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1. 发明申请

US20120157641A1 CURE ACCELERATORS FOR ANAEROBIC CURABLE COMPOSITIONS 有权
标题翻译：稳定加速器用于耐热可固化组合物
公开(公告)号：US20120157641A1
公开(公告)日：2012-06-21
申请号：US13269138
申请日：2011-10-07
申请人： David Birkett , Martin Wyer , Andrew Messana , Philip Klemarczyk , Anthony F. Jacobine
发明人： David Birkett , Martin Wyer , Andrew Messana , Philip Klemarczyk , Anthony F. Jacobine
IPC分类号： C08F120/68 , C07D215/06 , C07D209/08
CPC分类号： C08K5/34 , C07D209/08 , C07D215/04 , C08K5/1515 , C08K2201/014
摘要： The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants.
摘要翻译：本发明涉及可用于厌氧可固化组合物如粘合剂和密封剂的固化促进剂。

2. 发明申请

US20120129994A1 CURE ACCELERATORS FOR ANAEROBIC CURABLE COMPOSITIONS 有权
标题翻译：稳定加速器用于耐热可固化组合物
公开(公告)号：US20120129994A1
公开(公告)日：2012-05-24
申请号：US13284176
申请日：2011-10-28
申请人： David Birkett , Martin Wyer , Andrew Messana , David P. Dworak , Anthony F. Jacobine
发明人： David Birkett , Martin Wyer , Andrew Messana , David P. Dworak , Anthony F. Jacobine
IPC分类号： C08K5/17 , C08K5/08 , C08K5/13 , C08G18/72
CPC分类号： C08G18/765 , C08F290/067 , C08G18/10 , C08G18/3293 , C08G18/3844 , C08G18/4854 , C08G18/672 , C08L33/14 , C09J133/14 , C09J175/16 , C08G18/48
摘要： The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators are constructed as urethane/urea/thiourethane (meth)acrylate resins from diols and include a unit embraced within structure A where X is C1-20 alkyl, C2-20 alkenyl, or C7-20 alkaryl, any of which may be interrupted by one or more hereto atoms, and which are functionalized by at least one and preferably at least two groups selected from —OH, —NH2 or —SH and z is 1-3.
摘要翻译：本发明涉及可用于厌氧可固化组合物如粘合剂和密封剂的固化促进剂。固化促进剂由二醇构成为氨基甲酸酯/脲/硫代氨基甲酸酯（甲基）丙烯酸酯树脂，并且包括包含在结构A中的单元，其中X是C 1-20烃基，C 2-20烯基或C 7-20烷芳基，其中任何一种可以是由一个或多个原子间隔，并且由至少一个选自-OH，-NH2或-SH的至少一个并优选至少两个基团官能化，z为1-3。

3. 发明授权

US08158735B2 Adhesive bonding system having adherence to low energy surfaces 有权
标题翻译：具有粘附于低能表面的粘合粘合体系
公开(公告)号：US08158735B2
公开(公告)日：2012-04-17
申请号：US12180761
申请日：2008-07-28
申请人： Brendan J. Kneafsey , Edward P. Scott
发明人： Brendan J. Kneafsey , Edward P. Scott
IPC分类号： C08F30/08
CPC分类号： C08F30/08 , Y10T428/2852
摘要： This invention relates to (meth)acrylate-based polymerizable compositions and adhesive systems prepared therefrom, which include a alkylated borohydride or tetraalkyl borane metal or ammonium salt and a polymerizable siloxane. The inventive compositions and adhesive systems are particularly well suited for bonding applications which involve at least one low energy bonding surface, for example, the polyolefins, polyethylene, and polypropylene.
摘要翻译：本发明涉及由（甲基）丙烯酸酯系聚合性组合物及其制备的粘合剂体系，其包括烷基化硼氢化物或四烷基硼烷金属或铵盐和可聚合的硅氧烷。本发明的组合物和粘合剂体系特别适用于涉及至少一种低能粘合表面的粘结应用，例如聚烯烃，聚乙烯和聚丙烯。

4. 发明申请

US20110265913A1 THERMALLY DECOMPOSABLE POLYMER COATED METAL POWDERS 有权
标题翻译：热分解聚合物涂层金属粉末
公开(公告)号：US20110265913A1
公开(公告)日：2011-11-03
申请号：US13113716
申请日：2011-05-23
申请人： Puwei Liu , Matthew James Holloway , Blake Olsen
发明人： Puwei Liu , Matthew James Holloway , Blake Olsen
IPC分类号： B23K35/365 , B05D3/10 , B32B5/16 , B05D7/00
CPC分类号： H05K3/3484 , B22F1/0062 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/268 , B23K35/282 , B23K35/3006 , B23K35/302 , B23K35/3612 , B23K35/3613 , B23K35/365 , H05K2201/0224 , Y10T428/2991
摘要： The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.
摘要翻译：本发明涉及聚合物涂覆的金属粉末，例如用于形成焊料合金和糊料的金属粉末。金属粉末涂覆有氰基丙烯酸酯的可固化组合物。本发明涉及聚合物涂覆的金属粉末，例如用于形成焊料合金和糊料的金属粉末。金属粉末涂覆有氰基丙烯酸酯的可固化组合物，并且一旦固化，金属粉末上的涂层是氰基丙烯酸酯聚合物。

