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1. 发明申请

US20220209433A1 MULTIPART CONNECTOR FOR CONVEYING POWER 有权
公开(公告)号：US20220209433A1
公开(公告)日：2022-06-30
申请号：US17601400
申请日：2020-04-14
申请人： Interplex Industries, Inc.
发明人： Yin Qian , Keith S. Maranto , James M. Pick , Richard Schneider
IPC分类号： H01R4/2429 , H01R12/70 , H01R12/58 , H01R13/11 , H01R13/405 , H01R4/70
摘要： A multipart connector for electrical connection to a conductor to convey AC power having a frequency greater than 60 Hz. The connector includes a plurality of metal plates. Each metal plate has opposing planar surfaces and includes a pair of legs separated by a space. A plurality of insulation layers adjoin the planar surfaces of the metal plates, respectively. The insulation layers include a pair of legs separated by a space. The metal plates and the insulation layers are arranged in a stack such that the spaces of the metal plates and the insulation layers are aligned to form a groove extending through the stack. The conductor is disposed in the groove.

2. 发明授权

US10998675B2 Electrical connector 有权
公开(公告)号：US10998675B2
公开(公告)日：2021-05-04
申请号：US15931195
申请日：2020-05-13
申请人： Interplex Industries, Inc.
发明人： Joseph Lynch , Richard Schneider
IPC分类号： H01R13/631 , H01R13/405 , H01R12/58 , H01R13/504
摘要： A connector for connection to a substrate for mounting electronic devices. The connector includes a plurality of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The connector also includes one or more mounting contacts partially disposed within the housing. Each mounting contact has a fastening structure joined to a bar section. The fastening structure is adapted for securement to the substrate and the bar section is disposed in a second space of at least one of the coupling contacts.

3. 发明授权

US10522945B2 Electrical connector 有权
公开(公告)号：US10522945B2
公开(公告)日：2019-12-31
申请号：US16190809
申请日：2018-11-14
申请人： Interplex Industries, Inc.
发明人： Richard Schneider , James M. Pick , Keith S. Maranto
IPC分类号： H01R4/48 , H01R13/631 , H01R12/71 , H01R13/10 , H01R12/58 , H01R12/70 , H01R12/91 , H01R13/11 , H01R13/42 , H01R12/73
摘要： A connector for connection to a substrate for mounting electronic devices. The connector includes a stack of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The first and second spaces are aligned to form first and second receiving grooves in the stack, respectively. The connector also includes one or more mounting contacts partially disposed within the housing. Each mounting contact has a fastening structure joined to a bar section. The fastening structure is adapted for securement to the substrate and the bar section is disposed in the second receiving groove of the stack of coupling contacts.

4. 发明授权

US10485092B2 Multilayer bus board 有权
公开(公告)号：US10485092B2
公开(公告)日：2019-11-19
申请号：US15552116
申请日：2016-02-16
申请人： Richard Schneider , Joseph J. Lynch , INTERPLEX INDUSTRIES, INC.
发明人： Richard Schneider , Joseph J. Lynch
IPC分类号： H05K1/02 , H02G5/00 , H01R12/52 , H05K3/42 , H05K3/46 , H05K1/18
摘要： A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.

5. 发明申请

US20100124036A1 SOLDERLESS ELECTRONIC COMPONENT OR CAPACITOR MOUNT ASSEMBLY 有权
标题翻译：无电子电子元件或电容器组装
公开(公告)号：US20100124036A1
公开(公告)日：2010-05-20
申请号：US12622899
申请日：2009-11-20
申请人： Richard Schneider
发明人： Richard Schneider
IPC分类号： H05K7/00
CPC分类号： H05K7/12 , H01G2/04 , H01G2/06 , H01G9/08 , H05K3/301 , H05K2201/10015 , H05K2201/10325
摘要： A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor.
摘要翻译：一种无焊电子部件或电容器安装组件，其包括具有基部和盖部的壳体。盖部分和基部可彼此耦合，以便将电容器固定到壳体。所述组件还包括至少一个连接器，其被配置为将所述组件耦合到印刷电路板，以及至少一个电触点，其被配置为接触所述电容器的相应的至少一个引线并提供所述电容器的电连接。

6. 发明申请

US20090298218A1 LEAD FRAME THERMOPLASTIC SOLAR CELL RECEIVER 失效
标题翻译：导线框架热塑性太阳能电池接收器
公开(公告)号：US20090298218A1
公开(公告)日：2009-12-03
申请号：US12472286
申请日：2009-05-26
申请人： Domenico J. Federici , Richard Schneider , Michael P. Jasmin
发明人： Domenico J. Federici , Richard Schneider , Michael P. Jasmin
IPC分类号： H01L21/50 , H05K7/18 , B05D5/12 , H01L31/0203 , H01L31/0232
CPC分类号： H01L23/49861 , H01L23/49537 , H01L31/02008 , H01L31/044 , H01L31/0543 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： A lead frame thermoplastic package for a solar cell, and a method of manufacturing the same. The lead frame being either a single-lead frame design or a dual-lead frame design. The single-lead frame design being made up of a single-lead metal frame. The dual-lead frame design being made up of a die pad lead frame, a wire bond lead frame, and being encapsulated in a thermoplastic resin. Optionally, the single lead frame or at least one of the dual-lead frames is coated with a dielectric material. The lead frame providing connections for a semiconductor die, a diode, and the associated electrical connections. The lead frame also providing a large surface area metal pad for cooling, and mounting tabs for securing various optics systems to the package. Optionally, the lead frame is incorporated into a solar cell including the lead frame, a semiconductor die, a diode, an optics system, and an integrated electrical connection system.
摘要翻译：一种用于太阳能电池的引线框架热塑性封装及其制造方法。引线框架是单引线框架设计或双引线框架设计。单引线框架设计由单引线金属框架组成。双引线框架设计由芯片引线框架，引线框架引线框架构成，并被封装在热塑性树脂中。可选地，单引线框架或双引线框架中的至少一个涂覆有电介质材料。引线框架为半导体管芯，二极管和相关联的电连接提供连接。引线框架还提供用于冷却的大表面积金属焊盘，以及安装用于将各种光学系统固定到封装件的突出部。可选地，引线框结合到包括引线框架，半导体管芯，二极管，光学系统和集成电连接系统的太阳能电池中。

