专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20160105983A1 Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board 审中-公开
标题翻译：可插拔功率单元，带有插入母板的安装触点
公开(公告)号：US20160105983A1
公开(公告)日：2016-04-14
申请号：US14857430
申请日：2015-09-17
申请人： International Rectifier Corporation
发明人： Eung San Cho , Thomas J. Ribarich , Dean Fernando , Kevin Moody , Dae Keun Park , Chuan Cheah
IPC分类号： H05K7/10
CPC分类号： H05K7/1092 , H02M3/145 , H05K1/117 , H05K1/141 , H05K3/366 , H05K2201/048
摘要： In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board.
摘要翻译：在一个实现中，用于插入母板的可插入动力单元包括位于基板上的功率模块和远离电源模块的基板的延伸侧上的安装触点。安装触头通过在衬底中的电路径电耦合到功率模块。安装触头被配置为在电源模块和母板之间提供电连接。

2. 发明授权

US09171743B2 Electrical connectivity for circuit applications 有权
标题翻译：电路连接用于电路应用
公开(公告)号：US09171743B2
公开(公告)日：2015-10-27
申请号：US14045949
申请日：2013-10-04
申请人： Donald J. Desbiens , Gary D. Polhemus , Robert T. Carroll
发明人： Donald J. Desbiens , Gary D. Polhemus , Robert T. Carroll
IPC分类号： H01L23/48 , H01L21/50 , H01L23/482 , H01L23/495 , H01L25/07
CPC分类号： H01L21/50 , H01L23/4824 , H01L23/49562 , H01L25/072 , H01L2224/16245 , H01L2924/1305 , H01L2924/00
摘要： According to example configurations herein, a leadframe includes a first conductive strip, a second conductive strip, and a third conductive strip disposed substantially adjacent and substantially parallel to each other. A semiconductor chip substrate includes a first array of switch circuits disposed adjacent and parallel to a second array of switch circuits. Source nodes in switch circuits of the first array are disposed substantially adjacent and substantially parallel to source nodes in switch circuits of the second array. When the semiconductor chip and the leadframe device are combined to form a circuit package, a connectivity interface between the semiconductor chip and conductive strips in the circuit package couples each of the source nodes in switch circuits of the first array and each of the multiple source nodes in switch circuits of the second array to a common conductive strip in the leadframe device.
摘要翻译：根据这里的示例性配置，引线框架包括第一导电条，第二导电条和基本相邻并基本上彼此平行设置的第三导电条。半导体芯片衬底包括与第二阵列开关电路相邻并平行设置的第一开关电路阵列。第一阵列的开关电路中的源节点被设置为基本上与第二阵列的开关电路中的源节点相邻并且基本上平行。当半导体芯片和引线框架装置组合以形成电路封装时，电路封装件中的半导体芯片与导电条之间的连接接口将第一阵列的开关电路中的每个源节点与多个源节点在第二阵列的开关电路中到引线框装置中的公共导电条。

3. 发明授权

US09159679B2 Semiconductor package with integrated passives and method for fabricating same 有权
标题翻译：具有集成无源的半导体封装及其制造方法
公开(公告)号：US09159679B2
公开(公告)日：2015-10-13
申请号：US12584420
申请日：2009-09-03
申请人： Michael A. Briere
发明人： Michael A. Briere
IPC分类号： H01L23/64 , H01L23/522
CPC分类号： H01L23/642 , H01L23/5223 , H01L23/5227 , H01L23/645 , H01L2924/0002 , H01L2924/00
摘要： According to one disclosed embodiment, a semiconductor package for integrated passives and a semiconductor device comprises a high permeability structure formed over a surface of the semiconductor package and surrounding a contact body of the semiconductor package, the contact body being connected to an output of the semiconductor device. The contact body can be, for example, a solder bump. The high permeability structure causes a substantial increase in inductance of the contact body so as to form an increased inductance inductor coupled to the output of the semiconductor device. In one embodiment, the semiconductor package further comprises a blanket insulator formed over the high permeability structure, and a capacitor stack formed over the blanket insulator. In one embodiment, the semiconductor device comprises a group III-V power semiconductor device.
摘要翻译：根据一个公开的实施例，用于集成无源的半导体封装和半导体器件包括形成在半导体封装的表面上并围绕半导体封装的接触体的高磁导率结构，该接触体连接到半导体的输出端设备。接触体可以是例如焊料凸块。高导磁率结构导致接触体的电感的显着增加，从而形成耦合到半导体器件的输出的增加的电感电感器。在一个实施例中，半导体封装还包括形成在高导磁率结构上的覆盖绝缘体，以及形成在覆盖绝缘体上的电容器堆叠。在一个实施例中，半导体器件包括III-V族功率半导体器件。