5. 发明授权

US08002149B2 Child resistant closure 失效
标题翻译：防儿童关闭
公开(公告)号：US08002149B2
公开(公告)日：2011-08-23
申请号：US11836834
申请日：2007-08-10
申请人： Gary Leonard
发明人： Gary Leonard
IPC分类号： B65D50/04
CPC分类号： B65D50/046
摘要： The present invention provides a child-resistant closure for a container. The closure comprises a dispensing nozzle, a cap for the dispensing nozzle, inter-engaging formations and a resiliently deformable element. The inter-engaging formations provided on the closure hold the cap to the nozzle in an interengaged assembly thereof. The resiliently deformable element biases the cap and the nozzle apart. The inter-engaging formations comprise a retaining slot for receiving a retainer and a retainer for engagement with the retaining slot. The retaining slot, retainer and resiliently deformable element are arranged so that the cap and the nozzle are retained interengaged in the interengaged assembly by bias from the resiliently deformable element. The release of the interengaging formations is achieved by applying sufficient pressure axially to the assembly to overcome the bias of the resiliently deformable element, and sufficient turning force to move the retainer out through the opening of the retaining slot.
摘要翻译：本发明提供了一种用于容器的防儿保护盖。封闭件包括分配喷嘴，用于分配喷嘴的盖，相互接合的结构和可弹性变形的元件。设置在封闭件上的相互接合的结构将帽盖与其相互接合的组件保持在喷嘴上。弹性可变形元件将帽和喷嘴分开偏置。相互接合的结构包括用于接收保持器的保持槽和用于与保持槽接合的保持器。保持槽，保持器和可弹性变形的元件布置成使得盖和喷嘴通过来自可弹性变形的元件的偏压保持在相互接合的组件中相互接合。相互接合结构的释放是通过向组件轴向施加足够的压力来克服弹性可变形元件的偏压以及足够的转动力使保持器从保持槽的开口移出而实现的。

6. 发明授权

US07847034B2 Adducts and curable compositions using same 失效
标题翻译：加合物和使用其的可固化组合物
公开(公告)号：US07847034B2
公开(公告)日：2010-12-07
申请号：US12051871
申请日：2008-03-20
申请人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham
发明人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham
IPC分类号： C08L63/00 , C08L83/14
CPC分类号： C08L63/00 , C08G18/10 , C08G18/12 , C08G18/4854 , C08G18/61 , C08G18/6677 , C08G18/73 , C08G59/66 , C08G65/007 , C08G65/336 , C08G73/06 , C08G77/42 , C08G77/452 , C08G77/458 , C08G77/46 , C08L79/04 , C08L83/10 , C08L83/12 , Y10S525/909 , C08G18/3876 , C08G18/3855 , C08L2666/20
摘要： The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
摘要翻译：本发明涉及用于改善韧性的加合物和使用这种增韧加合物的可固化组合物。在一个具体方面，本发明涉及本发明的增韧加合物和可固化组合物，其使用那些增韧的加合物具有改进的断裂韧性。

7. 发明授权

US07799865B2 Rapidly curing formulations including a conductive component 失效
标题翻译：快速固化配方，包括导电组分
公开(公告)号：US07799865B2
公开(公告)日：2010-09-21
申请号：US11034984
申请日：2005-01-14
申请人： Eadaoin D. Ledwidge , Harry J. Woolfson
发明人： Eadaoin D. Ledwidge , Harry J. Woolfson
IPC分类号： C08L31/00 , C08F118/02 , C08F4/44
CPC分类号： C09J4/00 , H05K3/323 , H05K2201/0224
摘要： A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.
摘要翻译：一种用于形成各向异性导电键的可固化组合物，包括：（i）第一基本上未固化的可固化组分的量; （ii）涂覆有分散在第一可固化氰基丙烯酸酯组分内的第二可固化组分的固化产物的基本上均匀厚的涂层的导电颗粒。该组合物适合用作将芯片接合到电子电路的粘合剂组合物。理想地，第一组分和第二组分都是氰基丙烯酸酯。

