B2 Microphone with dustproof through holes 有权
公开(公告)号：US10277968B2
公开(公告)日：2019-04-30
申请号：US15521151
申请日：2015-01-05
申请人： Goertek.Inc
发明人： Guanxun Qiu , Qinglin Song
IPC分类号： H04R25/00 , H04R1/08 , H04R19/00 , H04R19/04 , H04R1/02
摘要： The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

10. 发明授权

US10264360B2 Structure for detecting vibration displacement of a speaker and acoustoelectric inter-conversion dual-effect device 有权
公开(公告)号：US10264360B2
公开(公告)日：2019-04-16
申请号：US15551262
申请日：2015-11-26
申请人： Goertek.Inc
发明人： Minghui Shao , Jianbin Yang
IPC分类号： H04R9/06 , H04R3/00 , H04R7/06 , H04R7/18 , H04R9/02 , H04R29/00 , H04R31/00 , H04R19/01
摘要： Disclosed is a structure for detecting the vibration displacement of a speaker, including: a vibration system having a movable pole plate; a magnetic circuit system; and a fixed pole plate provided under the vibration system and opposite to the movable pole plate, the movable pole plate and the fixed pole plate constituting a capacitor. Also disclosed is an acoustoelectric inter-conversion dual-effect device, further including an impedance transformer connected to the capacitor and including a field effect transistor and a diode. In the present invention, a movable pole plate of a capacitor is provided on a vibration system and a fixed pole plate is provided under the vibration system and fixed in position. When the vibration system vibrates, the change in capacitance is detected to calculate the actual displacement of the vibration system, which can reduce the power of the speaker device when the actual displacement of the vibration system exceeds a safety threshold. For an electronic device adopting such a speaker structure, the displacement of the vibration system of a speaker product can be detected in real time at the system end of the electronic device.

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