4. 发明授权

US09111776B2 Power semiconductor package with non-contiguous, multi-section conductive carrier 有权
标题翻译：功率半导体封装，具有非连续，多段导电载体
公开(公告)号：US09111776B2
公开(公告)日：2015-08-18
申请号：US14488747
申请日：2014-09-17
申请人： International Rectifier Corporation
发明人： Eung San Cho
IPC分类号： H01L29/76 , H01L25/07 , H01L23/00 , H01L23/31 , H01L21/48 , H01L21/56 , H01L25/11 , H01L25/16 , H01L23/492 , H01L23/495
CPC分类号： H01L23/49568 , H01L21/4803 , H01L21/4825 , H01L21/4839 , H01L21/4853 , H01L21/4871 , H01L21/56 , H01L21/561 , H01L23/041 , H01L23/12 , H01L23/3121 , H01L23/3157 , H01L23/492 , H01L23/49503 , H01L23/4952 , H01L23/49524 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L24/16 , H01L24/24 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L25/072 , H01L25/117 , H01L25/16 , H01L2224/16245 , H01L2224/24137 , H01L2224/24245 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3754 , H01L2224/73259 , H01L2224/73267 , H01L2224/82106 , H01L2224/83801 , H01L2224/8382 , H01L2224/8384 , H01L2224/8385 , H01L2224/83851 , H01L2224/92224 , H01L2224/92244 , H01L2924/00014 , H01L2924/1032 , H01L2924/1033 , H01L2924/12042 , H01L2924/13091 , H01L2924/1426 , H01L2924/181 , H01L2924/1815 , H02M3/158 , H01L2924/00 , H01L2924/0665 , H01L2924/014 , H01L2924/00012
摘要： In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size.
摘要翻译：在一个实施方案中，功率半导体封装包括不连续的多段导电载体。具有控制晶体管端子的控制晶体管耦合到多段导电载体的第一部分，而具有同步晶体管端子的同步晶体管耦合到多段导电载体的第二部分。多段导电载体的第一部分和第二部分由控制和同步晶体管产生的热量。多段导电载体的第一和第二部分仅通过附接到功率半导体封装的安装表面电连接。功率半导体封装的另一实现包括耦合到多段导电载体的第三部分的驱动器IC。还公开了一种用于制造功率半导体封装的方法。根据本公开的功率半导体封装导致有效的热保护，载流能力和相对小的尺寸。

5. 发明授权

US09102242B2 Mechatronic integration of motor drive and E-machine, especially smart-E-motor 有权
公开(公告)号：US09102242B2
公开(公告)日：2015-08-11
申请号：US11888812
申请日：2007-08-02
申请人： Henning Hauenstein
发明人： Henning Hauenstein
IPC分类号： H02P1/24 , B60L15/20 , B60L11/18 , B60K1/00
CPC分类号： B60L15/20 , B60K2001/003 , B60L11/1872 , Y02T10/645 , Y02T10/7005 , Y02T10/705 , Y02T10/7275
摘要： The power switches of an inverter are mechanically integrated with an electric motor of a vehicle and are mounted on the end plate of the motor and employ short connections between the motor a-c terminals and the inverter a-c output terminals. Bond wireless modules are employed. The electronic controls for the inverter are mounted on a main control board which is positioned remotely from the inverter and is not subject to the heat and EMI produced by the inverter.

6. 发明申请

US20150162321A1 Composite Power Device with ESD Protection Clamp 审中-公开
标题翻译：具有ESD保护钳的复合电源装置
公开(公告)号：US20150162321A1
公开(公告)日：2015-06-11
申请号：US14553419
申请日：2014-11-25
申请人： International Rectifier Corporation
发明人： Michael A. Briere
IPC分类号： H01L27/02 , H01L29/778 , H01L29/78 , H01L27/088
CPC分类号： H01L27/0255 , H01L27/0629 , H01L27/0883 , H01L29/778 , H01L29/78 , H02H9/046 , H03K17/08104 , H03K17/102 , H03K2017/6875
摘要： There are disclosed herein various implementations of a normally off (enhancement mode) composite power device with an ESD protection clamp. Such a normally off composite power device includes a normally on (depletion mode) power transistor providing a composite drain of the normally off composite power device, and a normally off low voltage (LV) transistor cascoded with the normally on power transistor. The normally off LV transistor provides a composite source and a composite gate of the normally off composite power device. The normally off composite power device also includes the ESD protection clamp coupled between the composite source and the composite gate. The ESD protection clamp is configured to provide electrostatic discharge (ESD) protection for the normally off composite power device.
摘要翻译：这里公开了具有ESD保护钳的常闭（增强模式）复合功率器件的各种实施方式。这种常关复合功率器件包括提供常关复合功率器件的复合漏极的正常导通（耗尽型）功率晶体管，以及与常开功率晶体管级联的常闭低电压（LV）晶体管。常闭型LV晶体管提供常闭复合功率器件的复合源极和复合栅极。常闭复合功率器件还包括耦合在复合源和复合栅之间的ESD保护钳。 ESD保护钳被配置为为常闭复合功率器件提供静电放电（ESD）保护。