8. 发明申请

US20100234516A1 NOVEL ADDUCTS AND CURABLE COMPOSITIONS USING SAME 审中-公开
标题翻译：使用相同的新添加剂和可固化组合物
公开(公告)号：US20100234516A1
公开(公告)日：2010-09-16
申请号：US12784782
申请日：2010-05-21
申请人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham , Martin J. Fitzpatrick , Rainer Schoenfeld , Ciaran B. McArdle , Mark Loane
发明人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham , Martin J. Fitzpatrick , Rainer Schoenfeld , Ciaran B. McArdle , Mark Loane
IPC分类号： C08L83/06
CPC分类号： C07C251/30 , C07C253/30 , C07C255/23
摘要： The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.
摘要翻译：本发明涉及可用于改善韧性的新型加合物和使用这种增韧加合物的可固化组合物。在一个特定方面，本发明涉及使用那些增韧的加合物，具有改进的断裂韧性的新型增韧加合物和可固化组合物。

9. 发明授权

US07371466B2 Polymerisation initiators, polymerisable compositions, and uses thereof for bonding low surface energy substrates 有权
标题翻译：聚合引发剂，可聚合组合物及其用于粘合低表面能基材的用途
公开(公告)号：US07371466B2
公开(公告)日：2008-05-13
申请号：US10412331
申请日：2003-04-14
申请人： Brendan J. Kneafsey , Gerry Coughlan , Thomas B. Harty
发明人： Brendan J. Kneafsey , Gerry Coughlan , Thomas B. Harty
IPC分类号： B32B27/30 , C08F4/42
CPC分类号： C09J4/00 , Y10T428/31928 , Y10T428/31935 , C08F220/00
摘要： Quaternary boron salts are used as initiators of polymerisation in adhesive compositions for bonding low surface energy substrates such as polyolefins. The quaternary boron salts are of the formula I wherein R1 is C1-C10 alkyl, R2, R3 and R4, which may be the same or different, are, C1-C10 alkyl or C3-C10 cycloalkyl, phenyl, or phenyl-substituted C1-C10 alkyl or C3-C10 cycloalkyl, provided that any two of R1-R4 may optionally be part of a carbocyclic ring, and M+ is a metal ion or a quaternary ammonium ion. When M+ is a quaternary ammonium ion, the initiator may be used in a two-part composition having a (meth)acrylate monomer in both parts and the initiator compound in one part, the two parts being in a weight ratio of about 1:1.Particular examples of initiator compounds include sodium tetraethyl borate, lithium tetraethyl borate, lithium phenyl triethyl borate, tetramethylammonium phenyl triethyl borate, and tetra methyl ammonium phenyl tri-n-butyl borate, the last-mentioned of which is a novel compound.
摘要翻译：在粘合剂组合物中用作键合低表面能基底如聚烯烃的季铵硼盐作为聚合引发剂。季硼盐具有式I的化合物，其中R 1是C 1 -C 10烷基，R 2， R 3和R 4可以相同或不同，是C 1 -C 10烷基，烷基或C 3 -C 10环烷基，苯基或苯基取代的C 1 -C 10烷基或 C 3 -C 10环烷基，条件是R 1〜R 4中的任意两个可以任选地为碳环，M + +是金属离子或季铵离子。当M + +是季铵离子时，引发剂可以在两部分中具有（甲基）丙烯酸酯单体和引发剂化合物的两部分组合物中一起使用，两部分在重量比约为1:1。引发剂化合物的具体实例包括硼酸四乙酯，硼酸四乙酯锂，苯基三乙基硼酸锂，硼酸四甲基铵，硼酸三甲基铵和硼酸四正丁基铵，其中最后提到了新的化合物。

10. 发明申请

US20080076886A1 NOVEL ADDUCTS AND CURABLE COMPOSITIONS USING SAME 失效
标题翻译：使用相同的新添加剂和可固化组合物
公开(公告)号：US20080076886A1
公开(公告)日：2008-03-27
申请号：US11535270
申请日：2006-09-26
申请人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham , Martin J. Fitzpatrick , Rainer Schoenfeld , Ciaran B. McArdle , Mark Loane
发明人： Barry N. Burns , Ray P. Tully , Jonathan P. Wigham , Martin J. Fitzpatrick , Rainer Schoenfeld , Ciaran B. McArdle , Mark Loane
IPC分类号： C08L79/00 , C08G77/04 , C08G73/00 , B32B27/18
CPC分类号： C08G18/61 , C08G18/3206 , C08G18/4825 , C08G18/675 , C08G59/5006 , C08G59/504 , C08L63/00 , C08G18/48 , C08L2666/14 , C08L83/00 , C08L2666/08
摘要： The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.
摘要翻译：本发明涉及可用于改善韧性的新型加合物和使用这种增韧加合物的可固化组合物。在一个特定方面，本发明涉及新颖的增韧加合物和热固性树脂配方，其使用那些增韧的加合物具有改进的断裂韧性。

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