7. 发明授权

US08690586B2 Inter-board connection system with compliant flexible pin deformation prevention 有权
标题翻译：板间连接系统，符合柔性销变形预防
公开(公告)号：US08690586B2
公开(公告)日：2014-04-08
申请号：US13474059
申请日：2012-05-17
申请人： Richard Schneider
发明人： Richard Schneider
IPC分类号： H01R12/00
CPC分类号： H01R12/91 , H01R12/728 , H01R12/73 , Y10T29/4981 , Y10T29/49826
摘要： An assembly for preventing deformation of compliant pins when interconnecting two printed circuit boards with the pins includes a mechanism for limiting an amount of movement of a flexible portion of the pins. In one approach, a bar is placed within the flexible portion of the pins to block damaging movement. In another approach, wing portions of the pins are locked into a surface thus preventing movement of the pin that could cause damage to the flexible portion of the pin.
摘要翻译：当将两个印刷电路板与销相互连接时，用于防止柔性销的变形的组件包括用于限制销的柔性部分的移动量的机构。在一种方法中，将杆放置在销的柔性部分内以阻止有害运动。在另一种方法中，销的翼部被锁定到表面中，从而防止销的运动，从而可能损坏销的柔性部分。

8. 发明授权

US08305769B2 Solderless electronic component or capacitor mount assembly 有权
标题翻译：无焊接电子部件或电容器安装组件
公开(公告)号：US08305769B2
公开(公告)日：2012-11-06
申请号：US12622899
申请日：2009-11-20
申请人： Richard Schneider
发明人： Richard Schneider
IPC分类号： H05K7/14
CPC分类号： H05K7/12 , H01G2/04 , H01G2/06 , H01G9/08 , H05K3/301 , H05K2201/10015 , H05K2201/10325
摘要： A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion is disclosed. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor.
摘要翻译：公开了一种无焊电子部件或电容器安装组件，其包括具有基部和盖部的壳体。盖部分和基部可彼此耦合，以便将电容器固定到壳体。所述组件还包括至少一个连接器，其被配置为将所述组件耦合到印刷电路板，以及至少一个电触点，其被配置为接触所述电容器的相应的至少一个引线并提供所述电容器的电连接。

9. 发明授权

US07977777B2 Lead frame thermoplastic solar cell receiver 失效
标题翻译：引线框架热塑性太阳能电池接收器
公开(公告)号：US07977777B2
公开(公告)日：2011-07-12
申请号：US12472286
申请日：2009-05-26
申请人： Domenico J. Federici , Richard Schneider , Michael P. Jasmin
发明人： Domenico J. Federici , Richard Schneider , Michael P. Jasmin
IPC分类号： H01L31/024
CPC分类号： H01L23/49861 , H01L23/49537 , H01L31/02008 , H01L31/044 , H01L31/0543 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： A lead frame thermoplastic package for a solar cell, and a method of manufacturing the same. The lead frame being either a single-lead frame design or a dual-lead frame design. The single-lead frame design being made up of a single-lead metal frame. The dual-lead frame design being made up of a die pad lead frame, a wire bond lead frame, and being encapsulated in a thermoplastic resin. Optionally, the single lead frame or at least one of the dual-lead frames is coated with a dielectric material. The lead frame providing connections for a semiconductor die, a diode, and the associated electrical connections. The lead frame also providing a large surface area metal pad for cooling, and mounting tabs for securing various optics systems to the package. Optionally, the lead frame is incorporated into a solar cell including the lead frame, a semiconductor die, a diode, an optics system, and an integrated electrical connection system.
摘要翻译：一种用于太阳能电池的引线框架热塑性封装及其制造方法。引线框架是单引线框架设计或双引线框架设计。单引线框架设计由单引线金属框架组成。双引线框架设计由芯片引线框架，引线框架引线框架构成，并被封装在热塑性树脂中。可选地，单引线框架或双引线框架中的至少一个涂覆有电介质材料。引线框架为半导体管芯，二极管和相关联的电连接提供连接。引线框架还提供用于冷却的大表面积金属焊盘，以及安装用于将各种光学系统固定到封装件的突出部。可选地，引线框结合到包括引线框架，半导体管芯，二极管，光学系统和集成电连接系统的太阳能电池中。

10. 发明授权

US11432442B2 EMC shield and method of producing the same 有权
公开(公告)号：US11432442B2
公开(公告)日：2022-08-30
申请号：US17281170
申请日：2019-09-16
申请人： Interplex Industries, Inc.
发明人： Jeffrey D Parrish , Gregory Torigian , Anthony Miller
IPC分类号： H05K9/00
摘要： An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

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