7. 发明授权

US09054090B2 Power semiconductor package 有权
标题翻译：功率半导体封装
公开(公告)号：US09054090B2
公开(公告)日：2015-06-09
申请号：US14331479
申请日：2014-07-15
申请人： International Rectifier Corporation
发明人： Martin Standing
IPC分类号： H01L23/495 , H01L23/492 , H01L23/498 , H01L25/07 , H01L25/11 , H01L25/16 , H01L23/00
CPC分类号： H01L23/49503 , H01L23/492 , H01L23/49506 , H01L23/49517 , H01L23/49844 , H01L24/16 , H01L24/31 , H01L24/32 , H01L24/37 , H01L24/39 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0655 , H01L25/072 , H01L25/115 , H01L25/16 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/1411 , H01L2224/16 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/37147 , H01L2224/81801 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/1205 , H01L2924/1207 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/0665 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive.
摘要翻译：一种半导体封装，其包括具有金属背板，绝缘体和绝缘体上的多个导电焊盘的基板以及耦合到所述导电焊盘的半导体管芯，所述导电焊盘包括被直接连接到外部的焊盘的区域该封装使用导电胶。

8. 发明授权

US09048230B2 Half-bridge package with a conductive clip 有权
标题翻译：半桥封装带导电夹
公开(公告)号：US09048230B2
公开(公告)日：2015-06-02
申请号：US14221518
申请日：2014-03-21
申请人： International Rectifier Corporation
发明人： Eung San Cho , Chuan Cheah , Andrew N. Sawle
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L25/074 , H01L23/492 , H01L23/49524 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/33 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/451 , H01L2224/48106 , H01L2224/48247 , H01L2224/49111 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/1306 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/48227 , H01L2924/00012 , H01L2224/45099
摘要： According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input, a control source coupled to a common conductive clip, and a control gate for being driven by a driver IC. The stacked half-bridge package also includes a sync transistor having a sync drain for connection to the common conductive clip, a sync source coupled to a low voltage input, and a sync gate for being driven by the driver IC. The control and sync transistors are stacked on opposite sides of the common conductive clip with the common conductive clip electrically and mechanically coupling the control source with the sync drain, where the common conductive clip has a conductive leg for providing electrical and mechanical connection to an output terminal leadframe.
摘要翻译：根据示例性实施例，堆叠半桥封装包括控制晶体管，其具有用于连接到高电压输入的控制漏极，耦合到公共导电夹子的控制源和用于由驱动器IC驱动的控制栅极。堆叠的半桥封装还包括具有用于连接到公共导电夹子的同步漏极的同步晶体管，耦合到低电压输入的同步源以及由驱动器IC驱动的同步栅极。控制和同步晶体管堆叠在公共导电夹子的相对侧上，其中公共导电夹将电源和机械耦合控制源与同步漏极，其中公共导电夹具具有用于提供到输出端的电和机械连接的导电腿终端引线框架。

10. 发明授权

US09041191B2 Power semiconductor package 有权
标题翻译：功率半导体封装
公开(公告)号：US09041191B2
公开(公告)日：2015-05-26
申请号：US13300565
申请日：2011-11-19
申请人： Martin Standing
发明人： Martin Standing
IPC分类号： H01L23/12 , H01L23/043 , H01L23/492 , H01L23/13 , H01L23/498 , H01L23/00 , H01L25/16
CPC分类号： H01L24/40 , H01L23/04 , H01L23/06 , H01L23/13 , H01L23/14 , H01L23/492 , H01L23/4924 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L23/4985 , H01L24/24 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/82 , H01L24/83 , H01L24/84 , H01L25/165 , H01L2224/24227 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/76155 , H01L2224/82102 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/05432 , H01L2924/0635 , H01L2924/0665 , H01L2924/07025 , H01L2924/0715 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49174 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
摘要翻译：包括导电罐的半导体封装，电气和机械地附接到罐的内表面的功率半导体器件，以及与罐内的功率半导体器件复合封装的IC半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式